• Title/Summary/Keyword: AlN crystal

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HVPE growth of GaN/InGaN heterostructure on r-plane sapphire substrate (R-plane 사파이어 기판위의 GaN/InGaN 이종접합구조의 HVPE 성장)

  • Jeon, H.S.;Hwang, S.L.;Kim, K.H.;Jang, K.S.;Lee, C.H.;Yang, M.;Ahn, H.S.;Kim, S.W.;Jang, S.H.;Lee, S.M.;Park, G.H.;Koike, M.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.17 no.1
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    • pp.6-10
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    • 2007
  • The a-plane GaN layer on r-plane $Al_2O_3$ substrate is grown by mixed-source hydride vapor phase epitaxy (HVPE). The GaN/InGaN heterostructure is performed by selective area growth (SAG) method. The heterostructure consists of a flown over mixed-sourec are used as gallium (or indium) and nitrogen sources. The gas flow rates of HCl and $NH_3$ are maintained at 10 sccm and 500 sccm, respectively. The temperatures of GaN source zone is $650^{\circ}C$. In case of InGaN, the temperature of source zone is $900^{\circ}C$. The grown temperatures of GaN and InGaN layer are $820^{\circ}C\;and\;850^{\circ}C$, respectively. The EL (electroluminescence) peak of GaN/InGaN heterostructure is at nearly 460 nm and the FWHM (full width at half maximum) is 0.67 eV. These results are demonstrated that the heterostructure of III-nitrides on r-plane sapphire can be successfully grown by mixed-source HVPE with multi-sliding boat system.

Effect of Water and Aluminum Sulfate Mole Ratio on Pore Characteristics in Synthesis of AlO(OH) Nano Gel by Homogeneous Precipitation (균일침전에 의한 AlO(OH) 나노 겔 합성에서 물/황산알루미늄의 몰 비가 세공특성에 미치는 영향)

  • Choe, Dong-Uk;Park, Byung-Ki;Lee, Jung-Min
    • Journal of the Korean Ceramic Society
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    • v.43 no.9 s.292
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    • pp.564-568
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    • 2006
  • AlO(OH) nano gel is used in precursor of ceramic material, coating material and catalyst. For use of these, not only physiochemical control for particle morphology, pore characteristic and peptization but also studies of synthetic method for preparation of advanced application products were required. In this study, AlO(OH) nano gel was prepared through the aging and drying process of aluminum hydroxides gel precipitated by the hydrolysis reaction of dilute NaOH solution and aluminum sulfate solution. In this process, optimum synthetic condition of AlO(OH) nano gel having excellent pore volume as studying the effect of water and aluminum sulfate mole ratio on gel precipitates has been studied. Water and aluminum sulfate mole ratio brought about numerous changes on crystal morphology, surface area, pore volume and pore size. Physiochemical properties were investigated as using XRD, TEM, TG/DTA, FT-IR, and $N_2$ BET method.

Orientation, Surface Roughness and Piezoelectric Characteristics of AlN Thin Films with RF Magnetron Sputtering Conditions (RF 마그네트론 스퍼터링 공정 조건에 따른 AlN 박막의 배향성, 표면 거칠기 및 압전 특성에 관한 연구)

  • Bang Jung-Ho;Chang Dong-Hoon;Kang Seong-Jun;Kim Dong-Guk;Yoon Yung-Sup
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.43 no.4 s.346
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    • pp.1-7
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    • 2006
  • AlN thin films have been fabricated by using RF magnetron sputtering method and their crystal orientations, microstructures and piezoelectric properties have been investigated with variation of the $Ar/N_2$ gas ratio and the substrate temperature. Particularly, when the $Ar/N_2$ gas ratio and the substrate temperature are 10/10 (sccm) and $400^{\circ}C$, respectively, the AlN thin film exhibits the highest (002) orientation. The result of the surface roughness measurement by using AFM shows that the surface roughness becomes better as the partial pressure of $N_2$ increases at the substrate temperature of $400^{\circ}C$ and it becomes the smallest value of 2.1 nm when $Ar/N_2$ is 0/20 (sccm). The AFM measurement also shows that when $Ar/N_2$ is 10/10 (sccm) shows that surface roughness becomes better as the substrate temperature increases from room temperature up to $300^{\circ}C$ and then it becomes worse as the substrate temperature goes up from $300^{\circ}C$. At the substrate temperature of $300^{\circ}C$ and $Ar/N_2$=10/10 (sccm), the surface roughness is 3.036 nm. The piezoelectric constant ($d_{33}$) of AlN thin film is measured by Pneumatic probe method. The measurement shows that the AlN thin film with the highest (002) orientation, fabricated at $Ar/N_2$=10/10 (sccm) and the substrate temperature of $400^{\circ}C$, has the best Piezoelectric constant ($d_{33}$) of 6.01 pC/N.

DFabrication of $GdAlO_3$ Buffer Layers by Sol-Gel Processing (졸-겔법에 의한 $GdAlO_3$ 버퍼층의 제조)

  • Bang, Jae-Cheol
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.5
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    • pp.801-804
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    • 2006
  • [ $GdAlO_3(GAO)$ ] buffer layer for $YBa_2Cu_3O_{7-{\delta}}(YBCO)$ coated superconductor wire was fabricated by sol-gel processing. Precursor solution was prepared by dissolving 1:1 stoichiometric quantaties of gadolinium nitrate hexahydrate and aluminum nitrate nonahydrate in methanol. The solution was spin-coated on $SrTiO_3(STO)$(100) single crystal substrates and heated at $1000^{\circ}C$ for 2h in wet $N_2-5%\; H_2$, atmosphere. A SEM(scanning electron microscopy) observation of the surface morphology of the GAO layer has shown that it has a faceted morphology indicating epitaxy. It was shown from x-ray diffraction(XRB) that GAO buffer layer was highly c-axis oriented epitaxial thin film with both good out-of-plane($FWHM=0.29^{\circ}$ for the (002) reflection) and in-plane ($FWHM=1.10^{\circ}$ for the {112} reflection) alignment.

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Synthesis of p-Type ZnO Thin Film Prepared by As Diffusion Method and Fabrication of ZnO p-n Homojunction

  • Kim, Deok Kyu
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.6
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    • pp.372-375
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    • 2017
  • ZnO thin films were deposited by RF magnetron sputtering and then diffused by using an As source in the ampouletube. Also, the ZnO p-n homojunction was made by using As-doped ZnO thin films, and its properties were analyzed. After the As doping, the surface roughness increased, the crystal quality deteriorated, and the full width at half maximum was increased. The As-doped ZnO thin films showed typical p-type properties, and their resistivity was as low as $2.19{\times}10^{-3}{\Omega}cm$, probably because of the in-diffusion from an external As source and out-diffusion from the GaAs substrate. Also, the ZnO p-n junction displayed the typical rectification properties of a p-n junction. Therefore, the As diffusion method is effective for obtaining ZnO films with p-type properties.

A Study on the Effect of Fluid Flow on the Microstructure of High Purity Al Ingot under Forced Flow (강제대류시 고순도 Al괴의 응고조직에 미치는 유동의 영향)

  • Kim, Kyoung-Min;Kim, Heon-Joo;Ha, Ki-Yun;Yoon, Eui-Pak
    • Journal of Korea Foundry Society
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    • v.13 no.6
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    • pp.540-546
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    • 1993
  • The effects of fluid flow on the purification of aluminum were studied. As the revolution rate(N) increased, the size of columnar grain decreased gradually. The concentration of solidified crystal was decreased with increasing distance from chill and revolution rate(N). Distribution boundary layer thickness(${\delta}$) was calculated from the solute distribution obtained in solid experimentally and by use of BPS equation. The value of ${\delta}$ changed from about $60{\mu}m$ at N value of 27rpm to about $15{\mu}m$ at N value of 1000rpm. From this result, high purification was obtained by decreasing the diffusion boundary layer under forced convection.

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Suppression of Macrostep Formation Using Damage Relaxation Process in Implanted SiC Wafer (SiC 웨이퍼의 이온 주입 손상 회복을 통한 Macrostep 형성 억제)

  • Song, G.H.;Kim, N.K.;Bahng, W.;Kim, S.C.;Seo, K.S.;Kim, E.D.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.346-349
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    • 2002
  • High Power and high dose ion implantation is essentially needed to make power MOSFET devices based on SiC wafers, because the diffusivities of the impurities such as Al, N, p, B in SiC crystal are very low. In addition, it is needed high temperature annealing for electrical activation of the implanted species. Due to the very high annealing temperature, the surface morphology after electrical activation annealing becomes very rough. We have found the different surface morphologies between implanted and unimplanted region. The unimplanted region showed smoother surface morphology It implies that the damage induced by high energy ion implantation affects the roughening mechanism. Some parts of Si-C bonding are broken in the damaged layer, s\ulcorner the surface migration and sublimation become easy. Therefore the macrostep formation will be promoted. N-type 4H-SiC wafers, which were Al ion implanted at acceleration energy ranged from 30kev to 360kev, were activated at 1600$^{\circ}C$ for 30min. The pre-activation annealing for damage relaxation was performed at 1100-1500$^{\circ}C$ for 30min. The surface morphologies of pre-activation annealed and activation annealed were characterized by atomic force microscopy(AFM).

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Wear behavior of $Si_3N_4$-SiC nanocomposite in water

  • Kim, S. H.;Lee, S. W.
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1997.10a
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    • pp.187-187
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    • 1997
  • Silicon nitride is the most excellent materials among structural ceramics. It has been reported that fracture toughness was improved with adding second phase particles, whisker, fiber etc. However, containing of second phase particles enhanced fracture toughness, however flexural strength was degraded. As adding nanosize SiC particles into silicon nitride, the physical properties of fluxural strength, fracture toughness, the modulus of elasticity. In this study, 2wt% $Al_2$O$_3$ and 4 wt% $Y_2$O$_3$ were added into UBE E-10 and 0, 10, 20, 30, 40, 50 vol% nano-SiC powder (Sumitomo T1 powder) were added, respectively. It is hot pressed at 185$0^{\circ}C$ for 1 hour. Most of structural ceramics for engineering application are wear resistance. In this study, wear behaviors (in water) of silicon nitride with varying the amount of nano-size silicon carbide were investigated, and was compared to physical properties. Simultaneously wear mechanism will be found out.

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Temperature dependence of photocurrent for CdIn2Te4 single crystal grown by Bridgman method (Bridgman법으로 성장한 CdIn2Te4 단결정의 광전류 온도 의존성)

  • 유상하;홍광준
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.11a
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    • pp.157-157
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    • 2003
  • 수평 전기로에서 CdIn2Te4 다결정을 용융법으로 합성하고 Bridgman법으로 tetragonal structure의 c축에 평행한 CdIn2Te4 단결정을 성장시켰다. c축에 평행한 시료의 광흡수와 광전류 spectra를 293K에서 10K까지 측정하였다. 광흡수 spectra에 의해 band gap Eg(T)는 varshni공식에 따라 계산한 결과 1.4753eV-(7.78$\times$$10^{-3}$eV/K)T$^2$/(T+2155K)임을 확인하였다. Hall 효과는 van der Pauw 방법에 의해 측정되었으며, 온도에 의존하는 운반자 농도와 이동도는 293K에서 각각 9.01$\times$$10^{16}$ /㎤, 219 $\textrm{cm}^2$/V.S였다. 광전류 스펙트럼으로부터 Hamilton matrix(Hopfield quasicubic mode)법으로 계산한 결과 crystal field splitting $\Delta$cr값이 0.2704 eV이며 spin-orbit $\Delta$so 값은 0,1465 eV임을 확인하였다. 10K일 때 광전류 봉우리들은 n=1일때 Al-, Bl-와 Cl-exciton 봉우리임을 알았다.

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Investigation of pretilt generation by UV light irradiation during imidization of polyimide (폴리이미드 소성 시에 UV 광조사를 이용한 프리틸트 발생에 대한 연구)

  • 서대식;김형규
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.1
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    • pp.75-79
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    • 2000
  • In this study, we investigated the pretilt angle generation and liquid crystal (LC) alignment by ultravi-olet (UV) light irradiation during imidization of polymide. The generated pretilt angle of nematic (N) LC by using the in-situ photo-alignment method was smaller than that of the conventional UV photo-alignment method. Also, generated pretilt angle of NLC tends to increase by annealing. In case of using the polymer(AL-3046), we found that the in-situ Uv photo-alignment method has higher thermal stability of LC alignment, but it has a disadvantage to control pretilt angle.

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