• 전기전자학회논문지
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• 제26권4호
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• pp.722-727
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• 2022

본 논문에서는 0.25 ㎛의 게이트를 갖는 AlGaN/GaN HEMT를 기반으로 개발된 X-대역 전력 증폭기 MMIC의 특성을 기술한다. 개발된 X-대역 전력 증폭기 MMIC는 9 GHz~10 GHz의 주파수 대역에서 21.6 dB 이상의 소신호 이득과 46.11dBm(40.83 W) 이상의 출력 전력을 가진다. 전력 부가 효율 특성은 43.09%~44.47%이며 칩의 크기는 3.6 mm×4.3 mm이다. 출력 전력 밀도는 2.69 W/mm²를 나타내었다. 개발된 AlGaN/GaN 전력 증폭기 MMIC는 다양한 X-대역 레이더 응용에 적용 가능하다.

• 전기전자학회논문지
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• 제11권4호
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• pp.152-157
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• 2007

본 연구에서는 AlGaN/GaN HEMT (High electron mobility transistor)를 제작하고 20 mTorr의 챔버 압력과 15 sccm의 ${N_2}O$ 유량, 40 W의 RF 전력의 조건으로 원거리에서 형성된 플라즈마로 소스와 드레인 영역을 10초${\sim}$120초 동안 처리하여 HEMT의 전기적 특성을 관찰하였다. 상온에서 ${N_2}O$ 플라즈마에 처리한 경우 HEMT의 특성이 변화하지 않았으나 $200^{\circ}C$의 온도에서 10초 동안 처리한 경우 게이트 길이가 1um, 소스와 드레인 사이의 거리가 4um인 HEMT의 게이트 누설전류가 246 nA로부터 1.2 pA로 크게 감소하였다. 또한 25 um 떨어진 200um 폭의 두 활성층 사이 누설전류가 3 uA로부터 7 nA로 감소하였으며 720 ${\Omega}/{\box}$의 활성층의 면저항을 608 ${\Omega}/{\box}$로 감소시켜 도전율의 증가를 나타내기도 하였다. ${N_2}O$ 플라즈마의 처리에 의한 전기적 특성 개선은 10초 이내의 짧은 시간 동안 이루어지며 더 이상의 처리는 누설전류 특성 개선에 도움이 되지 않았다. 또한 ${N_2}O$ 플라즈마 처리로 개선된 특성은 $SiO_2$의 증착과 식각 후에도 개선된 특성이 유지되었다. ${N_2}O$ 플라즈마의 처리는 트랜지스터의 트랜스컨덕턴스와 드레인 전류의 증가, 드레인 전류의 차단특성의 개선에도 기여하여 고품위의 AlGaN/GaN HEMT 제작에 효과적으로 이용될 수 있음이 확인되었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.391-392
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• 2012

In these days, the desire for the precise and tiny displays in mobile application has been increased strongly. Currently, laser displays ranging from large-size laser TV to mobile projectors, are commercially available or due to appear on the market [1]. In order to achieve a mobile projectors, the semiconductor laser diodes should be used as a laser source due to their size and weight. In this presentation, the continuous etch characteristics of Pd and AlGaN/GaN superlattice for the fabrication of blue laser diodes were investigated by using inductively coupled $CHF_3$ and $Cl_2$ -based plasma. The GaN laser diode samples were grown on the sapphire (0001) substrate using a metal organic chemical vapor deposition system. A Si-doped GaN layer was grown on the substrate, followed by growth of LD structures, including the active layers of InGaN/GaN quantum well and barriers layer, as shown in other literature [2], and the palladium was used as a p-type ohmic contact metal. The etch rate of AlGaN/GaN superlattice (2.5/2.5 nm for 100 periods) and n-GaN by using $Cl_2$ (90%)/Ar (10%) and $Cl_2$ (50%)/$CHF_3$ (50%) plasma chemistry, respectively. While when the $Cl_2$/Ar plasma were used, the etch rate of AlGaN/GaN superlattice shows a similar etch rate as that of n-GaN, the $Cl_2/CHF_3$ plasma shows decreased etch rate, compared with that of $Cl_2$/Ar plasma, especially for AlGaN/GaN superlattice. Furthermore, it was also found that the Pd which is deposited on top of the superlattice couldn't be etched with $Cl_2$/Ar plasma. It was indicating that the etching step should be separated into 2 steps for the Pd etching and the superlattice etching, respectively. The etched surface of stacked Pd/superlattice as a result of 2-step etching process including Pd etching ($Cl_2/CHF_3$) and SLs ($Cl_2$/Ar) etching, respectively. EDX results shows that the etched surface is a GaN waveguide free from the Al, indicating the SLs were fully removed by etching. Furthermore, the optical and electrical properties will be also investigated in this presentation. In summary, Pd/AlGaN/GaN SLs were successfully etched exploiting noble 2-step etching processes.

• Transactions on Electrical and Electronic Materials
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• 제11권2호
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• pp.49-53
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• 2010

Microstructural origins of leakage current and physical degradation during operation in product-quality AlGaN/GaN high electron mobility transistor (HEMT) devices were investigated using photon emission microscopy (PEM) and transmission electron microscopy (TEM). AlGaN/GaN HEMTs were fabricated with metal organic chemical vapor deposition on semi-insulating SiC substrates. Photon emission irregularity, which is indicative of gate leakage current, was measured by PEM. Site specific TEM analysis assisted by a focused ion beam revealed the presence of threading dislocations in the channel below the gate at the position showing strong photon emissions. Observation of electrically degraded devices after life tests revealed crack/pit shaped defects next to the drain in the top AlGaN layer. The morphology of the defects was three-dimensionally investigated via electron tomography.

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권3호
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• pp.354-362
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• 2017

We investigated the improvement in electrical characteristics of large AlGaN/GaN on Si Schottky barrier diode (SBD) induced by structural change to achieve a better trade-off between the forward and reverse performance to obtain high power conversion efficiency in PFC converter. Using an optimized dry etch condition for a large device, we fabricated three-types of SBD with 63 mm channel width: conventional, recessed, recessed dual-anode-metal SBD. The recessed dual-anode-metal SBD exhibited a very low turn-on voltage of 0.34 V, a high forward current of 1.63 A at 1.5 V, a leakage current of $114{\mu}A$ at -15 V, a breakdown voltage of 794 V.

• 한국광학회지
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• 제16권3호
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• pp.275-286
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• 2005

InGaN LED에서 칩 구조 및 칩마운트 구조에 따른 광추출효율의 변화를 Monte Calo 기법을 이용하여 해석하였다. Simulation을 통해 얻은 중요한 결론의 하나는, InGaAlP 또는 InGaN/SiC LED의 경우에서는 달리, InGaN/sapphire LED의 경우 칩의 측 벽면 기울임 기법의 광추출효율 개선효과가 상대적으로 미미하다는 점이다. InGaN/SiC LED의 경우와는 달리, 기판으로 사용되는 sapphire의 굴절률이 상대적으로 작아서 생성된 광자들이 기판으로 넘어가는데 전반사장벽을 만나게 되어, 많은 광자들이 기판으로 넘어가지 못하고 두께가 매우 얇은 반도체 결정층에 갇히는 현상 때문이다. 동일한 현상은 epi-down 구조의 칩 마운트에서 광추출효율이 크게 개선되지 못하는 원인으로도 작용하게 된다. 광추출효율 관점에서의 epi-down 구조의 InGaN/sapphire LED가 갖고 있는 잠재력을 살리기 위한 방법의 하나는 기판-에피택시 계면을 texturing 하는 것이라고 할 수 있는데, 이 경우 생성된 광자들이 다량기판으로 넘어갈 수 있게 되어 광추출효율이 현저하게 개선된다.

• 한국재료학회지
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• 제9권5호
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• pp.460-466
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• 1999

The deep level electron traps in AP-MOCVD GaAs/undoped Al\ulcornerGa\ulcornerAs/n-type GaAs heterostructures have been investigated by means of Deep Level Transient Spectroscopy DLTS). In terms of the experimental procedure, GaAs/undoped Al\ulcornerGa\ulcornerAs/n-type GaAs heterostructures were deposited on 2" undoped semi-insulating GaAs wafers by the AP-MOCVD method at $650^{\circ}C$ with TMGa, AsH3, TMAl, and SiH4 gases. The n-type GaAs conduction layers were doped with Si to the target concentration of about 2$\times$10\ulcornercm\ulcorner. The Al content was targeted to x=0.5 and the thicknesses of Al\ulcornerGa\ulcornerAs layers were targeted from 0 to 40 nm. In order to investigate the electrical characteristics, an array of Schottky diodes was built on the heterostructures by the lift-off process and Al thermal evaporation. Among the key results of this experiment, the deep level electron traps at 0.742~0.777 eV and 0.359~0.680 eV were observed in the heterostructures; however, only a 0.787 eV level was detected in n-type GaAs samples without the Al\ulcornerGa\ulcornerAs overlayer. It may be concluded that the 0.787 eV level is an EL2 level and that the 0.742~0.777 eV levels are related to EL2 and residual oxygen impurities which are usually found in MOCVD GaAs and Al\ulcornerGa\ulcornerAs materials grown at $630~660^{\circ}C$. The 0.359~0.680 eV levels may be due to the defects related with the al-O complex and residual Si impurities which are also usually known to exist in the MOCVD materials. Particularly, as the Si doping concentration in the n-type GaAs layer increased, the electron trap concentrations in the heterostructure materials and the magnitude of the C-V hysteresis in the Schottky diodes also increased, indicating that all are intimately related.ated.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.292-292
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• 2014

Wide band gap semiconductors, such as III-nitrides (GaN, AlN, InN, and their alloys), SiC, and diamond are expected to play an important role in the next-generation electronic devices. Specifically, GaN-based high electron mobility transistors (HEMTs) have been targeted for high power, high frequency, and high temperature operation electronic devices for mobile communication systems, radars, and power electronics because of their high critical breakdown fields, high saturation velocities, and high thermal conductivities. For the stable operation, high power, high frequency and high breakdown voltage and high current density, the fabrication methods have to be optimized with considerable attention. In this study, low ohmic contact resistance and smooth surface morphology to AlGaN/GaN on 2 inch c-plane sapphire substrate has been obtained with stepwise annealing at three different temperatures. The metallization was performed under deposition of a composite metal layer of Ti/Al/Ni/Au with thickness. After multi-layer metal stacking, rapid thermal annealing (RTA) process was applied with stepwise annealing temperature program profile. As results, we obtained a minimum specific contact resistance of $1.6{\times}10^{-7}{\Omega}cm2$.

• 전자공학회논문지
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• 제51권2호
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• pp.33-37
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• 2014

본 논문에서는 AlGaN/GaN HFET의 누설전류 특성을 개선하고자 산화갈륨 희생층 공정을 이용한 새로운 패시베이션 공정을 제안하였다. 오믹 전극 형성시 고온 열처리 과정으로 인해 갈륨의 표면 손상이 불가피하다. 표면 손상을 방지하기 위해 보편적으로 선표면처리 공정을 사용하기도 하지만 이러한 방법만으로는 표면 손상을 완전히 없애기 어렵다. 본 연구에서 새롭게 제안된 산화갈륨 희생층을 이용한 공정 방법은 고온 열처리 후 손상된 표면에 $O_2$ 플라즈마 처리를 통해 산화갈륨층을 형성한 뒤, 염화수소를 이용하여 산화갈륨층을 식각한다. 우수한 상태의 표면 상태를 얻을 수 있었으며, 누설전류의 확연한 감소로 subthreshold slope이 개선되었을 뿐만 아니라 최대 드레인 전류 특성도 594 mA/mm에서 634 mA/mm로 증가하였다. 질화갈륨 희생층 공정의 효과를 분석하기 위해 X-선 광전자 분광법을 이용하여 질화갈륨의 표면 변화에 대해 살펴보았다.

• Transactions on Electrical and Electronic Materials
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• 제14권1호
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• pp.32-35
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• 2013

In this paper, a manufacturing process was developed for fabricating high-quality AlGaN/GaN high electron mobility transistors (HEMTs) on silicon carbide (SiC) substrates. Various conditions and processing methods regarding the ohmic contact and pre-metal-deposition $BCl_3$ etching processes were evaluated in terms of the device performance. In order to obtain a good ohmic contact performance, we tested a Ti/Al/Ta/Au ohmic contact metallization scheme under different rapid thermal annealing (RTA) temperature and time. A $BCl_3$-based reactive-ion etching (RIE) method was performed before the ohmic metallization, since this approach was shown to produce a better ohmic contact compared to the as-fabricated HEMTs. A HEMT with a 0.5 ${\mu}m$ gate length was fabricated using this novel manufacturing process, which exhibits a maximum drain current density of 720 mA/mm and a peak transconductance of 235 mS/mm. The X-band output power density was 6.4 W/mm with a 53% power added efficiency (PAE).