• Journal of the Korean Ceramic Society
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• v.39 no.8
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• pp.775-782
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• 2002

The effects of solid and dispersant concentration was investigated by wet-sieving method for knowing the amount of coarse particle in fine powders. In the work alumina powders, sodium hexametaphosphate and sodium polyacrylate were used for preparing slurry. It was confirmed that the coarse particle mass increased by increasing alumina concentration and decreasing dispersant concentration. With systematic measurements we know that the alumina powder and dispersant of one weight percent(1.0wt%) were proper quantity for coarse particle mass measuring, respectively. Sodium polyacrylate as dispersant showed higher coarse particle mass than sodium hexametaphosphate. The sieve mass was decreased according to increase of experiment number. Based on experiments it was considered that wet-sieving method is good tool for measuring a coarse particle mass in fine powders.

• Analytical Science and Technology
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• v.6 no.2
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• pp.225-229
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• 1993

ATZ was prepared by adding an alumina sol equivalent to 2wt% as $Al_2O_3$ to an aqueous slurry of alumina (AKP-30) and zirconia (TZ-2Y or TZ-0Y) in the range of 10-30ATZ, followed by gelation, calcination, and sintereing between $1450^{\circ}C{\sim}1550^{\circ}C$ for 2h. They showed excellent microstructure with alumina grains of <$0.5{\mu}m$ and>99% of the theoretical density. Fracture toughness of ${\sim}8MPa{\cdot}m^{1/2}$ was observed around 20ATZ which was higher than $6MPa{\cdot}m^{1/2}$ obtainable by ball-milling.

• Journal of the Korean Ceramic Society
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• v.52 no.5
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• pp.366-373
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• 2015

Sol-gel binder was prepared by hydrolysis and condensation reaction using boehmite sol and methyltrimethoxysilane as a function of aging-time. The coating slurry was composed of a plate-shape alumina in the sol-gel binder for the EPD process, in which particles dispersed in the slurry were deposited on the electrode under an electric field due to the surface charge. We studied the effects of three parameters: the content of boehmite, the aging time, and the applied voltage, on the physical, thermal, and electrical properties of the hybrid composite films by EPD. The amount of boehmite was 10 ~ 20 wt% and the aging time was 0.5 ~ 72, with a fixed amount of plate-shape alumina of 10 wt%. The condition of applied voltage was 5 ~ 30 V with a distance of 2 cm between the electrode during the EPD process. We confirmed that a structure of hybrid composite films of well-ordered plate alumina was deposited on the substrate when the film was prepared using a sol-gel binder composed of 15 wt% boehmite with 1 hr aging time and EPD at 10 V. The process shows a weight loss of 7% at $500^{\circ}C$ in TGA and a breakdown voltage of 8 kV at $87{\mu}m$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.12
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• pp.1296-1300
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• 2004

SnO$_2$ is one of the most suitable gas sensor materials. The microstructure and surface morphology of films must be controlled because the electrical and optical properties of SnO$_2$ films depend on these characteristics. The effects of chemical mechanical polishing(CMP) on the variation of morphology of SnO$_2$ films prepared by RF sputtering system were investigated. The commercially developed ceria-based oxide slurry, silica-based oxide slurry, and alumina-based tungsten slurry were used as CMP slurry. Non-uniformities of all slurries met stability standards of less than 5 %. Silica slurry had the highest removal rate among three different slurries, sufficient thin film topographies and suitable root mean square(RMS) values.

• Transactions on Electrical and Electronic Materials
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• v.4 no.2
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• pp.1-4
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• 2003

The purpose of this study was to investigate the characteristics of slurry including phosphoric acid for chemical-mechanical planarization of copper and tantalum nitride. In general, the slurry for copper CMP consists of alumina or colloidal silica as an abrasive, organic acid as a complexing agent, an oxidizing agent, a film forming agent, a pH control agent and additives. Hydrogen peroxide (H$_2$O$_2$) is the material that is used as an oxidizing agent in copper CMP. But, the hydrogen peroxide needs some stabilizers to prevent decomposition. We evaluated phosphoric acid (H$_3$PO$_4$) as a stabilizer of the hydrogen peroxide as well as an accelerator of the tantalum nitride CMP process. We also estimated dispersion stability and zeta potential of the abrasive with the contents of phosphoric acid. An acceleration of the tantalum nitride CMP was verified through the electrochemical test. This approach may be useful for the development of the 2$\^$nd/ step copper CMP slurry and hydrogen peroxide stability.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.141-142
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• 2002

In this paper, we propose a slurry jet (water containing $1\;{\mu}m$ alumina particles) impact test in order to quickly evaluate the wear properties of physical vapor deposited (PVD) coatings on commercial cutting tools. Linear wear was obtained for bothe coating and substrate material, and the penetration through the coating into the substrate was signified by a sharp increase in slope of the wear versus time curve. The PVD coatings deposited on the tools showed the same wear rates as those on reference plate specimens produced by the same coating methods. We conclude that our proposed evaluation technique for coatings is considerably useful as a screening test when evaluating coated tools like twist drills, taps, end mills, gear hobs, etc.

• Journal of the Korean Ceramic Society
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• v.41 no.9
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• pp.647-652
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• 2004

In aqueous tape casting of alumina slurry systems, the relationships between the suspension compositions and the defects of the dried tapes were discussed. The suspensions compositions were controlled with the ratios of the solids, water and organics binder contents. The effects of the thickness of dried tape and kinds of binder system were also examined. In the defect free region, the apparent viscosity showed nearly same value due to the count balancing effect of solid and organic binder content on the apparent viscosity. When water content was constant, increasing solid led to decrease of organic binder content. The defect free region was narrowed with increasing of casting thickness. When linear type acrylic emulsion binders system (D1000 and D 1035) were used, defect free zone formed the belt type in the triangle of solid, water and organic binder content according to the line of constant water contents. However the defect free region was not found in the cross-link type emulsion binder system (D 1050).

• Journal of the Korean Ceramic Society
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• v.33 no.6
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• pp.700-708
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• 1996

TiO2 membranes for microfiltration were prepared on $\alpha$-alumina support tube by slurry coating. The coating layer was obtained by flowing TiO2 slip on the inner surface of the alumina support. TiO2 membranes were heat-treated at 9$25^{\circ}C$ for 2 hrs. The thickness of the unsupported membrane was about 10${\mu}{\textrm}{m}$. The mean pore diameter of the membranes were 0.09 and 0.15${\mu}{\textrm}{m}$ respectively and the pure water flux was 900~1,200ι/m2.hr at room temperature and 1 bar. For a possible application of oily wastewater treatement an kerosene/wa-ter emulsion was separated in terms of flux and removal efficiency. In 60 min of operating time the flux of TiO2 membranes was 50~100 ι/m2.hr and removal efficiency was over 97% at 3kgf/cm2 of operating pres-sure and 600 ml/min of flow rate. TiO2 membranes could be recycled by reheat treatments at $600^{\circ}C$ for 2 hrs.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.7
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• pp.605-609
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• 2005

Chemical mechanical polishing (CMP) of Ni was performed by the various ratios of four kinds of oxidizers and an addition of alumina powders as an abrasive in each slurry with the different oxidizers. Moreover, the interaction between the Ni and the each oxidizer was discussed by potentiodynamic polarization measurement, in order to compare the effects of Ni-CMP and electrochemical characteristics on the Ni with the different oxidizers. As an experimental result, the removal rate of Ni reached a maximum at 1 $vol\%$ of $H_2O_2$. Also the removal rates of Ni increased with the audition of alumina abrasives in each slurry. The potentiodynamic polarization of Ni under dynamic condition showed a significant difference in electrochemical behavior by addition of $H_2O_2$ in solutions. Ni showed the perfect passivation behavior in solution without $H_2O_2$ under potentiodynamic polarization condition, while active dissolution dominates in solution with the addition of $H_2O_2$. The results indicate that the surface chemistry and electrochemical characteristics of Ni play an important role in controlling the polishing behavior of Ni.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1296-1299
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• 2004

MIM capacitor has been investigated for the next generation DRAM. Conventional poly-Si bottom electrode cannot satisfy the requirement of electrical properties and comparability to the high k materials. New bottom electrode material such as ruthenium has been suggested in the fabrication of MIM structure capacitor. However, the ruthenium has to be planarized due to the backend scalability. For the planarization CMP has been widely used in the manufacture of integrated circuit. In this research, ruthenium thin film was Polished by CMP with cerium ammonium nitrate (CAN)base slurry. HNO3 was added on the CAN solution as an additive. In the various concentration of chemical and alumina abrasive, ruthenium surface was etched and polished. After static etching and polishing, etching and removal rate was investigated. Also microroughness of surface was observed by AFM. The etching and removal rate depended on the concentration of CAN, and HNO3 accelerated the etching and polishing of ruthenium. The reasonable removal rate and microroughness of surface was achieved in the 1wt% alumina slurry.