• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2003.04a
• /
• pp.61-62
• /
• 2003

• Transactions of Materials Processing
• /
• v.8 no.3
• /
• pp.327-327
• /
• 1999

The oxidation behavior of 60%Cu-40%Zn brass haying small amounts of Zr, Cr, Mg, Al, and Si was studied between 873 and 1043 K in air. The alloying element of Mg was harmful, while other alloying elements were beneficial to oxidation resistance. Particularly, the simultaneous addition of Al and Si decreased the oxidation rate drastically. During oxidation, Zr formed ZrO₂, Cr formed CuCr₂O₄, Mg formed MgO, Al formed A1₂CuO₄, and Si formed amorphous SiO₂. These oxides were incorporated in the oxide scale composed predominantly of ZnO. The oxide scales formed on all the tested alloyswere prone to cracking, wrinkling, and spallation.

• Korean Journal of Materials Research
• /
• v.16 no.10
• /
• pp.614-618
• /
• 2006

The thermal stability of Cu/Ti(or Ta)/NiSi contacts was investigated. Ti(Ta)-capping layers deposited to form NiSi was utilized as the Cu diffusion barrier. Ti(Ta)/NiSi contacts was thermally stable upto $600^{\circ}C$. However when Cu/Ti(Ta)/NiSi contacts were furnace-annealed at $300{\sim}400^{\circ}C$ for 40 min., the Cu diffusion was found to be effectively suppressed, but NiSi was dissociated and then Ni diffused into the Cu layer to form Cu-Ni solutions. On the other hand, the Ni diffusion did not occur for the Al/Ti/NiSi system. The thermal instability of Cu/Ti(Ta)/NiSi contacts was attributed to the high heat of solution of Ni in Cu.

• Journal of Korea Foundry Society
• /
• v.30 no.5
• /
• pp.161-166
• /
• 2010

In this examination, the effect of Sr addition and holding time on microstructure of Al-10.5wt%Si-2wt%Cu secondary die-casting alloy was investigated. Degree of undercooling was improved with increasing the Sr content in this alloy. Up to 0.02wt%Sr addition, acicular and lamellar eutectic structure was observed in the microstructure. Meanwhile, the eutectic Si was modified toward the fine fibrous form by increasing Sr content with more than 0.03wt% and holding time of the melt. The well- modified alloys showed decreased eutectic silicon size from 3.25 ${\mu}m$ to less than 0.8 ${\mu}m$. From these results, the optimal strontium content and holding time were identified on the Al-10.5wt%Si-2wt%Cu secondary die-casting alloy.

• Transactions of the Korean hydrogen and new energy society
• /
• v.33 no.1
• /
• pp.105-112
• /
• 2022

Copper (Cu)-based catalysts have been widely used in a methanol steam reforming (MSR) reaction for hydrogen production for air-independent propulsion (AIP) applications and their good catalytic activities have attracted much attention. However, the agglomeration of the catalytic active site Cu causes deteriorating the catalytic performance and suppression of Cu agglomeration is a crucial issue in the AIP applications that the MSR system is typically operated at 250-300℃ for a long time. R. Sakai et al. recently showed a computational study on the anchoring effect that reduces an agglomeration of active sites by doping in a supporter. In order to present the anchoring effect on 𝛾-Al₂O₃ supported Cu-based catalysts, in this study, the adsorption energies of Cu on X-doped (X=ruthenium, phosphorus, silicon) 𝛾-Al₂O₃ were calculated and Cu adsorption energy decreased due to a change of the electronic structure originated from doping, thereby proving the anchoring effect.

• International Journal of Advanced Culture Technology
• /
• v.3 no.2
• /
• pp.132-137
• /
• 2015

The purpose of this paper was to investigate the effects of solution treatment time and Sr-modification on the microstructure and property of the Al-Si piston alloy. It was found that as-cast microstructures of unmodified and Sr-modified Al-Si alloys consisted of a coarse acicular plate of eutectic Si, $Cu_3NiAl_6$ and $Mg_2Si$ phases in the ${\alpha}$-Al matrix but different in size and morphology. Both size and inter-particle spacing of Si particles were significantly changed by increasing of the solution treatment time. After a short solution treatment, the coarse acicular plate of the eutectic Si appears to be fragmented. Fully modified microstructure of Sr-modified alloy can reduce the solution treatment time to shorter compared to unmodified alloy. The maximum of a peak hardness value is found in the very short solution treatment of both Al-Si piston alloys. Compared to 10 h solution treatment, the solution treatment of 2-4 h is sufficient to achieve appropriate microstructures and hardness. The short solution treatment is very useful to increase the productivity and to reduce the manufacturing cost of the Al-Si piston alloys.

• Journal of the Korea Institute of Military Science and Technology
• /
• v.7 no.1
• /
• pp.47-58
• /
• 2004

Loss factors of A356, Mn-Cu alloy and aluminum matrix composites reinforced with $SiC_p$ and Ni-coated graphite particles at various contents have been investigated using clamped-free cantilever beam method. The loss factors of half-power bandwidth of the specimens were measured over a wide range of frequencies from 50 to 3300Hz. Among the specimens, Al-10%$SiC_p$-10%$C_p$ showed the highest loss factor at the mode I, while Mn-Cu alloy showed the highest loss factors at the modes II and III. Consequently, at the mode I the Al-10%$SiC_p$--10%$C_p$ showed the loss factor of 0.00093, which is 2.64 and 1.58 times higher than those of A356 and Mn-Cu alloy, respectively.

• Journal of Korea Foundry Society
• /
• v.38 no.6
• /
• pp.111-120
• /
• 2018

In this study, the effects of two different casting methods (gravity casting and, diecasting) and various solid-solution conditions on the mechanical properties of ASC (Al-10.5wt%Si-1.75wt%Cu) and ALDC12 (Al-10.3wt%Si-1.72wt%Cu-0.76wt%Fe-0.28wt% Mn-0.32wt%Mg-0.9wt%Zn) alloys were investigated. A thermodynamic solidification analysis program (PANDAT) was used to predict the liquidus, solidus, and phases of the used alloys. In the results of an XRD analysis, ${\beta}$-AlFeSi peaks were observed only in the ALDC12 alloy regardless of the casting method or SST (solid-solution treatment) conditions. However, according to the results of a FE-SEM observation, both ${\theta}(Al_2Cu)$ and ${\beta}$-AlFeSi were found to exist besides ${\alpha}$-Al and eutectic Si in the gravity-casted ASC alloy at $500^{\circ}C$ after a SST of 120min. The ${\alpha}$-AlFeSi and ${\beta}$-AlFeSi phases including the eutectic phases were also found to exist in the ALDC12 alloy. The results of a microstructural observation and analyses by XRD, FE-SEM and EDS were in good agreement with the PANDAT results. The gravity-casted ALDC12 and ASC specimens showed the highest Y.S. and UTS values after aging for three hours at $180^{\circ}C$ after a SST at $500^{\circ}C$ for 30min. At longer solid-solution treatment times at $500^{\circ}C$ in the gravity-casted ALDC12 and ASC specimens, the elongations of the ASC alloys increased, whereas they decreased slightly in the ALDC12 alloys.

• Journal of the Korean Vacuum Society
• /
• v.18 no.3
• /
• pp.203-207
• /
• 2009

Copper is known as a replacement for aluminum wire which is used for semiconductor. Because specific resistance of Cu ($1.67{\mu}{\Omega}$-cm) is lower than that of Al ($2.66{\mu}{\Omega}$-cm), Cu reduce RC delay time. Although melting point of Cu($1085^{\circ}C$) is higher than melting point of Al, Cu have characteristic to easily react with Silicon(Si) in low temperature, and it isn't good at adhesive strength with Si. For above these reason, research of diffusion barrier to prevent reaction between Cu and Si and to raise adhesive strength is steadily advanced. Our study group have researched on W-C-N (tungsten-carbon-nitrogen) Diffusion barrier for preventing diffusion of Cu through semiconductor. By recent studies, It's reported that W-C-N diffusion barrier can even precent Cu and Si diffusing effectively at high temperature. In this treatise, we vaporized different proportion of N into diffusion barrier to research Cu's Electromigration based on the results and studied surface hardness in the heat process using nano scale indentation system. We gain that diffusion barrier containing nitrogen is more stable for Cu's electromigration and has stronger surface hardness in heat treatment process.

• Journal of Korea Foundry Society
• /
• v.22 no.1
• /
• pp.42-48
• /
• 2002

Effects of coating treatment of metallic Cu, Ni-P film on $SiC_p$, for $SiC_p$/iron aluminide composites were studied. Porous hybrid preforms were fabricated by reactive sintering after mixing the coated $SiC_p$, Fe and Al powders. Then the final composites were manufactured by squeeze casting after pouring AC4C Al alloy melts in preforms. The change of reactive temperature, density, microstructure of the preforms and microstructure of the composites were investigated. The exprimental results were summarized as follows. The thickness of Cu and Ni-P metallic layer formed on $SiC_p$ by electroless plating method were about $0.5{\mu}m$ and coated uniformly. There was no remakable change in the ignition temperature with variation of the mixing ratio of Fe and Al powder while in the case of coated $SiC_p$ it was lower about $20^{\circ}C$ than in the non-coated $SiC_p$. The maximum reaction temperature increased with increasing Al contents, but decreased with increasing $SiC_p$ contents. Expansion ratio of preform after reactive sintering increased with amount of Cu coated $SiC_p$. In the case of Fe-70at.%Al, the expansion ratio was about 7% up to 8wt.% of $SiC_p$, addition but further addition of $SiC_p$, increased the ratio significantly. And in the case of Fe-50 and 60at.%Al, it was about 20% up to 16wt.% of $SiC_p$ addition and about 28% in 24wt.% of $SiC_p$, addition. The microstructures of compounds showed that the grains became finer as amount of $SiC_p$, and mixing ratio of iron powder increased and the shape of compounds was changed gradually from irregular to spheroidal.