• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.79-81
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• 2002

ZnO 나노와이어는 ZnO 파우더를 볼밀 처리하여 열증착 방법으로 $1380^{\circ}C$에서 촉매없이 Si 기판위에서 합성되었다. 합성된 ZnO 나노와이어의 길이와 직경은 $20{\sim}30{\mu}m$와 $50{\sim}200$ nm 였다. ZnO 나노와이어 표면을 atomic layer deposition(ALD) 방법으로 $Al_2O_3$ 박막을 얇게 코팅하였다. 성장온도는 $300^{\circ}C$였고, 사용한 전구체는 Trimethlaluminum(TMA)와 distilled water($H_2O$) 이다. Transmission electron microscopy(TEM) 으로 측정한 $Al_2O_3$ 박막의 두께는 40 nm 로서 매우 균일하게 ZnO 나노와이어에 증착되었음을 알 수 있었다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.33 no.4
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• pp.153-157
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• 2023

In order to manufacture a semiconductor circuit, etching, cleaning, and deposition processes are repeated. During these processes, the inside of the processing chamber is exposed to corrosive plasma. Therefore, the coating of the inner wall of the semiconductor equipment with a plasma-resistant material has been attempted to minimize the etching of the coating and particle contaminant generation. In this study, we mixed AlF₃ powder with the solid-state reacted yttrium oxyfluoride (YOF) in order to increase plasma-etching resistance of the plasma spray coated YOF layer. Effects of the mixing ratio of AlF₃ with YOF powder on crystal structure, microstructure and chemical composition were investigated using XRD and FE-SEM. The plasma-etching ratios of the plasma-spray coated layers were calculated and correlation with AlF₃ mixing ratio was analyzed.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.513-519
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• 2014

For depth machining in die and mold, Electrical Discharge Machining (EDM) is used generally. To make deep hole and deep shape efficiently, cemented carbide endmill for depth machining is necessary. For this purpose, cemented carbide endmill was designed using design of experiment (DOE). To improve cutting performance, endmill was coated with multilayer surface treatment, TiAlCrSiN and TiAlCrN, for higher wear resistance. In order to evaluate the endmill, Transverse Rupture Strength (TRS) test was tried for investigating the relationship between surface treatment and strength in endmill body. Scratch test was also used for measuring adhesion force of each surface treatment. To evaluate hardness of surface treatment, Atomic Force Microscope (AFM) analysis was carried out. Wear test was executed for characteristics of each surface treatment in high temperature. Consequently, TiAlCrSiN was superior to the TiAlCrN coating in case of high temperature environment such as cutting.

• Korean Journal of Metals and Materials
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• v.49 no.4
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• pp.281-290
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• 2011

In order to gain better understanding of the selective surface oxidation and its influence on the galvanizability of a transformation-induced plasticity (TRIP) assisted steel containing 1.5 wt.% Si and 1.6 wt.% Mn, a model experiment has been carried out by depositing Si and Mn (each with a nominal thickness of 10 nm) in either monolayers or bilayers on a low-alloy interstitial-free (IF) steel sheet. After intercritical annealing at $800^{\circ}C$ in a $N_2$ ambient with a dew point of $-40^{\circ}C$, the surface scale formed on 590 MPa TRIP steel exhibited a microstructure similar to that of the scale formed on the Mn/Si bilayer-coated IF steel, consisting of $Mn_{2}SiO_{4}$ particles embedded in an amorphous $SiO_{2}$ film. The present study results indicated that, during the intercritical annealing process of 590 MPa TRIP steel, surface segregation of Si occurs first to form an amorphous $SiO_{2}$ film, which in turn accelerates the out-diffusion of Mn to form more stable Mn-Si oxide particles on the steel surface. During hot-dip galvanizing, particulate $Fe_{3}O_{4}$, MnO, and Si-Mn oxides were reduced more readily by Al in a Zn bath than the amorphous $SiO_{2}$ film. Therefore, in order to improve the galvanizability of 590 TRIP steel, it is most desirable to minimize the surface segregation of Si during the intercritical annealing process.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.24-24
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• 1998

반도체장비를 포함하는 초고진공장비의 園훌化가 급속히 그리고 절실히 요구되고 있는 것이 현실정이다. 當面해서 실현할 국산진공장비의 대상은 廣範圍하다. 즉, 각종 진공 pump ( (rotary, dry, diffusion, cryo, ion, turbo melecular pump), 진공 chamber, 진공 line, gate valve 를 위 시 한 진공 V머ve, flange, gasket, fl않d야lU, mainpulater 퉁 진공 部品이 다. 진공계 의 핵심 은 適切하고 優良한 진공재료의 선태파 사용이다. 진공장비는 사용자가 원하는 진공도를 원하 는 시간 동안 륨空度를 유지해 주어야 한다. 진공재료 선태의 기준사항은:(1) 기체의 透過성 (2) 薰했훌 (3) 혔體放出특성 - -outgassing과 degassing- (4) 機械的 량훌度 (5) 온도 의존성 (6) 化學톡성 (7) 加I성 및 鎔接 성 (8) 課電특성 (9) 磁氣특성 (10) 高速함子 및 放射線 특성 (11) 經濟성 및 調達생 둥이 다. 우량한 초고진공계재료는 풍부하게 개발되어 왔고, 또 新材料들이 개발되고 있다. 여기에서는 주로 초고진공 내지는 극고진공계의 構造材料, 機能材料, 部品材料 일반파 몇가지 신재료의 특 성에 관해서 記述한다. M Mild SteeHSAE, 1112, 1010, 1020, 1022, etc)., S Stainless SteeHAlSI, 304, 304L, 310, 316, 321, 347): 구조재료, chamber, fl하1ges A Aluminum과 Alloys (1060, 1100, 2014, 4032, 6(뻐1): 구조재료, chamber, flanges, gaskets A AI, Al 떠loy는 SS에 代替하는 역 할올 시 작하고 있다. C Copper, Copper Alloys(C11$\alpha$)0, C26800, C61400, Cl7200): 내장인자, gasket, cryopanel, tubing T Titanium, Ziriconium, Haf띠um 및 Alloys: 특히 Ti은 10n pump 용 getter material 이 외 에 U UHV,XHV용 chamber계로서 관심올 끌고 있다. N Nickel, Nickel Alloys (200, 204, 211, monel, nichrome): 부식 방지 , 전자장치 , 자기 장치 귀 금속(Ag, Au, Pt, Pd, Rh, Ir, Os, Ru): 보조부품, gasket, filament, coating, thermocouple, 접 합부위 T TiC, SiC, zrC, HfC, TaC 둥의 탄화물과, BN, TiN, AlN 동의 질화물, 붕화물이 둥장하고 었 다. 유리: Soda Lime, Borosilicate, Potash Soda Lead: View Port, Chamber envelope C Ceramics: AlZ03, BeO, MgO, zrOz, SiOz, MgOzSiOz, 3Alz032SiOz, Z$textsc{k}$hSiOz S상N4: e electrical, thermal insulators, crucibles, boats, single crystals, sepctr려 windows 저자는 최근 저자들이 발견한 Zr-Ti-Cu-Ni-Be amorphous alloys coated cham뾰r가 radiation p proof로 이용될 수 있는 사실을 점검하고 었다 .. Z.Y. Hua 들은 Cs3Sb를 새로운 photocathode 재료로 보고하고 있다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.28-28
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• 2009

Fabrications of antireflection structures on solar cell were investigated to trap the light and to improve quantum efficiency. Introductions of patterned substrate or textured layer for Si solar cell were performed to prevent reflectance and to increase the path length of incoming light. However, it is difficult to deposit conformally flat electrode on perpendicular plane. ZnO is II-VI compound semiconductor and well-known wide band-gap material. It has similar electrical and optical properties as ITO, but it is nontoxic and stable. In this study, Al-doped ZnO thin films are deposited as transparent electrode by atomic layer deposition method to coat on Si substrate with micro-scale structures. The deposited AZO layer is flatted on horizontal plane as well as perpendicular one with conformal 200 nm thickness. The carrier concentration, mobility and resistivity of deposited AZO thin film on glass substrate were measured $1.4\times10^{20}cm^{-3}$, $93.3cm^2/Vs$, $4.732\times10^{-4}{\Omega}cm$ with high transmittance over 80%. The AZO films were coated with polyimide and performed selective polyimide stripping on head of column by reactive ion etching to measure resistance along columns surface. Current between the micro-columns flows onto the perpendicular plane of deposited AZO film with low resistance.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.223-223
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• 2003

광통신에는 광신호의 전송과 광신호 처리에 처리 과정에서 광 손실을 수반하므로 각 요소별로 광신호 증폭이 반드시 필요하다. 또한 광통신망의 완전 광화를 위해서는 제조 공정이 간단하여 가격이 저렴하고, 높은 신뢰성과 높은 증폭 효율을 가지면서 다른 부품과의 집적화가 가능한 광도파로형 광증폭기가 요구되고 있다 그러나 실리카는 광통신 파장대인 1.55$\mu\textrm{m}$대역의 증폭이 가능한 Er 이온에 대한 용해도가 50ppm 이하로 낮아 lmol% 이상 고농도로 Er 이온을 첨가하여 높은 증폭 효율을 얻는데 한계를 가지고 있다. 따라서 본 연구에서는 Er 이온에 대하여 높은 용해 특성을 가지고 있어 고농도 Er 이온 도핑이 가능한 알루미나에 Er을 1-2 mol% 첨가하여 광발광 특성을 조사하였다. Er이 첨가된 알루미나 나노 졸은 Al(NO$_3$)$_3$ㆍ9$H_2O$와 Er(NO$_3$)$_3$.5$H_2O$가 일정 양 용해된 수용액에 NH$_4$OH를 가하여 침전물을 얻고 여과 및 수세하여 졸 입자의 함량이 약 5wt%가 되게 이온교환수와 해교제인 초산을 소량 가하여 10$0^{\circ}C$에서 약 50시간 열처리하는 방법으로 제조하였다. Er이 첨가된 알루미나 코팅막은 Er 이 첨가된 알루미나 나노 졸에 GPS(3-glycidoxypropyltriethoxysilane)를 Al에 대하여 7 mol% 가하여 스핀 코팅법으로 제조하였다. Si 기판에 코팅하고, 상온에서 90$0^{\circ}C$까지 각 1시간 열처리한 코팅막의 광 발광 특성은 Er 이온의 첨가량과 열처리로 변화된 알루미나 코팅막의 결정상과 연계하여 논의 될 것이다. X-선 회절법으로 분석한 알루미나 코팅막의 온도에 따른 결정상은 boehmite 상에서 약 50$0^{\circ}C$이후에 ${\gamma}$-Al$_2$O$_3$로 전이하고 있다.

• Applied Chemistry for Engineering
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• v.17 no.6
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• pp.580-585
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• 2006

UV-thermal dually curable coating materials were prepared by the sol-gel method. Nano-sized colloidal boehmite was treated with various organo silane coupling agents. These materials could be well dispersed in various alcohols and relatively polar organic solvents such as tetrahydrofuran and acetonitrile. The coating films were prepared by a spin coating method on various substrates, which were characterized by FT-IR, Si/Al CP MAS NMR spectra, UV-Vis spectrophotometer, FE-SEM, Taber abraser, haze meter, and pencil hardness tester. The effects of molar ratio and types of silane coupling agents, curing method and ion-shower treatment were investigated. Dually curable coating method offered an optimally good quality film in both hardness and transmittance. The transparency and the hardness of the prepared films were increased with amounts of 3-(trimethoxysilyl)propylmethacrylate, and (3-glycidyloxypropyl)trimethoxysilane, respectively. The adhesion between coated layer and substrate could be enhanced by ion-shower treatment.

• Polymer(Korea)
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• v.33 no.1
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• pp.79-83
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• 2009

Thin electric insulation layers were coated on aluminum plates and aluminum condenser cases by plasma polymerization of HMDSO+$O_2$. Electric resistances of the films were higher than 1.0 M$\Omega$ if they are thicker than 0.5 ${\mu}m$ independently of the type of films but their surface morphologies and adhesion strengths were dependent on the process conditions. Deposition rate and adhesion strength of the films were dependent on $O_2$/HMDSO flow ratio and discharge power. The best result was obtained at $O_2$/HMDSO flow ratio of 4 and discharge power of 60 W. Adhesion strength could also be highly improved if aluminum was pre-treated in boiling water for 30 min through the formation of Al-O-Si bonding between the film and the aluminum surface. The coated films showed excellent chemical and thermal resistances.

• Korean Journal of Materials Research
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• v.31 no.10
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• pp.546-551
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• 2021

To improve ferroelectric properties of PZT, many studies have attempted to fabricate dense PZT films. The AD process has an advantage for forming dense ceramic films at room temperature without any additional heat treatment in low vacuum. Thick films coated by AD have a higher dielectric breakdown strength due to their higher density than those coated using conventional methods. To improve the breakdown strength, glass (SiO₂-Al₂O₃-Y₂O₃, SAY) is mixed with PZT powder at various volume ratios (PZT-xSAY, x = 0, 5, 10 vol%) and coating films are produced on silicon wafers by AD method. Depending on the ratio of PZT to glass, dielectric breakdown strength and energy storage efficiency characteristics change. Mechanical impact in the AD process makes the SAY glass more viscous and fills the film densely. Compared to pure PZT film, PZT-SAY film shows an 87.5 % increase in breakdown strength and a 35.3 % increase in energy storage efficiency.