• Tribology and Lubricants
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• 제35권5호
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권4호
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• pp.202-208
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• 2001

In Recent results suggested that doping $Ta_2O_5$ with a small amount of $TiO_2$ using standard ceramic processing techniques can increase the dielectric constant of $Ta_2O_5$ significantly. In this paper, this concept is studied using RTCVD (Rapid Thermal Chemical Vapor Deposition). Ti-doped $Ta_2O_5$ films are deposited using $TaC_{12}H_{30}O_5N$, $C_8H_{24}N_4Ti$, and $O_2$ on both Si and $NH_3$-nitrided Si substrates. An $NH_3$-based interface layer at the Si surface is used to prevent interfacial oxidation during the CVD process and post deposition annealing is performed in $H_2/O_2$ ambient to improve film quality and reduce leakage current. A sputtered TiN layer is used as a diffusion barrier between the Al gate electrode and the $TaTi_xO_y$ dielectric. XPS analyses confirm the formation of a ($Ta_2O_5)_{1-x}(TiO_2)_x$ composite oxide. A high quality $TaTi_xO_y$ gate stack with EOT (Equivalent Oxide Thickness) of $7{\AA}$ and leakage current $Jg=O.5A/textrm{cm}^2$ @ Vg=-1.0V has been achieved. We have also succeeded in forming a $TaTi_x/O_y$ composite oxide by rapid thermal oxidation of the as-deposited CVD TaTi films. The electrical properties and Jg-EOT characteristics of these composite oxides are remarkably similar to that of RTCVD $Ta_2O_5, suggesting that the dielectric constant of $Ta_2O_5$ is not affected by the addition of $TiO_2$.

• 한국재료학회지
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• 제20권12호
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• pp.676-680
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• 2010

Most TCOs such as ITO, AZO(Al-doped ZnO), FTO(F-doped $SnO_2$) etc., which have been widely used in LCD, touch panel, solar cell, and organic LEDs etc. as transparent electrode material reveal n-type conductivity. But in order to realize transparent circuit, transparent p-n junction, and introduction of transparent p-type materials are prerequisite. Additional prerequisite condition is optical transparency in visible spectral region. Oxide based materials usually have a wide optical bandgap more than ~3.0 eV. In this study, single-phase transparent semiconductor of $SrCu_2O_2$, which shows p-type conductivity, have been synthesized by 2-step solid state reaction at $950^{\circ}C$ under $N_2$ atmosphere, and single-phase $SrCu_2O_2$ thin films of p-type TCOs have been deposited by RF magnetron sputtering on alkali-free glass substrate from single-phase target at $500^{\circ}C$, 1% $H_2$/(Ar + $H_2$) atmosphere. 3% $H_2$/(Ar + $H_2$) resulted in formation of second phases. Hall measurements confirmed the p-type nature of the fabricated $SrCu_2O_2$ thin films. The electrical conductivity, mobility of carrier and carrier density $5.27{\times}10^{-2}S/cm$, $2.2cm^2$/Vs, $1.53{\times}10^{17}/cm^3$ a room temperature, respectively. Transmittance and optical band-gap of the $SrCu_2O_2$ thin films revealed 62% at 550 nm and 3.28 eV. The electrical and optical properties of the obtained $SrCu_2O_2$ thin films deposited by RF magnetron sputtering were compared with those deposited by PLD and e-beam.

• 한국수산과학회지
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• 제18권5호
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• pp.409-416
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• 1985

In previous paper (Lee et al., 1983) processing method of sardine meat "surimi" was described as a part of the wort to develop new types of ready-to-cook food materials with dark fleshed fishes. As the other part of the work, processing of low salt mackerel fillet was investigated, in this paper, in which fresh mackerel was filleted, salted in brine or with dry salt for an adequate time until the expected salt concentration reached, washed, air dried (3 m/sec, 15 to $20^{\circ}C$), and finally packed individually in K-flex film bag by vacuum or $N_2$ gas substitution. Salting time and salt concentration of brine was decided by the salt level penetrated into the fillet. As the final salt level was fixed to 4 to $5\%$, salting for 20 hours with $10\%$ dry salt or in $15\%$ brine at $5^{\circ}C$ was enough to get that level of salt. If the final salt level was set 5 to $6\%$, salting for 20-24 hours with $15\%$ dry salt or in $20\%$ brine was adequate. Salt penetration, however, was not much influenced by salting method and temperature. Changes in VBN and salt soluble protein occurred more rapidly in cases of salting with dry salt at $20^{\circ}C$ than salted in brine at $5^{\circ}C$, although it was not significant in the period of 20 to 24 hours. Oxidation of lipid and histamine formation during salting at $20^{\circ}C$ could not be neglected if it was delayed loger than 25 hours. Insolubilizing the salt soluble proteins during the storage of salted fillet occurred rapidly regardless of storage temperature. Browning and histamine formation, however, was depended on temperature and packing condition. In case of air pack, deterioration by browning and rancid was deeply developed but not the case for the packs by vacuum or $N_2$ gas substitution. The shelf-life of the salted mackerel fillet based on panel scores of brown color and rancidity, appeared 21 days for the air packed, and more than 30 days for vacunm or $N_2$ gas packed fillet at $20^{\circ}C$.

• 한국염색가공학회지
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• 제28권1호
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• pp.48-56
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• 2016

Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.

• 한국세라믹학회지
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• 제35권7호
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• pp.647-647
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• 1998

비대칭적인 전극 구조를 가지는 Pb(Zr,Ti)$O_3$(PZT) 박막의 비대칭적인 스위칭 특성을 연구하기 위해 Pulsed Laser Deposituin(PLD)방법으로 $LaAlO_3$ 기판 위에 (La,Sr)$CoO_3$/Pb(Zr,Ti)$O_3$/(La,Sr)$CoO_3$(LSCO) 다층구조를 성장시켰다. PZT 박막 캐시터의 전극이 모두 같은 조성일 때, 즉 $(La_0.5Sr_0.5)CoO_3$(LSCO)일 때 PZT 박막의 이력곡선은 대칭성을 보여주고 있다. 그러나 산화물 전극의 조성이 변할 때 PZT 박막 캐패시터는 비대칭성을 보여주고 있다. $LaCoO_3(LCO)$를 상층 전극, $La_0.5,Sr_0.5)CoO_3$(LSCO)를 하층 전극으로 사용하였을 때 이력 곡선은 음의 방향으로 분극된 상태가 불안정 하여 음의 잔류 분극의 완화 현상을 보여준다. 반면 상층 전극이 LSCO, 하층 전극이 LCO인 PZT 박막 캐패시터는 양의 방향의 분극 상태가 불안정하여 양의 잔류 분극이 완화현상을 보여준다. 이러한 이력 곡선의 완화 현상은 LCO/PZT 계면에서의 전자 밴드 구조의 변형에 의한 내부 전계의 형성 때문이라 생각할 수 있다. 내부 전계는 LCO/PZT와 LSCO/PZT 계면에서의 전자 밴드 구조의 변형에 의한 내부 전계의 형성 때문이라 생각할 수 있다.내부 전계는 LCO/PZT 계면에서의 인가된 전압 강하 차이에 의해 발생되며 전압 강하는 각각의 계면에서 0.6V와 -0.12V의 크기를 갖는다.

• 한국수산과학회지
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• 제20권1호
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• pp.41-51
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• 1987

다획성적색육어류인 고등어를 원료로하여 우리나라 사람의 기호에 맞고 즉석(卽席)수우프의 원료로 이용할 수 있는 고등어분말수우프를 제조하기 위한 가공조건 및 이의 효율적인 저장방법과 제품의 맛성분에 대하여 검토하였다. 가공조건은 고등어를 필레로 만들어 $95^{\circ}C$의 열수 중에서 10분간 자숙한 다음 압착하여 가다랑어자숙 엑스분 중에서 5분간 침지하였다. 이것을 $80^{\circ}C$에서 8시간의 훈건 및 엄증을 3차례 반복하여 수분함량이 약 $10\~12\%$되도록 하여 50 mesh 크기로 분쇄한후 $(PET/Al\;foil/CPP:\;5{\mu}m/15{\mu}m/70{\mu}m,\;15\times17cm)$ 적층필름주머니에 일정량 충전하여 포장용기내의 공기를 질소치환 혹은 탈산소제를 봉입포장하여 저장함으로서 제품의 품질변화를 최대한 억제시킬 수 있었다. 한편 제품제조시 가다랑어자숙엑스분중에 침지처리함으로서 제조중 지방산화의 억제 및 제품의 풍미를 향상시킬 수 있었다. 고등어분말수우프의 수분함량은 $11.3\~12.3\%$, 조지방 $12.0\%$, 조단백질 $73.0\%$, 회분 $3.2\%$ 및 구분활성은 $0.52\~0.56$의 범위로서 저장중 거의 변화가 없었고, 제품의 pH, 휘발성염기질소 및 아미노질소는 저장기간이 경과함에 따라 약간씩 증가하는 경향이었다. 저장중 제품의 수용성 및 지용성 갈변도는 함기포장제품(C)의 경우 증가하는 경향을 나타내나 질소치환포장제품(N)이 나 탈산소제 봉입 포장제 품(O)은 거의 변화가 없었고, 과산화물값, 카르보닐값 및 TBA값을 측정한 결과 제품(N) 및 (O)는 저장중 지방산화를 효율적으로 억제 할 수 있었다. 제품의 주요구성지방산은 16:0, 18:1, 22:6, 18:0 및 20:5 등이었으며 제품제조 및 저장중 폴리엔산은 다소 감소한 반면, 포화산 및 모노엔산의 조성비는 증가하였다. 고등어분말수우프제품의 주요한 맛성분이라고 추정되는 IMP의 함량은 $420.2\~454.2mg/100g$으로서 저장중 약간씩 감소하는 경향이었고, 주요불휘발성 유기산은 lactic acid, succinic acid, $\alpha-ketoglutaric\;acid$ 등으로 함량은 각각 902.2 mg/100 g, 28.3 mg/100g 및 8.6mg/100g이었다. 이외에 malic acid 등 6종의 유기산이 미량 함유되어 있었다. 제품의 유리아미노산 및 관련화합물의 조성은 histidine이 641.8 mg/100g으로 가장 많았고, alanine 214.7 mg/100g, hydroxyproline이 48.9mg/100g, 이외에 lysine, glutamic acid 및 anserine 등이 전체의 $80.8\%$를 차지하였다. 고등어분말수우프의 맛성분은 건물량 기준으로 유리아미노산 및 관련화합물이 1,279.4 mg/100g, 불휘발성유기산이 948.1mg/100g, 핵산 관련물질 672.8 mg/100g, 총 creatinine이 430.4 mg/100g, betaine 86.6mg/100g 및 미량의 TMAO로 이루어져 있었고 국물로 우려낼때 맛성분의 추출조건은 $100^{\circ}C$에서 1분간의 고온단시간 추출이 적합하였다.