• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.326-329
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• 2002

In this paper, we investigated a feasibility of cerium oxide(CeO$_2$) films as a buffer layer of MFIS(metal ferroelectric insulator semiconductor) type capacitor. CeO$_2$ layer were Prepared by two step process of a low temperature film growth and subsequent RTA (rapid thermal annealing) treatment. By app1ying an ultra thin Ce metal seed layer and N$_2$ Plasma treatment, dielectric and interface properties were improved. It means that unwanted SiO$_2$ layer generation was successfully suppressed at the interface between He buffer layer and Si substrate. The lowest lattice mismatch of CeO$_2$ film was as low as 1.76% and average surface roughness was less than 0.7 m. The Al/CeO$_2$/Si structure shows breakdown electric field of 1.2 MV/cm, dielectric constant of more than 15.1 and interface state densities as low as 1.84${\times}$10$\^$11/ cm$\^$-1/eV$\^$-1/. After N$_2$ plasma treatment, the leakage current was reduced with about 2-order.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05a
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• pp.27-31
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• 2001

We fabricated organic electroluminescent(EL) devices with mixed emitting layer of poly(N-vinylcarbazole)(PVK), 2,5-bis(5'-tert-butyl-2-benzoxazoly)thiophene(BBOT), N,N'-diphenyl-N,N'-(3-methyphenyl)-1,1'-biphenyl-4, 4'-diarnine(TPD) and poly(3-hexylthiophene)(P3HT). To improve the external quantum efficiency of EL devices, we added the functional layer to the devices such as LiF insulating layer, carrier confinement layer(BBOT) and hole injection layer(CuPc). In the ITO/emitting layer/Al device, the maximum quantum efficiency at 15V was $1.88{\times}10^{-5}%$. And then, it is increased by a factor of 27 to $5.2{\times}10^{-3}%$ in ITO/CuPc/emitting layer/BBOT/LiF/Al device at 15V.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.9
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• pp.589-593
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• 2014

AlNO multi-layer thin films on aluminum substrates were prepared by DC reactive magnetron sputtering method. $Al_2O_3$/AlNO(LMVF)/AlNO(HMVF)/Al/substrate of 4 multi-layer has been prepared in an Ar and ($N_2+O_2$) gas mixture, and $Al_2O_3$ of top layer is anti-reflection layer on double AlNO(LMVF)/AlNO(HMVF) layers and Al metal of infrared reflection layer. In this study, the roughness and surface properties of AlNO thin films were estimated by field emission scanning electron microscopy(FE-SEM). The grain size of AlNO thin films increased with increasing sputtering power. The composition of thin films has been systematically investigated using electron probe microanalysis(EPMA). The optical properties with wavelength spectrum were recorded by UV-Vis-NIR spectrophotometry at a range of 200~1,500 nm. The absorptance of AlNO films shows the increasing trend with swelling ($N_2+O_2$) gas mixture in HMVF and LMVF deposition. The excellent optical performance showed above 98% of absorptance in visible wavelength region.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2000.04a
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• pp.164-169
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• 2000

The remote measurement system(RMS) as a new experimental method is limited in its application to crack measurements at elevated temperatures because of the oxide layer on the specimen surface. Since TiAlN and Cr coating layers have a high resistance to oxidation and wear, this paper proposed a TiAlN and Cr coating technique for specimens to facilitate the measurement of crack growth behavior using RMS. To investigate the effects of the coating layer, tension and fatigue tests were carried out at room temperature and at 538$^{\circ}C$, using specimens of 1Cr-1Mo-0.25V steel. From the experimental results, it was found that the mechanical properties of the TiAlN and Cr coated specimens were similar to those of the substrate. Accordingly, the TiAlN and Cr coated layer had hardly any influence on the fatigue crack propagation.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.10
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• pp.1202-1208
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• 1988

The electron density and electronic states in n- AlGaAs/GaAs heterointerface are calculated by using classical- and quantum-mechanics, respectively. We examine the effects of spacer layer thickness and doping concentration in AlGaAs layer on 2DEG density. Also, the dependences of electronic states of 2DEG upon temperature and acceptor concentration in GaAs layer are investigated.

• Korean Journal of Materials Research
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• v.28 no.5
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• pp.268-272
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• 2018

An $Al_2O_3/AlN$ bilayer deposited on GaN by atomic layer deposition (ALD) is employed to prepare $Al_2O_3/AlN/GaN$ metal-insulator-semiconductor (MIS) diodes, and their interfacial properties are investigated using X-ray photoelectron spectroscopy (XPS) with sputter etch treatment and current-voltage (I-V) measurements. XPS analyses reveal that the native oxides on the GaN surface are reduced significantly during the early ALD stage, indicating that AlN deposition effectively clelans up the GaN surface. In addition, the suppression of Al-OH bonds is observed through the ALD process. This result may be related to the improved device performance because Al-OH bonds act as interface defects. Finally, temperature dependent I-V analyses show that the barrier height increases and the ideality factor decreases with an increase in temperature, which is associated with the barrier inhomogeneity. A Modified Richardson plot produces the Richardson constant of $A^{**}$ as $30.45Acm^{-2}K^{-2}$, which is similar to the theoretical value of $26.4Acm^{-2}K^{-2}$ for n-GaN. This indicates that the barrier inhomogeneity appropriately explains the forward current transport across the $Au/Al_2O_3/AlN/GaN$ interface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.255-255
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• 2015

나노압침방법을 적용하여 arc ion plating을 통해 제조된 TiAlSiN 코팅층의 질소 함량에 따른 나노 기계적 특성을 평가하였다. 코팅층의 질소 함량은 28~30 [at.%] 이었다. 코팅층에는 AlN, TiSi, $Al_5Ti_3$, $Ti_3AlN$, $Al_5Ti_2$ 상이 형성되었다. 질소 함량이 더 작은 코팅층의 나노경도, 마찰계수, 피로한계의 값이 높아짐을 알 수 있었다.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.710-713
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• 2002

In order to improve the power efficiency of multi-layer organic light emitting diodes (OLEDs), electron injection into ETL(electron transport layer) from cathode at the interface between ETL and cathode was enhanced by interposing a proper electron injection layer at the interface. The HTL(hole transport layer) and ETL materials used were N, N'diphenyl- N, N' - bis(3-methylphenyl-1, 1'- biphenyl - 4, 4 'diamine (TPD) and tris (8-hydroxyquinoline) aluminum ($Alq_3$) respectively. Cathodes using co-evaporated Al-CsF, Al-KF, and Al-NaF composites are adopted to enhance the electrical and optical properties of OLEDs. OLEDs with alkaline metal-doped cathode show a luminance of as high as 35,000 cd/$m^2$, and external quantum efficiency about 1.35 %. In addition, they show higher power efficiency at all bias conditions and good reproducibility.

• Journal of the Korean Vacuum Society
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• v.11 no.1
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• pp.50-58
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• 2002

The growth of GaN films on Si substrate has many advantages in that Si is less expensive than sapphire substrate and that integration of GaN-based devices with Si substrate is easier The difference of lattice constant and thermal expansion coefficient between GaN and Si is larger than those between GaN and sapphire. However, which results in many defects into the grown GaN. In order to obtain high duality GaN films on Si substrate, we need to reduce defects using the buffer layer such as AlN. In this study, we prepared three types of AlN buffer layer with various crystallinity on Si (111) substrate using MOCVD, Sputtering and MOMBE methods. GaN was grown by MOCVD on three types of AlN/Si substrate. Using TEM and XRD, we carried out comparative investigation of growth and properties of GaN deposited on the various AlN buffers by characterizing lattice coherency, crystallinity, growth orientation and defects formed (voids, stacking faults, dislocations, etc). It is found that the crystallinity of AlN buffer layer has strong effects on growth of GaN. The AlN buffer layers grown by MOCVD and MOMBE showed the reduction of out-of-plane misorientation of GaN at the initial growth stage.

• Journal of Sensor Science and Technology
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• v.5 no.5
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• pp.79-84
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• 1996

A $1\;{\mu}m$ thick n-type GaAs layer with Si doping density of $1{\times}10^{17}/cm^{3}$ and a $500{\AA}$ thick undoped single crystalline AlAs layer were subsequently grown by molecular beam epitaxy on the $n^{+}$ GaAs substrate. The AlAs/GaAs layer was oxidized in $N_{2}$ bubbled $H_{2}O$ vapor($95^{\circ}C$) ambient at $400^{\circ}C$ for 2 and 3 hours. From the result of XPS analysis, small amounts of $As_{2}O_{3}$, AlAs, and elemental As were found in the samples oxidized up to 2 hours. After 3 hours oxidation, however, various oxides related to As were dissolved and As atoms were diffused out toward the oxide surface. The as-grown AlAs/GaAs layer was selectively converted to $Al_{2}O_{3}/GaAs$ at the oxidation temperature $400^{\circ}C$ for 3 hours. The oxidation temperature and time is very critical to stop the oxidation at the AlAs/GaAs interface and to form a defect-free surface layer.