• Bulletin of the Korean Chemical Society
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• 제11권1호
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• pp.1-7
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• 1990

We present a theoretical investigation on the etching of an Al solid by $SiCl_4$ molecules at a collision energy of 600 eV. The classical trajectory method is employed to calculate Al etching yields, degree of anisotropy, kinetic energy distribution and angular distribution. The calculated results are compared with the reaction of a Cu solid by $SiCl_4$. The major products of the reaction are aluminum monomers and dimers together with considerable quantities of multimers. The Al solid shows better etching yield and better anisotropy than the Cu solid. This is consistent with the problem in the CMOS micro-fabrication of the CuAl and CuAlSi alloys. The relevance of these calculations for the dry etching of CuAl alloy is discussed.

• 한국주조공학회지
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• 제24권1호
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• pp.45-51
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• 2004

Fe and Si are common impurity elements in the aluminum alloys. In this investigation, the effects of the addition of Fe and Si on the age-hardening behaviors of the Al-Cu-Mn-Ti-Zr-Cd casting alloys were examined through hardness measurements, calorimetric techniques and observation of the transmission electron microscopy. The addition of Fe depresses the formation of GPII and ${\theta}'$, and thus retards the peak aging time and reduces the peak hardness of the Al-Cu-Mn-Ti-Zr-Cd alloys. On the contrary, the addition of Si accelerates the formation of GPII and ${\theta}'$ and thus accelerates age-hardening behaviors of the Al-Cu-Mn-Ti-Zr-Cd alloys.

• 한국분말재료학회지
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• 제11권2호
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• pp.171-178
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• 2004

Effects of liquid phase and reinforcing particle morphology on the sintering of Al-6 wt％Cu-10 vol％ $Al_2O_3$ or SiC particles were studied in regards to densification, structure and transverse rupture properties. The Al-Cu liquid phase penetrated the boundaries between the aluminum matrix powders and the interfaces with reinforcing particles as well, indicating a good wettability to the powders. This enhanced the densification during sintering and the resulting strength and ductility. Since most of the copper added, however, was dissolved in the liquid phase and formed a brittle $CuAl_2$ phase upon cooling rather than alloyed with the aluminum matrix, the strengthening effect by the copper was not fully realized. Reinforcing particles of agglomerate type were found less suitable for the liquid phase sintering than solid type particles. $Al_2O_3$ and SiC particles protluced little difference on the sintering behavior but their size had a large effect. Repressing of the sintered composites increased density and bending properties but caused debonding at the matrix-particle interfaces and also fracturing of the particles.

• E2M - 전기 전자와 첨단 소재
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• 제9권3호
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• pp.291-297
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• 1996

The surface properties of AI(Si, Cu) alloy film after plasma etching using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched AI(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxidized (partially chlorinated) states, copper shows Cu metallic states and Cu-Cl$_{x}$(x$_{x}$ (x$_{x}$ (1

• 한국표면공학회지
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• 제56권5호
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• pp.335-340
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• 2023

Quinary component of 3㎛ thick Ti-Al-Si-Cu-N films were deposited onto WC-Co and Si wafer substrates by using an arc ion plating(AIP) system. In this study, the influence of copper(Cu) contents on the mechanical properties and microstructure of the films were investigated. The hardness of the films with 3.1 at.% Cu addition exhibited the hardness value of above 42 GPa due to the microstructural change as well as the solid-solution hardening. The instrumental analyses revealed that the deposited film with Cu content of 3.1 at.% was a nano-composites with nano-sized crystallites (5-7 nm in dia.) and a thin layer of amorphous Si₃N₄ phase.

• 대한금속재료학회지
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• 제48권3호
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• pp.248-255
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• 2010

The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.

• 한국재료학회지
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• 제24권10호
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• pp.538-542
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• 2014

Microstructural and mechanical characteristics of Al-6Si-2Cu alloy for lightweight automotive parts were investigated. The test specimens were prepared by gravity casting process. Solution heat treatments were applied to as-cast alloys to improve mechanical properties. The microstructure of the gravity casting specimen presents a typical dendrite structure, having a secondary dendrite arm spacing (SDAS) of $37{\mu}m$. In addition to the Al matrix, a large amount of coarsened eutectic Si, $Al_2Cu$ intermetallic phase, and Fe-rich phases were identified. After solution heat treatment, single-step solution heat treatments were found to considerably improve the spheroidization of the eutectic Si phase. Two-step solution treatments gave rise to a much improved spheroidization. The mechanical properties of the two-step solution heat treated alloy have been shown to lead to higher values of properties such as tensile strength and microhardness. Consequentially, the microstructural and mechanical characteristics of Al alloy have been successfully characterized and are available for use with other basic data for the development of lightweight automotive parts.

• 한국대기환경학회지
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• 제20권3호
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• pp.291-302
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• 2004

The CuO/$3AL_2O_3{\cdot}2SiO_2$ catalyst impregnated ceramic candle filters for nitrogen oxides removal were prepared by porous mullite($3AL_2O_3{\cdot}2SiO_2$) support and CuO catalyst deposited on this support to achieve uniformly dispersed CuO deposition, which are impregnated into the pores of available alumino-silicate ceramic candle filter. The CuO/3$AL_2O_3{\cdot}2SiO_2$ catalyst impregnated ceramic candle filters were characterized by XRD, BET, air permeability, pore size, SEM and catalytic tests in the reduction of NOx by NH$_3$. The observed effects of CuO/3$AL_2O_3{\cdot}2SiO_2$ impregnated ceramic candle filters in SCR reaction are as follows : (1) when the content of CuO catalyst increased further, activity of NO increased. (2) NO conversion at first increased with temperature and then decreased at high temperatures (above 40$0^{\circ}C$), possibly due to the occurrence of the ammonia oxidation reaction. (3) In pilot plant test for 3 months, NO conversion was greater than 90%.

• 열처리공학회지
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• 제31권6호
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• pp.300-306
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• 2018

In the present study we proposed new equations to predict the liquidus temperature curve for hypoeutectic Al-Si-Cu-Mg alloy. A thermodynamic simulation was carried out to calculate the liquidus temperature, eutectic temperature and eutectic Si concentration with different Si, Cu, and Mg contents in hypoeutectic Al-Si alloys. Regressed equations were derived using the thermodynamic simulation results by multiple regression analysis. The proposed equations were compared with the equations reported previously by other researchers and agreed better with the experimental data. The addition of Cu and Mg lowered the eutectic temperature. The eutectic Si concentration was decreased by adding Cu whereas that was increased by adding Mg. Al-Si binary phase diagram was successfully predicted with a consideration of the effect of Cu and Mg addition by using the proposed equations.

• 마이크로전자및패키징학회지
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• 제23권2호
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• pp.49-55
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• 2016

차세대 반도체의 초미세 Cu 배선 확산방지층 적용을 위해 원자층증착법(atomic layer deposition, ALD) 공정을 이용하여 증착한 RuAlO 확산방지층과 Cu 박막 계면의 계면접착에너지를 정량적으로 측정하였고, 환경 신뢰성 평가를 수행하였다. 접합 직후 4점굽힘시험으로 평가된 계면접착에너지는 약 $7.60J/m^2$으로 측정되었다. $85^{\circ}C$/85% 상대습도의 고온고습조건에서 500시간이 지난 후 측정된 계면접착에너지는 $5.65J/m^2$로 감소하였으나, $200^{\circ}C$에서 500시간 동안 후속 열처리한 후에는 $24.05J/m^2$으로 계면접착에너지가 크게 증가한 것으로 평가되었다. 4점굽힘시험 후 박리된 계면은 접합 직후와 고온고습조건의 시편의 경우 RuAlO/$SiO_2$ 계면이었고, 500시간 후속 열처리 조건에서는 Cu/RuAlO 계면인 것으로 확인되었다. X-선 광전자 분광법 분석 결과, 고온고습조건에서는 흡습으로 인하여 강한 Al-O-Si 계면 결합이 부분적으로 분리되어 계면접착에너지가 약간 낮아진 반면, 적절한 후속 열처리 조건에서는 효과적인 산소의 계면 유입으로 인하여 강한 Al-O-Si 결합이 크게 증가하여 계면접착에너지도 크게 증가한 것으로 판단된다. 따라서, ALD Ru 확산방지층에 비해 ALD RuAlO 확산방지층은 동시에 Cu 씨앗층 역할을 하면서도 전기적 및 기계적 신뢰성이 우수할 것으로 판단된다.