• Title/Summary/Keyword: Al-Cu-Mg

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Effects of Cu and Zr Addition on the Tensile Properties, Corrosion Characteristics and Interfacial Compounds with Cast Iron of Al-Si-Mg Alloy for Compound Casting (복합주조용 Al-Si-Mg 합금의 인장성질, 부식특성 및 주철과의 접합계면 화합물에 미치는 Cu 및 Zr 첨가의 영향)

  • Kyoung-Min Min;Ki-Chae Jung;Je-Sik Shin;Jeong-Min Kim
    • Korean Journal of Materials Research
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    • v.33 no.1
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    • pp.8-14
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    • 2023
  • In order to broaden the range of application of light weight aluminum alloys, it is necessary to enhance the mechanical properties of the alloys and combine them with other materials, such as cast iron. In this study, the effects of adding small amounts of Cu and Zr to the Al-Si-Mg based alloy on tensile properties and corrosion characteristics were investigated, and the effect of the addition on the interfacial compounds layer with the cast iron was also analyzed. Although the tensile strength of the Al-Si-Mg alloy was not significantly affected by the additions of Cu and Zr, the corrosion resistance in 3.5 %NaCl solution was found to be somewhat lowered in this research. The influence of Cu and Zr addition on the type and thickness of the interfacial compounds layer formed during compound casting with cast iron was not significant, and the main interfacial compounds were identified to be Al5FeSi and Al8Fe2Si phases, as in the case of the Al-Si-Mg alloys.

Effects of Cu and Ag Addition on Nanocluster Formation Behavior in Al-Mg-Si Alloys

  • Kim, Jae-Hwang;Tezuka, Hiroyasu;Kobayashi, Equo;Sato, Tatsuo
    • Korean Journal of Materials Research
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    • v.22 no.7
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    • pp.329-334
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    • 2012
  • Two types of nanoclusters, termed Cluster (1) and Cluster (2) here, both play an important role in the age-hardening behavior in Al-Mg-Si alloys. Small amounts of additions of Cu and Ag affect the formation of nanoclusters. Two exothermic peaks were clearly detected in differential scanning calorimetry(DSC) curves by means of peak separation by the Gaussian method in the base, Cu-added, Ag-added and Cu-Ag-added Al-Mg-Si alloys. The formation of nanoclusters in the initial stage of natural aging was suppressed in the Ag-added and Cu-Ag-added alloys, while the formation of nanoclusters was enhanced at an aging time longer than 259.2 ks(3 days) of natural aging with the addition Cu and Ag. The formation of nanoclusters while aging at $100^{\circ}C$ was accelerated in the Cu-added, Ag-added and Cu-Ag-added alloys due to the attractive interaction between the Cu and Ag atoms and the Mg atoms. The influence of additions of Cu and Ag on the clustering behavior during low-temperature aging was well characterized based on the interaction energies among solute atoms and on vacancies derived from the first-principle calculation of the full-potential Korrinaga-Kohn-Rostoker(FPKKR)-Green function method. The effects of low Cu and Ag additions on the formation of nanoclusters were also discussed based on the age-hardening phenomena.

High Temperature Deformation Behavior of Sc Added Al-7.7wt%Zn-2.0wt%Mg-1.9wt%Cu Alloy (Sc을 첨가한 Al-7.7wt%Zn-2.0wt%Mg-1.9wt%Cu합금의 고온 변형거동)

  • Woo, Kee-Do;Ryu, Yong-Seok;Kim, Sug-Won;Deliang Zhang
    • Korean Journal of Materials Research
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    • v.13 no.12
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    • pp.819-824
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    • 2003
  • The Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc alloy exhibited excellent elongation by the new thermomechanical treatment (TMT) process; solution treatment and furnace cooling\longrightarrowhot and cold rolling and then annealing for short time. Tensile test at high temperature from 430 to $500^{\circ}C$ has been performed with various strain rates using for the Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc alloy obtained by the TMT process. The elongation of the Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc was 550% tensile tested at $470^{\circ}C$ temperature and 2.2 $\times$ $10^{-3}$ $s^{-1}$ strain rate. The m value of Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc alloy deformed 85% increased from 0.33 to 0.46 with increasing total elongation. This new TMT process was very simple and easy to make the sheets in the company.

Evaluation of the Inhibitory Effect of Cu2+, Al3+ and Zn2+ on the Activated Sludge (Cu2+, Al3+, Zn2+이 활성슬러지에 미치는 저해영향 평가)

  • Kim, Chang-Gyu;Kim, Yo-Yong;Park, Ik-Beom;Song, Jin-Ho;Nam, Woo-Kyong;Han, Song-Hee;Kim, Bok-Jun;Oh, Jo-Gyo
    • Journal of Korean Society on Water Environment
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    • v.31 no.2
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    • pp.87-93
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    • 2015
  • In this study, the inhibitory effect of toxic metals was investigated on the activated sludge of the municipal sewage treatment plant. The allowable concentration of toxic metals was also estimated for the stable operation of the biological treatment process. The single and mixture toxicity of $Cu^{2+}$, $Al^{3+}$ and $Zn^{2+}$ were evaluated for the activated sludge microorganisms. As a result, nitrifying microorganisms were more susceptible than heterotrophic microorganisms. $IC_{10}$ (Inhibition Concentration of 10%) of $Cu^{2+}$, $Al^{3+}$ and $Zn^{2+}$ for the nitrifying microorganisms was 3 mg/L, 7 mg/L and 25 mg/L, respectively. The mixture toxicity showed three times more sensitive than the single toxicity. The concentrations of $Cu^{2+}$, $Al^{3+}$ and $Zn^{2+}$ to minimize the inhibitory effect on organic matter removal and nitrification in batch experiments were found to be 1.3 mg/L, 2.5 mg/L and 6.3 mg/L.

The Effect of Small Additions of Zr, Cr, Mg, Al, and Si on the Oxidation of 6:4 Brass

  • 이동복;문재진
    • Transactions of Materials Processing
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    • v.8 no.3
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    • pp.327-327
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    • 1999
  • The oxidation behavior of 60%Cu-40%Zn brass haying small amounts of Zr, Cr, Mg, Al, and Si was studied between 873 and 1043 K in air. The alloying element of Mg was harmful, while other alloying elements were beneficial to oxidation resistance. Particularly, the simultaneous addition of Al and Si decreased the oxidation rate drastically. During oxidation, Zr formed ZrO₂, Cr formed CuCr₂O₄, Mg formed MgO, Al formed A1₂CuO₄, and Si formed amorphous SiO₂. These oxides were incorporated in the oxide scale composed predominantly of ZnO. The oxide scales formed on all the tested alloyswere prone to cracking, wrinkling, and spallation.

3D-printing-based Combinatorial Experiment for Al-Si-Cu-Mg Alloys (금속 3D 프린팅 적층 제조 공정 기반 Al-Si-Cu-Mg 합금 조합 실험)

  • Song, Yongwook;Kim, Jungjoon;Park, Suwon;Choi, Hyunjoo
    • Journal of Powder Materials
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    • v.29 no.3
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    • pp.233-239
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    • 2022
  • Aluminum alloys are extensively employed in several industries, such as automobile, aerospace, and architecture, owing to their high specific strength and electrical and thermal conductivities. However, to meet the rising industrial demands, aluminum alloys must be designed with both excellent mechanical and thermal properties. Computer-aided alloy design is emerging as a technique for developing novel alloys to overcome these trade-off properties. Thus, the development of a new experimental method for designing alloys with high-throughput confirmation is gaining focus. A new approach that rapidly manufactures aluminum alloys with different compositions is required in the alloy design process. This study proposes a combined approach to rapidly investigate the relationship between the microstructure and properties of aluminum alloys using a direct energy deposition system with a dual-nozzle metal 3D printing process. Two types of aluminum alloy powders (Al-4.99Si-1.05Cu-0.47Mg and Al-7Mg) are employed for the 3D printing-based combined method. Nine types of Al-Si-Cu-Mg alloys are manufactured using the combined method, and the relationship between their microstructures and properties is examined.

The Formation of $YBa_2$$Cu_3$$O_7$ Step-edge Josephson Junction on LaAl$O_3$and MgO Single Crystal Substrates by Using Step-edge Annealing (LaAl$O_3$와 MgO 기판 위에 형성한 $YBa_2$$Cu_3$$O_7$ 모서리 죠셉슨 접합의 열처리 효과)

  • Yunseok Hwang;Kim, Jin-Tae;Sunkyung Moon;Lee, Soon-Gul;Park, Yong-Ki;Park, Jong-Chul
    • Progress in Superconductivity
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    • v.2 no.2
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    • pp.71-75
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    • 2001
  • The effect of annealing step-edges of LaAlO$_3$ and MgO single crystal substrates on YBa$_2$Cu$_3$O$_{7}$ junction has been studied. The step-edge was fabricated by argon ion milling and was annealed at 105$0^{\circ}C$ in 1 attn oxygen pressure. We compared AFM image near step-edge of the substrates between before and after annealing process. And YBa$_2$Cu$_3$O$_{7}$ thin film was deposited on the step-edge by a standard pulsed laser deposition. The step-edge junctions were characterized by current-voltage curves at 77 K. The annealing of step-edges of MgO substrate improved the current-voltage characteristic of Josephson junction: double steps in the current-voltage characteristic disappeared. However the annealing for LaAlO$_3$ did not improve the junction property.rty.

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Effects of Alloying Element and Heat-Treatment Condition on the Strength of Squeeze-Casted Al-3.0 wt%Si Alloy (용탕 단조 Al-3.0 wt%Si 합금의 강도에 미치는 합금 원소 및 열처리 조건의 영향)

  • Lee, Hag-Ju;Hwang, Jae-Hyoung;Kwon, Hae-Wook
    • Journal of Korea Foundry Society
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    • v.26 no.6
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    • pp.249-257
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    • 2006
  • The effects of alloying element and the condition of heat-treatment on the strength of squeeze-cast Al-3.0 wt%Si alloy were investigated. The strength of the alloy without grain refinement was increased with increase Cu content upto 3.0 wt% and rather decreased beyond that. The tensile strength of the alloy with grain refinement increased with Cu content upto 3.0 wt% and not changed beyond that. The strength of the alloy without grain refinement increased with the Mg content. The tensile strength with grain refinement increased with the Mg content upto 0.50 wt% and then decreased beyond that. The strength of the grain refined alloy increased by individual and simultaneous additions of Cu and Mg and the maximum strength was obtained with Al-3.0 wt%Si-4.5 wt%Cu-0.50 wt%Mg alloy. The optimum heat-treatment condition for this alloy was obtained.

Interfacial Characteristics of Al/Cu Hybrid Materials Prepared by Compound Casting (복합주조공정으로 제조한 Al/Cu 하이브리드 소재의 계면특성)

  • Kim, Nam-Hoon;Kim, Jeong-Min
    • Journal of Korea Foundry Society
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    • v.35 no.6
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    • pp.141-146
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    • 2015
  • Aluminum-based hybrid parts were fabricated through a compound casting process with Al or Cu inserts which can be used for applications requiring high conductivity. Because the interface stability between the insert and the aluminum matrix is important, the effects of process variables on the interfacial adhesion strength were investigated. Additions of Cu and Mg to Al melt were found to enhance the adhesion strength, though the melt fluidity was slightly deteriorated when a small amount of Mg was added. An isothermal heating process after casting further improved the strength. However AlCu intermetallic compounds formed and their thickness increased during the heating process. As a result, deterioration in the interfacial adhesion strength was observed after an excessive annealing treatment.

Sputtering Yield and Secondary Electron Emission Coefficient(${\gamma}$) of the MgO, $MgAl_2O_4$ and $MgAl_2O_4/MgO$ Thin Film Grown on the Cu Substrate by Using the Focused Ion Beam (Cu 기판위에 성장한 MgO, $MgAl_2O_4$$MgAl_2O_4/MgO$ 박막의 집속이온빔을 이용한 스퍼터링수율 측정과 이차전자방출계수 측정)

  • Jung K.W.;Lee H.J.;Jung W.H.;Oh H.J.;Park C.W.;Choi E.H.;Seo Y.H.;Kang S.O.
    • Journal of the Korean Vacuum Society
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    • v.15 no.4
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    • pp.395-403
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    • 2006
  • It is known that $MgAl_2O_4$ has higher resistance to moisture than MgO, in humid ambient MgO is chemically unstable. It reacts very easily with moisture in the air. In this study, the characteristic of $MgAl_2O_4$ and $MgAl_2O_4/MgO$ layers as dielectric protection layers for AC- PDP (Plasma Display Panel) have been investigated and analysed in comparison for conventional MgO layers. MgO and $MgAl_2O_4$ films both with a thickness of $1000\AA$ and $MgAl_2O_4/MgO$ film with a thickness of $200/800\AA$ were grown on the Cu substrates using the electron beam evaporation. $1000\AA$ thick aluminium layers were deposited on the protective layers in order to avoid the charging effect of $Ga^+$ ion beam while the focused ion beam(FIB) is being used. We obtained sputtering yieds for the MgO, $MgAl_2O_4$ and $MgAl_2O_4/MgO$ films using the FIB system. $MgAl_2O_4/MgO$ protective layers have been found th show $24{\sim}30%$ lower sputtering yield values from 0.244 up to 0.357 than MgO layers with the values from 0.364 up to 0.449 for irradiated $Ga^+$ ion beam with energies ranged from 10 kV to 14 kV. And $MgAl_2O_4$ layers have been found to show lowest sputtering yield values from 0.88 up to 0.109. Secondary electron emission coefficient(g) using the ${\gamma}$- FIB. $MgAl_2O_4/MgO$ and MgO have been found to have similar g values from 0.09 up to 0.12 for indicated $Ne^+$ ion with energies ranged from 50 V to 200 V. Observed images for the surfaces of MgO and $MgAl_2O_4/MgO$ protective layers, after discharge degradation process for 72 hours by SEM and AFM. It is found that $MgAl_2O_4/MgO$ protective layer has superior hardness and degradation resistance properties to MgO protective layer.