• JSTS:Journal of Semiconductor Technology and Science
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• 제14권1호
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• pp.53-60
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• 2014

Different kinds of post-deposition annealing (PDA) by a rapid thermal process (RTP) are used to enhance the field-effect passivation of $Al_2O_3$ film in crystal Si solar cells. To characterize the effects of PDA on $Al_2O_3$ and the interface, metal-insulator semiconductor (MIS) devices were fabricated. The effects of PDA were characterized as functions of RTP temperature from $400{\sim}700^{\circ}C$ and RTP time from 30~120 s. A high temperature PDA can retard the passivation of thin $Al_2O_3$ film in c-Si solar cells. PDA by RTP at $400^{\circ}C$ results in better passivation than a PDA at $400^{\circ}C$ in forming gas ($H_2$ 4% in $N_2$) for 30 minutes. A high thermal budget causes blistering on $Al_2O_3$ film, which degrades its thermal stability and effective lifetime. It is related to the film structure, deposition temperature, thickness of the film, and annealing temperature. RTP shows the possibility of being applied to the PDA of $Al_2O_3$ film. Optimal PDA conditions should be studied for specific $Al_2O_3$ films, considering blistering.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.232-232
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• 2010

Simulation Program (AFORS-HET 2.4.1) was used, include the basic structure of crystalline silicon thin film as above, under the intrinsic a-Si:H films bonded symmetrical structure (Symmetrical structure) were used. The structure of ITO, a-Si p-type, intrinsic a-Si, c-Si, intrinsic a-Si, a-Si n-type, metal (Al) layer has one of the seven. When thickness for each layer was given the change, the changes of a-Si p-type layer and the intrinsic a-Si layer on top had an impact on efficiency. Efficiency ratio of p-type a-Si:H layer thickness was sensitive to, especially a-Si: H layer thickness is increased in a rapid decrease in Jsc and FF, and efficiency was also decreased.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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• pp.86.2-86
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• 1998

• 반도체디스플레이기술학회지
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• 제9권4호
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• pp.1-5
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• 2010

The PVA (poly-vinyl alcohol) insulators were spun coated onto ITO coated glass substrates with the capacitors of Glass/ITO/PVA/Al structure. The effects of PVA concentrations (3.0, 4.0 and 5.0 wt%) on the morphology and electrical properties of the films were investigated. As the concentration of PVA increased from 3.0 to 5.0 wt%, the leakage current of device decreased from 17.1 to 0.23 pA. From the AFM measurement, the RMS value decreased with increasing PVA concentration, showing the improvement of insulator film roughness. The capacitances of the films with PVA concentrations of 4.0 and 5.0 wt% were about 28.1 and 24.2 nF, respectively. The lowest leakage current of 1.77 PA was obtained at the film thickness of 117.5 nm for the device with fixed PVA concentration of 5.0 wt%.

• 한국전기전자재료학회논문지
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• 제17권11호
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• pp.1192-1198
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• 2004

Hole transporting polymer(poly［N-(p-diphenylamine)phenylmethacrylamide］, PDPMA) was doped with nile red dye at various concentrations to study the influence of doping on the energy transfer during light emitting processes. Organic LEDs composed of ITO/blend(PDPMA -nile red)/ Alq$_3$/Al as well as thin films of blend(PDPMA -nile red)/ Alq$_3$ were manufactured for investigating photoluminescence, electroluminescence, and current-voltage characteristics. Atomic Force Microscopy was also used to observe surface morphology of the blend films. It was found that such doping. significantly influences the efficiency of the energy transfer from the Alq$_3$ layer to blended layer and the optical/electrical properties could be optimized by choosing the right concentration of the dye molecule. The results also showed a interesting correlation with the morphological aspect, i.e. the optimum luminescence at the concentration with the least surface roughness. When the concentration of nile red was 0.8 wt%, the maximum energy transfer could be achieved.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.542-545
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• 2002

High performance organic electroluminescnet(EL) devices which are composed of organic thin multilayer films are fabricated. The basic structure is ITO/Emitting layer/LiF/Al in which have a blended emitting layer. The emitting layer is consisted of a host material(N,N' diphenyl-N,N' (3-methyl phenyl)-l,l'-biphenyl-4,4'diamine)(TPD)) and a guest emitting material(poly(3-hexylthiophehe)(P3HT)). We think that the energy transfer in blending layer occurred from TPD to P3HT. Red emitting multilayer EL devices were fabricated using tris(8-hydroxyqunolinate) aluminum$(Alq_3)$ as electron transport material. The device structure of ITO/blending layer(TPD+P3HT)$/Alq_3$/LiF/Al was employed. In the Voltage-current-luminance characteristics of multilayer device, the device tum on at the 2V and the luminance of $10{\mu}W/cm^2$ obtain at l0V. Red emission peak at 640nm was observed with this device structure. We have presented evidence that the excitation energy migration between a polymeric host and guest has to be explained. And by using multilayer, the red light emitting EL device enhances not only Voltage-current-luminance characteristic but also stability of device.

• Current Photovoltaic Research
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• 제4권3호
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• pp.108-113
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• 2016

III-V compound semiconductor based thin film solar cells promise relatively higher power conversion efficiencies and better device reliability. In general, the thin film III-V solar cells are fabricated by an epitaxial lift-off process, which requires an $Al_xGa_{1-x}As$ ($x{\geq}0.8$) sacrificial layer and an inverted solar cell structure. However, the device performance of the inversely grown solar cell could be degraded due to the different internal diffusion conditions. In this study, InGaP/GaAs double-junction solar cells are inversely grown by MOCVD on GaAs (100) substrates. The thickness of the GaAs base layer is reduced to minimize the thermal budget during the growth. A wide band gap p-AlGaAs/n-InGaP tunnel junction structure is employed to connect the two subcells with minimal electrical loss. The solar cell structures are transferred on to thin metal films formed by Au electroplating. An AlAs layer with a thickness of 20 nm is used as a sacrificial layer, which is removed by a HF:Acetone (1:1) solution during the epitaxial lift-off process. As a result, the flexible InGaP/GaAs solar cell was fabricated successfully with an efficiency of 27.79% under AM1.5G illumination. The efficiency was kept at almost the same value after bending tests of 1,000 cycles with a radius of curvature of 10 mm.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.538-539
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• 2013

여러 장점으로 인해 OLED는 디스플레이 및 조명 등 적용분야가 넓어지고 있지만, 수분 및 산소에 취약하여 그 수명이 제한되는 단점이 있다. 이를 해결하고자 현재까지는 glass cap을 이용한 encapsulation 기술이 적용되고 있지만, flexible 기판에 적용하지 못하는 문제가 있다. 이러한 문제를 해결하고자 여러 가지 thin film encapsulation 기술이 적용되고 있으나 보다 신뢰성이 높은 기술의 개발이 절실한 때이다. Encapsulation 무기 박막 물질로서 $Si_3N_4$ 박막은 PE-CVD (Plasma Enhanced Chemical Vapor Deposition) 등의 박막 증착법을 사용한 많은 연구가 진행되어, 저온에서의 좋은 품질의 박막 증착이 가능하지만, 100도 이하의 thermal budget을 갖는 OLED Encapsulation에 사용하기에는 충분하지 않았다. CVD 박막의 특성을 더욱 개선하기 위해 최근 ALD (Atomic Layer Deposition) 방법을 통한 $Al_2O_3$ film 증착 방법이 연구되고 있지만, 낮은 증착 속도로 인해 양산에 걸림돌이 되고 있다. 본 연구에서는 또 다른 해결책으로서 Digital CVD 방법을 이용한 양질의 $Si_3N_4$ 박막의 증착을 연구하였다. 이것은 ALD 증착법과 유사하며, 1st step에서 PECVD 방법으로 4~5 ${\AA}$의 얇은 silicon 박막을 증착하고, 2nd step에서 nitrogen plasma를 이용하여 질화 반응을 진행하고, 이러한 cycle을 원하는 두께가 될 때까지 반복적으로 진행된다. 이 때 1 cycle 당 증착속도는 7 ${\AA}$/cycle 정도였다. 최적의 증착 방법과 조건으로 기존의 CVD $Si_3N_4$ 박막 대비 1/5 이하로 pinhole을 최소화 할 수는 있지만 완벽하게 제거하기는 힘든 문제가 있고, 이를 해결하기 위한 개선을 위한 접근 방법이 필요하다고 판단하였다. 본 연구에서는 무기물 박막인 carbon nitride를 이용한 SiN/C:N multilayer 증착 연구를 진행하였다. Fig. 1은 CVD 조건으로 증착된 두께 750 nm SiN film에서 여러 층의 C:N film layer를 삽입했을 때, 38 시간의 85%/$85^{\circ}C$ 가속실험에 따라 OLED의 발광 사진이다. 그림에서 볼 수 있듯이 C:N 층을 삽입하고 또한 그 박막의 수가 증가함에 따라서 OLED에 대한 encapsulation 특성이 크게 개선됨을 확인할 수 있다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.111-114
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• 1999

Electroluminescence(EL) devices based on organic thin films have been attracted lots of interests in large-area light-emitting display. In this stuffy, an emissive layer was fabricated using Langmuir-Blodgett(LB) technique in organic light-emitting (OLEDs). This emissive organic material was synthesized and named PECCP[poly(3.6-N-2-ethylhexyl carbazolyl cyanoterephthalidene)] which has a strong electron donor group and an electron acceptor group in main chain repeated unit. This material has good solubility in common organic solvents such as chloroform. THF, etc, and has a good stability in air. The Langmuir-Blodgett(LB) technique has the advantage of precise control of the thickness down to the molecular scale, In particular, by varying the film thickness it is possible to investigate the metal/polymer interface. Optimum conditions for the LB film deposition are usually determined by investigating a relationship between a surface pressure $\pi$ and an effective are A occupied by one molecule on the subphase. The LB films were deposited on an indium-tin-oxide(ITO) glass at a surface pressure of 10 mN/m and dipping speed of 12 mm/min after spreading PECCP solution on distilled water surphase at room temperature, Cell structure was ITO/PECCP LB film/Alq$_3$/Al. We considered PECCP as a hole -transport layer inserted between the emissive layer and ITO. We also used Alq$_3$ as an emissive layer and an electron transport layer. We measured current-voltage(I-V) characteristics, UV/visible absorption, PL spectrum and EL spectrum of the OLEDs.

• 대한전자공학회논문지SD
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• 제44권4호
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• pp.80-85
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• 2007

Passivation 기술은 소자를 외부 환경의 영향으로부터 보호할 수 있고, 소자 성능의 감소를 예방할 수 있기 때문에 능동 소자 제작에 있어서 매우 중요하다. 본 논문에서 passivation 물질로 낮은 유전 상수를 갖는 benzocyclobutene (BCB)과 전통적인 passivation 물질인 Si3N4를 이용하여 GaAs를 기반으로 하는 $0.1{\mu}m\;{\Gamma}$-gate InAlAs/InGaAs metamorphic high electron mobility transistors (MHEMTs)를 제작하였다. 제작된 MHEMT의 특성은 passivation 전과 후로 구분하여 비교하였다. Passivation후 BCB와 Si3N4를 이용한 경우 모두에서 passivation 이전에 비해 저하된 DC 및 RF 특성을 나타내었으나, BCB를 이용하여 passivation을 한 소자들이 전통적인 passivation 물질인 Si3N4를 이용한 소자들에 비해서 상대적으로 낮은 특성 저하를 DC와 RF에서 함께 나타내었다.