• 한국결정성장학회지
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• 제17권1호
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• pp.6-10
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• 2007

R-plane 사파이어 위에 a-plane GaN층이 성장된 기판에 혼합소스 HVPE(mixed-source hydride vapor phase epitaxy) 방법으로 GaN/InGaN의 이종접합구조(heterostructure)를 구현하였다. GaN/InGaN 이종접합구조는 GaN, InGaN, Mg-doped GaN 층으로 구성되어 있다. 각 층의 성장온도는 GaN층은 $820^{\circ}C$, InGaN 층은 $850^{\circ}C$, Mg-doped GaN 층은 $1050^{\circ}C$에서 성장하였다. 이때의 $NH_3$와 HCl 가스의 유량은 각각 500 sccm, 10 sccm 이었다. SAG-GaN/InGaN 이종접합구조의 상온 EL (electroluminescence) 특성은 중심파장은 462 nm, 반치폭(FWHM : full width at half maximum) 은 0.67eV 이었다. 이 결과로부터 r-plane 사파이어 기판위에 multi-sliding boat system의 혼합소스 HVPE 방법으로 이종접합구조의 성장이 가능함을 확인하였다.

• 한국세라믹학회지
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• 제43권9호
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• pp.564-568
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• 2006

AlO(OH) nano gel is used in precursor of ceramic material, coating material and catalyst. For use of these, not only physiochemical control for particle morphology, pore characteristic and peptization but also studies of synthetic method for preparation of advanced application products were required. In this study, AlO(OH) nano gel was prepared through the aging and drying process of aluminum hydroxides gel precipitated by the hydrolysis reaction of dilute NaOH solution and aluminum sulfate solution. In this process, optimum synthetic condition of AlO(OH) nano gel having excellent pore volume as studying the effect of water and aluminum sulfate mole ratio on gel precipitates has been studied. Water and aluminum sulfate mole ratio brought about numerous changes on crystal morphology, surface area, pore volume and pore size. Physiochemical properties were investigated as using XRD, TEM, TG/DTA, FT-IR, and $N_2$ BET method.

• 대한전자공학회논문지SD
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• 제43권4호
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• pp.1-7
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• 2006

RF 마그네트론 스퍼터링 방법을 이용하여 $Ar/N_2$ 가스비와 기판 온도 변화에 따른 AlN 박막의 배향성과 표면 거칠기 그리고 압전 특성의 변화를 조사하였다. 특히, $Ar/N_2$=10/10 (sccm), 기판 온도 $400^{\circ}C$ 일 때 가장 우수한 (002) 배향성을 얻을 수 있었다. AFM 을 이용하여 표면 거칠기를 분석한 결과, 기판 온도 $400^{\circ}C$ 인 경우 $Ar/N_2$ 가스비의 변화에 대해서는 $N_2$의 분압비가 증가할수록 표면 거칠기 특성이 좋아지는 것으로 나타났으며 $Ar/N_2$=0/20 (sccm) 일 때 2.1 nm 로 가장 작은 값을 나타내었다. $Ar/N_2$=10/10 (sccm) 인 조건에서 기판 온도 변화에 대한 표면 거칠기 특성은 기판 온도가 상온에서 $300^{\circ}C$ 로 증가함에 따라 향상되는 경향을 보였으며, $300^{\circ}C$ 에서 3.036 nm 로 최소값을 나타낸 후, 기판 온도가 $300^{\circ}C$ 이상으로 상승하면 표면 거칠기는 다시 열악해지는 것을 확인할 수 있었다. Pneumatic probe 방법을 이용하여 압전 특성을 측정한 결과, $Ar/N_2$=10/10 (sccm), 기판 온도 $400^{\circ}C$ 일 때 Piezoelectric constant ($d_{33}$)=6.01 pC/N 이라는 가장 우수한 값을 나타내었으며, 이는 AlN 박막이 가장 좋은 (002) 배향성을 갖는 조건과 일치하는 것이다.

• 한국산학기술학회논문지
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• 제7권5호
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• pp.801-804
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• 2006

[ $YBa_2Cu_3O_{7-{\delta}}(YBCO)$ ]계 초전도 선재용 $GdAlO_3(GAO)$ 버퍼층을 졸-겔(sol-gel) 공정에 의해 제조하였다. 전구체 용액은 Gd 질산염과 Al 질산염을 1:1 화학양론비로 하여 메탄올에 용해하여 준비하였다. 전구체 용액을 $SrTiO_3(STO)$ (100) 단결정 기판위에 스핀 코팅하고, 수분이 포함된 $N_2-5%\; H_2$ 분위기에서 $1000^{\circ}C$에서 2시간 열처리 하였다. 열처리 후 GAO 층의 표면에 대한 주사전자현미경 관찰에 의해 GAO 층이 에피택셜의 특징인 각면 형상을 갖는 것을 알 수 있었다. X-선 회절분석에 의하면 GAO 버퍼층은 c-축으로 우선 배향된 에피택셜 박막으로써 반가폭이 각각 (002)면에서 $0.29^{\circ}(out-of-plane)$, {112}지면에서 $1.10^{\circ}(in-plane)$의 우수한 배향성을 나타내었다.

• 한국전기전자재료학회논문지
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• 제30권6호
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• pp.372-375
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• 2017

ZnO thin films were deposited by RF magnetron sputtering and then diffused by using an As source in the ampouletube. Also, the ZnO p-n homojunction was made by using As-doped ZnO thin films, and its properties were analyzed. After the As doping, the surface roughness increased, the crystal quality deteriorated, and the full width at half maximum was increased. The As-doped ZnO thin films showed typical p-type properties, and their resistivity was as low as $2.19{\times}10^{-3}{\Omega}cm$, probably because of the in-diffusion from an external As source and out-diffusion from the GaAs substrate. Also, the ZnO p-n junction displayed the typical rectification properties of a p-n junction. Therefore, the As diffusion method is effective for obtaining ZnO films with p-type properties.

• 한국주조공학회지
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• 제13권6호
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• pp.540-546
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• 1993

The effects of fluid flow on the purification of aluminum were studied. As the revolution rate(N) increased, the size of columnar grain decreased gradually. The concentration of solidified crystal was decreased with increasing distance from chill and revolution rate(N). Distribution boundary layer thickness(${\delta}$) was calculated from the solute distribution obtained in solid experimentally and by use of BPS equation. The value of ${\delta}$ changed from about $60{\mu}m$ at N value of 27rpm to about $15{\mu}m$ at N value of 1000rpm. From this result, high purification was obtained by decreasing the diffusion boundary layer under forced convection.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.346-349
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• 2002

High Power and high dose ion implantation is essentially needed to make power MOSFET devices based on SiC wafers, because the diffusivities of the impurities such as Al, N, p, B in SiC crystal are very low. In addition, it is needed high temperature annealing for electrical activation of the implanted species. Due to the very high annealing temperature, the surface morphology after electrical activation annealing becomes very rough. We have found the different surface morphologies between implanted and unimplanted region. The unimplanted region showed smoother surface morphology It implies that the damage induced by high energy ion implantation affects the roughening mechanism. Some parts of Si-C bonding are broken in the damaged layer, s\ulcorner the surface migration and sublimation become easy. Therefore the macrostep formation will be promoted. N-type 4H-SiC wafers, which were Al ion implanted at acceleration energy ranged from 30kev to 360kev, were activated at 1600$^{\circ}C$ for 30min. The pre-activation annealing for damage relaxation was performed at 1100-1500$^{\circ}C$ for 30min. The surface morphologies of pre-activation annealed and activation annealed were characterized by atomic force microscopy(AFM).

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1997년도 Proceedings of the 13th KACG Technical Meeting `97 Industrial Crystallization Symposium(ICS)-Doosan Resort, Chunchon, October 30-31, 1997
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• pp.187-187
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• 1997

Silicon nitride is the most excellent materials among structural ceramics. It has been reported that fracture toughness was improved with adding second phase particles, whisker, fiber etc. However, containing of second phase particles enhanced fracture toughness, however flexural strength was degraded. As adding nanosize SiC particles into silicon nitride, the physical properties of fluxural strength, fracture toughness, the modulus of elasticity. In this study, 2wt% $Al_2$O$_3$ and 4 wt% $Y_2$O$_3$ were added into UBE E-10 and 0, 10, 20, 30, 40, 50 vol% nano-SiC powder (Sumitomo T1 powder) were added, respectively. It is hot pressed at 185$0^{\circ}C$ for 1 hour. Most of structural ceramics for engineering application are wear resistance. In this study, wear behaviors (in water) of silicon nitride with varying the amount of nano-size silicon carbide were investigated, and was compared to physical properties. Simultaneously wear mechanism will be found out.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.157-157
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• 2003

수평 전기로에서 CdIn2Te4 다결정을 용융법으로 합성하고 Bridgman법으로 tetragonal structure의 c축에 평행한 CdIn2Te4 단결정을 성장시켰다. c축에 평행한 시료의 광흡수와 광전류 spectra를 293K에서 10K까지 측정하였다. 광흡수 spectra에 의해 band gap Eg(T)는 varshni공식에 따라 계산한 결과 1.4753eV-(7.78$\times$$10^{-3}$eV/K)T$^2$/(T+2155K)임을 확인하였다. Hall 효과는 van der Pauw 방법에 의해 측정되었으며, 온도에 의존하는 운반자 농도와 이동도는 293K에서 각각 9.01$\times$$10^{16}$ /㎤, 219 $\textrm{cm}^2$/V.S였다. 광전류 스펙트럼으로부터 Hamilton matrix(Hopfield quasicubic mode)법으로 계산한 결과 crystal field splitting $\Delta$cr값이 0.2704 eV이며 spin-orbit $\Delta$so 값은 0,1465 eV임을 확인하였다. 10K일 때 광전류 봉우리들은 n=1일때 Al-, Bl-와 Cl-exciton 봉우리임을 알았다.

• 한국전기전자재료학회논문지
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• 제13권1호
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• pp.75-79
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• 2000

In this study, we investigated the pretilt angle generation and liquid crystal (LC) alignment by ultravi-olet (UV) light irradiation during imidization of polymide. The generated pretilt angle of nematic (N) LC by using the in-situ photo-alignment method was smaller than that of the conventional UV photo-alignment method. Also, generated pretilt angle of NLC tends to increase by annealing. In case of using the polymer(AL-3046), we found that the in-situ Uv photo-alignment method has higher thermal stability of LC alignment, but it has a disadvantage to control pretilt angle.