• 한국전기전자재료학회논문지
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• 제22권8호
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• pp.654-658
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• 2009

For investigation of surface leakage currrent of AlGaN/GaN heterostructures through etched GaN buffer surface and mesa wall, three kind of surface-leakage-test-patterns were fabricated. and we measured the surface leakage current of each patterns. In result of our work, the surface leakage current of pattern of which Schottky contact is formed on etched mesa wall is the largest. the leakage current through schottky contact on etched mesa wall is predominant in AlGaN/GaN heterostructures.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 춘계학술대회 논문집
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• pp.89-90
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• 2009

Three kind of surface-leakage-test-patterns were fabricated and measured in order to investigate the surface leakage current of AlGaN/GaN heterostructures through etched GaN buffer surface and mesa wall. The pattern which contain the mesa wall has the largest surface leakage current among them. The leakage current due to the mesa wall is predominant source of the leakage current of AlGaN/GaN devices.

• JSTS:Journal of Semiconductor Technology and Science
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• 제3권2호
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• pp.96-101
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• 2003

Direct evidence on the incorporation of high concentration of oxygen into undoped AlGaN layers for the AlGaN/GaN heterostuctures is provided by scanning photoemission microscopy using synchrotron radiation. In-situ annealing at $1000^{\circ}C$ resulted in a significant increase in the oxygen concentration at the AlGaN surface due to the predominant formation of Al-O bonds. The oxygen incorporation into the AlGaN layers resulting from the high reactivity of Al to oxygen can enhance the tunneling-assisted transport of electrons at the metal/AlGaN interface, leading to the reduction of the Schottky barrier height and the increase of the sheet carrier concentration near the AlGaN/GaN interface.

• 한국재료학회지
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• 제9권5호
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• pp.460-466
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• 1999

The deep level electron traps in AP-MOCVD GaAs/undoped Al\ulcornerGa\ulcornerAs/n-type GaAs heterostructures have been investigated by means of Deep Level Transient Spectroscopy DLTS). In terms of the experimental procedure, GaAs/undoped Al\ulcornerGa\ulcornerAs/n-type GaAs heterostructures were deposited on 2" undoped semi-insulating GaAs wafers by the AP-MOCVD method at $650^{\circ}C$ with TMGa, AsH3, TMAl, and SiH4 gases. The n-type GaAs conduction layers were doped with Si to the target concentration of about 2$\times$10\ulcornercm\ulcorner. The Al content was targeted to x=0.5 and the thicknesses of Al\ulcornerGa\ulcornerAs layers were targeted from 0 to 40 nm. In order to investigate the electrical characteristics, an array of Schottky diodes was built on the heterostructures by the lift-off process and Al thermal evaporation. Among the key results of this experiment, the deep level electron traps at 0.742~0.777 eV and 0.359~0.680 eV were observed in the heterostructures; however, only a 0.787 eV level was detected in n-type GaAs samples without the Al\ulcornerGa\ulcornerAs overlayer. It may be concluded that the 0.787 eV level is an EL2 level and that the 0.742~0.777 eV levels are related to EL2 and residual oxygen impurities which are usually found in MOCVD GaAs and Al\ulcornerGa\ulcornerAs materials grown at $630~660^{\circ}C$. The 0.359~0.680 eV levels may be due to the defects related with the al-O complex and residual Si impurities which are also usually known to exist in the MOCVD materials. Particularly, as the Si doping concentration in the n-type GaAs layer increased, the electron trap concentrations in the heterostructure materials and the magnitude of the C-V hysteresis in the Schottky diodes also increased, indicating that all are intimately related.ated.

• 한국전기전자재료학회논문지
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• 제15권7호
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• pp.591-596
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• 2002

In this work, epitaxial GaN is grown on sapphire substrate in AlGaN/GaN heterostructures. Deliberate oxygen doping of GaN grown by MOVPE has been studied. The electron concentration increased as a function of the square root of the oxygen partial Pressure. Oxygen is a shallow donor with a thermal ionization energy of $27\pm2 meV$ measured by temperature dependent Hall effects. A compensation ratio of $\theta$=0.3~0.4 was determined from Hall effect measurements. The formation energy of $O_N$ of $E^F$ =1.3eV determined from the experimental data, is lower than the theoretically predicted vague.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.23-23
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• 2009

GaN-based nitride semiconductors have attracted considerable attention in high-brightness light-emitting-diodes (LEDs) and laser diodes (LDs) covering from green to ultraviolet spectral range. LED and LD heterostructures are usually grown on (0001)-$Al_2O_3$. The large lattice mismatch between $Al_2O_3$ substrates and the GaN layers leads to a high density of defects(dislocations and stacking faults). Moreover, Ga and N atoms are arranged along the polar [0001] crystallographic direction, which leads to spontaneous polarization. In addition, in the InGaN/GaN MQWs heterostructures, stress applied along the same axis can also give rise to piezoelectric polarization. The total polarization, which is the sum of spontaneous and piezoelectric polarizations, is aligned along the [0001] direction of the wurtzite heterostructures. The change in the total polarization across the heterolayers results in high interface charge densities and spatial separation of the electron and hole wave functions, redshifting the photoluminescence peak and decreasing the peak intensity. The effect of polarization charges in the GaN-based heterostructures can be eliminated by growing along the non-polar [$11\bar{2}0$] (a-axis) or [$1\bar{1}00$] (m-axis) orientation instead of thecommonly used polar [0001] (c-axis). For non-polar GaN growth on non-polar substrates, the GaN films have high density of planar defects (basal stacking fault BSFs, prismatic stacking fault PSFs), because the SFs are formed on the basal plane (c-plane) due to their low formation energy. A significant reduction in defect density was recently achieved by applying blocking layer such as SiN, AlN, and AlGaN in non-polar GaN. In this work, we were performed systematic studies of the defects in the nonpolar GaN by conventional and high-resolution transmission electron microscopy.

• 한국진공학회지
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• 제17권1호
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• pp.34-39
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• 2008

저온에서 성장된 AlN (LT-AlN)층이 삽입된 $Al_xGa_{1-x}N/LT$-AlN/GaN 이종접합 구조를 금속유기 화학기상 증착법 (metal-organic chemical vapor deposition)을 사용하여 사파이어 기판 위에 제작하였다. Rutherford backscattering spectroscopy 실험을 통하여 $Al_xGa_{1-x}N$층의 Al의 조성비 x가 55% 임을 확인하였고, X-선 역격자 공간 mapping을 통하여 층간 변형력을 조사하였다. LT-AlN층의 삽입 여하에 따른 $Al_{0.55}Ga_{0.45}N$ 층의 깨짐 현상을 광학현미경과 주사전자현미경을 통하여 조사하였는데, LT-AlN 층이 삽입된 시료의 경우에 깨짐 현상이 현저히 줄어든 $Al_{0.55}Ga_{0.45}N$ 층을 얻을 수 있었다. 뿐만 아니라 LT-AlN 층이 삽입된 $Al_{0.55}Ga_{0.45}N$/LT-AlN/GaN 이종접합 구조에 대하여 이차원 전자가스 (two-dimensional electron gas, 2DEG) 관련된 photoluminescence (PL) 신호를 관찰하였다. 이 시료에 대하여 온도 변화에 따른 PL 실험을 수행하여 100 K 근방까지 2DEG 관련된 PL 신호를 관찰하였다. 여기광 세기에 따른 PL 실험을 통하여 ~3.411 eV에서 나타난 2DEG PL 신호와 함께 ${\sim}3.437eV$에서도 PL 신호가 관측되었는데, 이는 AlGaN/LT-AlN/GaN 계면에 형성된 2DEG 버금띠와 Fermi 에너지 준위에서의 재결합 특성으로 각각 해석되었다.

• 한국진공학회지
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• 제17권4호
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• pp.359-364
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• 2008

금속 유기화학 증착기 (metal-organic chemical vapor deposition)를 이용하여 사파이어 기판 위에 $Al_{0.3}Ga_{0.7}N$/GaN 및 $Al_{0.3}Ga_{0.7}N/GaN/Al_{0.15}Ga_{0.85}N/GaN$ 이종접합 구조들을 성장하고, 이들 시료의 전자와 정공들 간의 구속 효과를 조사하기 위하여 광학적, 구조적 특성을 비교하였다. 저온 (10 K) photoluminescence 실험으로부터 $Al_{0.3}Ga_{0.7}N$/GaN 단일 이종접합 구조의 경우 3.445 eV에서 단일의 이차원 전자가스 (two-dimensional electron gas; 2DEG) 관련된 발광을 관찰한 반면, $Al_{0.3}Ga_{0.7}N/GaN/Al_{0.15}Ga_{0.85}N/GaN$ 다중 이종접합 구조의 경우 3.445 eV에서 뿐만 아니라, 3.42 eV에서 추가적인 2DEG 관련된 발광을 관찰 할 수 있었다. 이 두 개의 2DEG 관련 신호들의 근원을 조사하기 위하여 $Al_{0.3}Ga_{0.7}N/GaN/Al_{0.15}Ga_{0.85}N/GaN$ 다중 이종접합구조에서의 에너지 밴드 구조를 이론적으로 계산하여 실험과 비교한 결과, 하나의 2DEG에 의한 서로 다른 버금띠로 부터가 아닌 다중 구조에 형성된 두 개의 2DEG로부터의 신호로 해석되었다.

• Electronic Materials Letters
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• 제14권6호
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• pp.784-792
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• 2018

In this letter, a standard deviation based optimization technique has been applied on High Resolution X-ray Diffraction symmetric and asymmetric scan results to accurately determine the Aluminum molar fraction and lattice relaxation of Molecular Beam Epitaxy grown compositionally graded Aluminum Gallium Nitride (AlGaN)/Aluminum Nitride/Gallium Nitride (GaN) heterostructures. Mathews-Blakeslee critical thickness model has been applied in an alternative way to determine the partially relaxed AlGaN epilayer thicknesses. The coupling coefficient determination has been presented in a different perspective involving sample tilt method by off set between the asymmetric planes of GaN and AlGaN. Sample tilt is further increased to determine mosaic tilt ranging between $0.01^{\circ}$ and $0.1^{\circ}$.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2006년도 제31회 학술논문발표회 초록집
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• pp.155-155
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• 2006