• Bulletin of the Korean Chemical Society
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• v.11 no.1
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• pp.1-7
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• 1990

We present a theoretical investigation on the etching of an Al solid by $SiCl_4$ molecules at a collision energy of 600 eV. The classical trajectory method is employed to calculate Al etching yields, degree of anisotropy, kinetic energy distribution and angular distribution. The calculated results are compared with the reaction of a Cu solid by $SiCl_4$. The major products of the reaction are aluminum monomers and dimers together with considerable quantities of multimers. The Al solid shows better etching yield and better anisotropy than the Cu solid. This is consistent with the problem in the CMOS micro-fabrication of the CuAl and CuAlSi alloys. The relevance of these calculations for the dry etching of CuAl alloy is discussed.

• Journal of Korea Foundry Society
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• v.24 no.1
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• pp.45-51
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• 2004

Fe and Si are common impurity elements in the aluminum alloys. In this investigation, the effects of the addition of Fe and Si on the age-hardening behaviors of the Al-Cu-Mn-Ti-Zr-Cd casting alloys were examined through hardness measurements, calorimetric techniques and observation of the transmission electron microscopy. The addition of Fe depresses the formation of GPII and ${\theta}'$, and thus retards the peak aging time and reduces the peak hardness of the Al-Cu-Mn-Ti-Zr-Cd alloys. On the contrary, the addition of Si accelerates the formation of GPII and ${\theta}'$ and thus accelerates age-hardening behaviors of the Al-Cu-Mn-Ti-Zr-Cd alloys.

• Journal of Powder Materials
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• v.11 no.2
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• pp.171-178
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• 2004

Effects of liquid phase and reinforcing particle morphology on the sintering of Al-6 wt％Cu-10 vol％ $Al_2O_3$ or SiC particles were studied in regards to densification, structure and transverse rupture properties. The Al-Cu liquid phase penetrated the boundaries between the aluminum matrix powders and the interfaces with reinforcing particles as well, indicating a good wettability to the powders. This enhanced the densification during sintering and the resulting strength and ductility. Since most of the copper added, however, was dissolved in the liquid phase and formed a brittle $CuAl_2$ phase upon cooling rather than alloyed with the aluminum matrix, the strengthening effect by the copper was not fully realized. Reinforcing particles of agglomerate type were found less suitable for the liquid phase sintering than solid type particles. $Al_2O_3$ and SiC particles protluced little difference on the sintering behavior but their size had a large effect. Repressing of the sintered composites increased density and bending properties but caused debonding at the matrix-particle interfaces and also fracturing of the particles.

• Electrical & Electronic Materials
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• v.9 no.3
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• pp.291-297
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• 1996

The surface properties of AI(Si, Cu) alloy film after plasma etching using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched AI(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxidized (partially chlorinated) states, copper shows Cu metallic states and Cu-Cl$_{x}$(x$_{x}$ (x$_{x}$ (1

• Journal of the Korean institute of surface engineering
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• v.56 no.5
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• pp.335-340
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• 2023

Quinary component of 3㎛ thick Ti-Al-Si-Cu-N films were deposited onto WC-Co and Si wafer substrates by using an arc ion plating(AIP) system. In this study, the influence of copper(Cu) contents on the mechanical properties and microstructure of the films were investigated. The hardness of the films with 3.1 at.% Cu addition exhibited the hardness value of above 42 GPa due to the microstructural change as well as the solid-solution hardening. The instrumental analyses revealed that the deposited film with Cu content of 3.1 at.% was a nano-composites with nano-sized crystallites (5-7 nm in dia.) and a thin layer of amorphous Si₃N₄ phase.

• Korean Journal of Metals and Materials
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• v.48 no.3
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• pp.248-255
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• 2010

The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.

• Korean Journal of Materials Research
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• v.24 no.10
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• pp.538-542
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• 2014

Microstructural and mechanical characteristics of Al-6Si-2Cu alloy for lightweight automotive parts were investigated. The test specimens were prepared by gravity casting process. Solution heat treatments were applied to as-cast alloys to improve mechanical properties. The microstructure of the gravity casting specimen presents a typical dendrite structure, having a secondary dendrite arm spacing (SDAS) of $37{\mu}m$. In addition to the Al matrix, a large amount of coarsened eutectic Si, $Al_2Cu$ intermetallic phase, and Fe-rich phases were identified. After solution heat treatment, single-step solution heat treatments were found to considerably improve the spheroidization of the eutectic Si phase. Two-step solution treatments gave rise to a much improved spheroidization. The mechanical properties of the two-step solution heat treated alloy have been shown to lead to higher values of properties such as tensile strength and microhardness. Consequentially, the microstructural and mechanical characteristics of Al alloy have been successfully characterized and are available for use with other basic data for the development of lightweight automotive parts.

• Journal of Korean Society for Atmospheric Environment
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• v.20 no.3
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• pp.291-302
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• 2004

The CuO/$3AL_2O_3{\cdot}2SiO_2$ catalyst impregnated ceramic candle filters for nitrogen oxides removal were prepared by porous mullite($3AL_2O_3{\cdot}2SiO_2$) support and CuO catalyst deposited on this support to achieve uniformly dispersed CuO deposition, which are impregnated into the pores of available alumino-silicate ceramic candle filter. The CuO/3$AL_2O_3{\cdot}2SiO_2$ catalyst impregnated ceramic candle filters were characterized by XRD, BET, air permeability, pore size, SEM and catalytic tests in the reduction of NOx by NH$_3$. The observed effects of CuO/3$AL_2O_3{\cdot}2SiO_2$ impregnated ceramic candle filters in SCR reaction are as follows : (1) when the content of CuO catalyst increased further, activity of NO increased. (2) NO conversion at first increased with temperature and then decreased at high temperatures (above 40$0^{\circ}C$), possibly due to the occurrence of the ammonia oxidation reaction. (3) In pilot plant test for 3 months, NO conversion was greater than 90%.

• Journal of the Korean Society for Heat Treatment
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• v.31 no.6
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• pp.300-306
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• 2018

In the present study we proposed new equations to predict the liquidus temperature curve for hypoeutectic Al-Si-Cu-Mg alloy. A thermodynamic simulation was carried out to calculate the liquidus temperature, eutectic temperature and eutectic Si concentration with different Si, Cu, and Mg contents in hypoeutectic Al-Si alloys. Regressed equations were derived using the thermodynamic simulation results by multiple regression analysis. The proposed equations were compared with the equations reported previously by other researchers and agreed better with the experimental data. The addition of Cu and Mg lowered the eutectic temperature. The eutectic Si concentration was decreased by adding Cu whereas that was increased by adding Mg. Al-Si binary phase diagram was successfully predicted with a consideration of the effect of Cu and Mg addition by using the proposed equations.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.49-55
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• 2016

The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.