• 제목/요약/키워드: Alignment mark

검색결과 28건 처리시간 0.029초

평판 스크린을 이용하는 롤투롤 연속 스크린 인쇄 시스템의 개발 (Development of Continuous Roll-to-Roll Screen Printing System Using a Flat Screen)

  • 김가을;전용호;이문구;홍민성;이택민;권신
    • 한국생산제조학회지
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    • 제25권3호
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    • pp.217-223
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    • 2016
  • In this research, a continuous roll-to-roll screen printing system was developed using a flat screen. It has a newly devised sliding mechanism of screen printing module, which can be controlled accurately in sync with a moving web, driven by a roll-to-roll tension control and web-guiding system. In addition, the real-time precision alignment module that consists of a vision camera and an $X-Y-{\theta}$ alignment stage was implemented. With this developed system, the feasibility of continuous printing with minimum pattern width below $60{\mu}m$ was verified, and an overlay of ${\pm}60{\mu}m$ between the laser-patterned reference mark and the printed mark on a 300-mm-wide film was achieved.

Edge Detecting Algorithm을 이용한 OLED 보호 필름의 Real Time Inspection에 대한 연구 (A study on real time inspection of OLED protective film using edge detecting algorithm)

  • 한주석;한봉석;한유진;최두선;김태민;고강호;박정래;임동욱
    • Design & Manufacturing
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    • 제14권2호
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    • pp.14-20
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    • 2020
  • In OLED panel production process, it is necessary to cut a part of protective film as a preprocess for lighting inspection. The current method is to recognize only the fiducial mark of the cut-out panel. Bare Glass Cutting does not compensate for machining cumulative tolerances. Even though process defects still occur, it is necessary to develop technology to solve this problem because only the Align Mark of the panel that has already been cut is used as the reference point for alignment. There is a lot of defective lighting during panel lighting test because the correct protective film is not cut on the panel power and signal application pad position. In laser cutting process to remove the polarizing film / protective film / TSP film of OLED panel, laser processing is not performed immediately after the panel alignment based on the alignment mark only. Therefore, in this paper, we performed real time inspection which minimizes the mechanism tolerance by correcting the laser cutting path of the protective film in real time using Machine Vision. We have studied calibration algorithm of Vision Software coordinate system and real image coordinate system to minimize inspection resolution and position detection error and edge detection algorithm to accurately measure edge of panel.

고속 고정도 자동정렬장치에 관한 연구 (A study on high speed, high precision auto-alignment system)

  • 박대헌;이성훈;김가규;이연정;이승하
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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    • pp.32-35
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    • 1997
  • A recent development in the Flat Panel Display(FPD) industry requires an auto-alignment system which is operated in high speed and high precision. In the FPD production process, aligning photo-mask with respect to guide mark printed in the glass should be accomplished in the accuracy of sub-micron order. So the system has high bandwidth and needs a dedicated control system which is fast and robust enough to control linear motors in precise manner. Proposed auto-alignment system structure in this presentation which consists of the master controller board, the DSP position controller board which controls 3 axis precision linear motors, the servo system and the man machine interface software. Designed and tuned under repeated experiments, the proposed system showed a reasonable performance in the aspect of rise time and steady state error.

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머신비전을 이용한 PCB 스크린인쇄기의 정렬오차측정 및 위치보정 (1) (Measurement and Correction of PCB Alignment Error for Screen Printer Using Machine Vision (1))

  • 신동원
    • 한국정밀공학회지
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    • 제20권6호
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    • pp.88-95
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    • 2003
  • This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand fur high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The geometrical relationship between PCB, cameras, and xy$\theta$ stage is derived, and analytical equations for alignment errors are also obtained. The unknown parameters including camera declining angles and etc. can be obtained by initialization process. Finally, the proposed algorithm is verified by experiments by using test bench.

The Fingerprinting of Huangjinju Powder for Injection on Chinese Patent Medicine by XRD Fourier

  • Pan, Yan-Li;Zhang, Gui-Jun;Gong, Ning-Bo;Wu, Yun-Shan;Lu, Yang;Luo, Rong;Choi, Ho-Young
    • 한국약용작물학회지
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    • 제14권2호
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    • pp.117-123
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    • 2006
  • The purpose is to study the identification method of Huangjinju powder for injection and the medicinal materials by the fingerprint off-ray Diffraction Fourier (XRDF). We used the same method on both the studying of Huangjinju and the medicinal materials. Then we selected a few components alignment to compare. We analyzed the data by setting up the deviation $d({\AA})$ as ${\pm}0.05$ to calculate the rate of special mark on the sample (Px) and on the patent (P). The special XRDF of Huangjinju$[d({\AA})/(I/I_0)]$ have 5 peaks that have not expressed in medicinal materials. Therefore Px is 22.73%. Flos Trollii Chinensis has 3 special marks and Px is 17.65%. Flos Chrysanthemi Indici has 1 special mark and Px is 3.57%. Its coincided interplanar spacing with the patent is $2.907{\AA}$. Flos Lonicerae Japonicae has 6 special marks and Px is 23.08%. Its special mark in the patent are 4.95/14 and 4.50/15, respectively. The P is 9.09%. Its coincided interplanar spacing with the patent is $2.910{\AA}\;and\;3.05{\AA}$, respectively. The number of special XRDF mark peaks of baicalin is 9 and Px is 18.37%. Its coincided interplanar spacing with the patent is $2.910{\AA}$. It has visible mark and specificity adopting XRDF fingerprint to identify Huangjinju and medicinal materials. Establishing the quality standard is a synthetic index that depends both on special marks in the medicinal materials of the patent and on the coincidence peak data.

The Effect of Layer Spacing Changes in the SmA Phase on Defects Observed in SSFLC Devices.

  • Wang, Chenhui;Bos, Philip J.;Kumar, Satyendra;Wand, Michael;Handschy, Mark
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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    • pp.193-197
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    • 2004
  • The effect of the temperature dependence of the smectic layer spacing in the smectic-A (SmA) phase on the formation of defects in the ferroelectric smectic-$C^{\ast}$ ($SmC^{\ast}$) phase is investigated with x-ray scattering technique. The study is based on thin parallel-aligned surface stabilized ferroelectric liquid crystal cells with two different alignment conditions, high pretilt $SiO_x$, alignment and low pretilt polyimide films. It is found that defects observed in the $SmC^{\ast}$ phase have much more profound dependence on the layer changes and chevron formation in the SmA phase than in the $SmC^{\ast}$ phase. We find that thermal layer expansion with decreasing temperature in the SmA phase suppresses the formation of defects observed in the SmC phase.

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플라즈마 에칭 후 게이트 산화막의 파괴 (Pinholes on Oxide under Polysilicon Layer after Plasma Etching)

  • 최영식
    • 한국정보통신학회논문지
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    • 제6권1호
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    • pp.99-102
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    • 2002
  • 다결정 실리콘층 아래의, 게이트 산화막이라고 불리는 높은 온도에서 형성된 산화막에서 핀홀이 관찰되었으며 그 메카니즘이 분석되었다. 다결정 실리콘층 아래의 산화막은 다른 다결정 실리콘층의 플라즈마 에칭 과정 동안에 파괴되어진다. 두 개의 다결정 실리콘층은 CVD증착에 의해 만들어진 0.8$\mu\textrm{m}$의 두꺼운 산화막에 의해 분리되어 있다. 파괴된 산화막들이 아크가 발생한 부분을 중심으로 흩어져 있으며 아크가 발생한 부분에서 생성된 극도로 강한 전계가 게이트 산화막을 파괴 시켰다고 가정된다. 아크가 발생한 부분은 Alignment key에서 관찰되었고 그리고 이것이 발견된 웨이퍼는 낮은 수율을 보여주었다. 아크가 발생한 부분이 칩의 내부가 아니더라도 게이트 산화막의 파괴에 의해 칩이 정상적으로 동작하지 않았다.

노이즈에 강인한 마크인식에 관한 연구 (A Study of Mark Recognition with Noise Immunity)

  • 양남열;정수화
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 G
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    • pp.3012-3014
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    • 1999
  • CCD 카메라를 이용한 화상처리가 최근 많은 분야에서 활용되고 있다. 특히 반도체 장비, 정밀 위치결정 시스템, 그리고 정밀 Alignment시스템과 같이 정밀한 제어가 요구되는 시스템에서 정화한 화상처리 기술이 요구되고 있다. 본 논문은 화상처리를 이용한 마크 인식에 관한 방법으로 CCD카메라로 부터 얻은 영상에 노이즈가 상당히 포함되어 있는 경우와 마크의 일부분만 보이는 경우에 마크를 정화히 찾는 방법에 관한 연구이다.

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Pose and Expression Invariant Alignment based Multi-View 3D Face Recognition

  • Ratyal, Naeem;Taj, Imtiaz;Bajwa, Usama;Sajid, Muhammad
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • 제12권10호
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    • pp.4903-4929
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    • 2018
  • In this study, a fully automatic pose and expression invariant 3D face alignment algorithm is proposed to handle frontal and profile face images which is based on a two pass course to fine alignment strategy. The first pass of the algorithm coarsely aligns the face images to an intrinsic coordinate system (ICS) through a single 3D rotation and the second pass aligns them at fine level using a minimum nose tip-scanner distance (MNSD) approach. For facial recognition, multi-view faces are synthesized to exploit real 3D information and test the efficacy of the proposed system. Due to optimal separating hyper plane (OSH), Support Vector Machine (SVM) is employed in multi-view face verification (FV) task. In addition, a multi stage unified classifier based face identification (FI) algorithm is employed which combines results from seven base classifiers, two parallel face recognition algorithms and an exponential rank combiner, all in a hierarchical manner. The performance figures of the proposed methodology are corroborated by extensive experiments performed on four benchmark datasets: GavabDB, Bosphorus, UMB-DB and FRGC v2.0. Results show mark improvement in alignment accuracy and recognition rates. Moreover, a computational complexity analysis has been carried out for the proposed algorithm which reveals its superiority in terms of computational efficiency as well.

도로교통에 있어서 운전자 주시특성분석과 그 적용성에 관한 연구 (Study on Analysis of Driver's Visual Characteristics in Road Traffic and its Applications)

  • 김대웅;임채문
    • 대한교통학회지
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    • 제9권2호
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    • pp.101-120
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    • 1991
  • The Subject of this research work is to study the driver's vision and eye-movement ch-aracteristics under the diffrent condiction of road traffic and driving. The analysis of this investigation was conducted spatially or temporaly into three parts'eye-mark distribution, viewing-time percentage and fixation duration. This dissertation focuses on analysis of dr-iver's visual characteristics to improve road circumstamces. In this study driver's ch-aracteristics are measured with eye-mark recorder and analyzed statistically The main features of this study are : 1st Duration distribution of fixation point is significant in 87% at 5% of the significant level in Gamma Distribution. The average of fixation duration by road are 0.33sec on streets 0.45sec on Roads and 0.86sec on highways. The average of fixation duration by visual objects are 0.4sec on road surface 0.26sec on road shoulder 0.49sec on traffic sign 0.37sec on warning sign and 0.67sex on gwide sign. 2st Moving anglrs of a fixation point are fit in the Exponential Distribution. The average moving angle is appeared to be 3.85。 on streets 2.81。 on roads 2.73。 on highway and 5 。 on intersecyion. 3st As a result of examining alignment of guide and warning sign in traffic signs cxisting foundation methods are less affected by lane than by apeed of a vehicle.

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