• Electrical & Electronic Materials
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• v.9 no.2
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• pp.188-195
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• 1996

The AlSi etching process using the MERIE type reactor carried out with different process parameters such as C1$_{2}$ and N$_{2}$ gas flow rate, RF power and chamber pressure. The etching characteristics were evaluated in terms of etch rate, selectivity, uniformity and etched profile. As the N2 gas flow rate is increased, the AlSi etch rate is decreased and uniformity has remained constant within .+-.5%. The etch rate is increased and uniformity is decreased, according to increment of the C1$_{2}$ gas flow rate, RF power and chamber pressure. Selective etching of TEOS with respect to AlSi is decreased as the RF power is increased while it is increased by increment of the C1$_{2}$ gas flow rate and chamber pressure, on the other hand, selective etching of photoresist with respect to AlSi is increased by increment of the C1$_{2}$ gas flow rate and chamber pressure, it is decreased as the N$_{2}$ gas flow rate is increased.

• Journal of the Korean Ceramic Society
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• v.30 no.4
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• pp.309-315
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• 1993

Gas pressure sintering is a promising process in various densification methods of high strength Si3N4 ceramics. Environmental influences on gas pressure sintering of Si3N4 was investigated with the variationof packing powder, specimen container and N2 gas pressure. The specimens had higher density, larger weight loss and inhomogeneous color in graphite specimen container than in SN26 crucible. The variations of sintering densities in various packing powders (Si3N4, SN26, AlN, BN) were very small but SiC powder was synthesised in graphite crucible with Si3N4 packing powder, aluminium oxynitride compounds were synthesised in SN26 crucible with AlN packing power. Also N2 gas pressure over 20kg/$\textrm{cm}^2$ reduced the densification of Si3N4 in one step-gas pressure sintering. As the result of two step-gas pressure sintering at 700kg/$\textrm{cm}^2$ for 15min., relative density of 99.9% and 3-point bending strength of 1090MPa and dense microstructure of 3~4${\mu}{\textrm}{m}$ grain size were obtained.

• Journal of the Korean Ceramic Society
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• v.54 no.4
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• pp.292-297
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• 2017

${\beta}-SiAlON$, based on its high fracture toughness, good strength and low abrasion resistance, has been adopted in several industrial fields such as bearings, turbine blades and non-ferrous metal refractories. In general, ${\beta}-SiAlON$ is fabricated by reactive sintering using expensive $Si_3N_4$ and AlN as starting materials. On the other hand, in this study, a cheaper ${\beta}-SiAlON$ starting powder synthesized by SHS was employed to improve price competitiveness compared to that of the reactive sintering process. ${\beta}-SiAlON$ ceramics with various content of the sintering additive $Y_2O_3$ up to 7 wt% were fabricated by conventional pressureless sintering at $1800^{\circ}C$ for 2 to 8 h under $N_2$ pressure of 0.1 MPa. The specimen with 3 wt% $Y_2O_3$ exhibited the best mechanical properties: hardness of 14 GPa, biaxial strength of 830 MPa, fracture toughness of $5MPa{\cdot}m^{1/2}$ and wear rate of about $3{\times}10^{-6}mm^3/N{\cdot}m$.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.99-99
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• 2003

The growth of GaN on Si is of great interest due to the several advantages : low cost, large size and high-quality wafer availability as well as its matured technology. The crystal quality of GaN is known to be much influenced by the surface pretreatment of Si substrate[1]. In this work, the properties of GaN overlayer grown on ion beam modified Si(111) have been investigated. Si(111) surface was treated RIB with 1KeV-N$_2$$\^$+/(at 1.9 ${\times}$ 10$\^$-5/) to dose ranging from 5${\times}$10$\^$15/ to 1${\times}$10$\^$17/ prior to film growth. GaN epilayers were grown at 1100$^{\circ}C$ for 1 hour after growing AlN buffer layers for 5∼30 minutes at 1100$^{\circ}C$ in Metal Organic Chemical Vapor Deposition (MOCVD). The properties of GaN epilayers were evaluated by X-Ray Diffraction(XRD), Raman spectroscopy, Photoluminescence(PL) and Hall measurement. The results showed that the ion modified treatment markedly affected to the structural, optical and electrical characteristic of GaN layers.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1577-1579
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• 2003

AlN thin films are prepared on Si (111) substrate by RF magnetron sputtering. Two-step deposition method is proposed to obtain AlN thin films with high c-axis (002)-TC value and low surface roughnesses. For all the deposited AlN films, the c-axis (002)-orientation, surface mophology, and roughness are characterized in terms of deposition conditions FEAR devices with Al/AlN/Mo/Si(111) configuration are also fabricated. From the frequency response characteristics, the return loss and electromechanical coupling contant($k_t{^2}$) are estimated.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.396-396
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• 2012

산업 분야에서 TiN, CrN, CrAl-N, TiAl-N과 같은 Hard 코팅들은 기계적 특성이 우수하여 절삭 공구, 기계 부품분야에서 많이 사용되고 있다. 최근 연구 동향을 살펴보면 기존에 하나 또는 두가지 합금상태의 Hard 코팅을 넘어서 제3원소, 제4원소를 첨가하여 미세 구조적 변화를 통해 기존의 우수한 특성에 고온안정성, 내식성, 내산화성 등 다양한 기능성을 부여하는 다기능성 연구가 활발히 진행 중이다. 본 연구에서는 마그네트론 스퍼터를 이용하여 고경도 코팅인 Ti-Al계열에 Si, Cu, Cr, B을 첨가함에 따른 내식특성을 확인해보았다. 성분이 균일한 코팅을 만들기 위해 Ti-Al, Ti-Al-Si, Ti-Al-Cu, Ti-Al-Cr, Ti-Al-B 단일합금타겟을 제조하여 실험을 진행하였다. 기본 물성을 확인하기 위해 경도 측정과 SEM XRD 등을 분석하였다. 내식성 평가는 동전위 테스트와 염수분무 테스트를 진행하였고 전해질은 염수와 동일한 5%-NaCl로 진행하였다. 그 결과 Ti-Al-Cr이 내식성에 강한 것으로 나타났고 염수분무 실험에서도 1200시간 이상 지속되는 성과를 보였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.105-108
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• 1998

Pt-WO$_3$-Si$_3$N$_4$-SiO$_2$-Si-Al 캐패시터를 이용한 NO$_2$ 가스 센서를 개발하였다. 표준 실리콘 MNOS구조에 촉매 게이트로 Pt와 가스 흡착층으로 WO$_3$를 이용함으로서 전통적인 세라믹 가스 센서보다 낮은 온도에서 NO$_2$ 가스를 감지할 수 있었다. 은도 변화와 NO$_2$ 가스 농도의 변화에 따라서 디바이스의 NO$_2$ 가스 감도를 조사하였다. Pt-WO$_3$ 계면에서 NO$_2$ 이온농도의 변화에 기초로 한 가스 감지 모델을 제시하였다. 제시된 가스 감지 모델을 계면에서의 가스 반응 속도론에 의하여 분석함으로서 확인하였다.

• Journal of the Semiconductor & Display Technology
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• v.12 no.3
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• pp.47-51
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• 2013

Current research trends of solar cells has focused on the high conversion efficiency and low-cost production technology. Passivation technology that can be easily adapted to mass production. Therefore, this study conducted experiments with aim of the following two methods for the fabrication of high-efficiency crystalline silicon solar cells. In the first task, an attempt is formation of local Al-BSF to a number of locally doped dots to increase the conversion efficiency of solar cells to reduce the loss of $V_{oc}$ overcome. The second major task, rear surface apply in $Al_2O_3/SiN_x$ stack layer, $Al_2O_3$ prominent negative fixed charge characteristics. As the result of task, Local Al-BSF and $Al_2O_3/SiN_x$ stack layer applied to the p-type single crystalline silicon solar cells, the average $V_{oc}$ of 644mV, $I_{sc}$ of 918mV and conversion efficiency of 18.70% were obtained.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.135-140
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• 2003

The difference in lattice parameter and thermal expansion coefficient between GaN and Si which results in many defects into the grown GaN is larger than that between GaN and sapphire. In order to obtain high quality GaN films on Si substrate, it is essential to understand growth characteristics of GaN. In this study, GaN layers were grown on Si(111) substrates by MOCVD at three different GaN growth temperatures ($900^{\circ}C$, $1,000^{\circ}C$ and $1,100^{\circ}C$), using AlN and LT-GaN buffer layers. Using TEM, we carried out the comparative investigation of growth characteristics of GaN by characterizing lattice coherency, crystallinity, orientation relationship and defects formed (transition region, stacking fault, dislocation, etc). The localized region with high defect density was formed due to the lattice mismatch between AlN buffer layer and GaN. As the growth temperature of GaN increases, the defect density and surface roughness of GaN are decreased. In the case of GaN grown at $1,100^{\circ}$, growth thickness is decreased, and columns with out-plane misorientation are formed.

• Journal of the Korean Ceramic Society
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• v.35 no.3
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• pp.303-309
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• 1998

The fabrication of Al2O3/Al composite by pressureless infiltration was investigated by the change of Mg and Si content in Al alloy infiltration process and infiltration atmosphere. The effect of alloying elements infiltration atmosphere and interfacial reactants between Al alloy matrix and Al2O3 particles were in-vestigated in terms of bendingstrength and harness test,. The fabrication of Al2O3/Al composite by the vestigated in terms of bending strength and hardness test. The fabrication of Al2O3/Al composite by the pressureless infiltration was done in nitrogen atmosphere with Mg in Al alloy. It was successfully fabricated at $700^{\circ}C$ according to Mg contents in Al alloy and infiltration condition. Because Mg in the Al alloy and ni-trogen atmosphere of infiltratio condition produced Mg-N compound(Mg3N2) it decreased the wetting an-gle between molten Al alloy and Al2O3 particles by coating on surface of Al2O3 particles. The fracture strength of Al2O3/Al-Mg composite was 800MPa and Al2O3/Al-Si-Mg composite was 400MPa. Si in Al alloy decreased the interfacial strength between Al alloy matrix and Al2O3 particles.