Browse > Article
http://dx.doi.org/10.7777/jkfs.2015.35.6.141

Interfacial Characteristics of Al/Cu Hybrid Materials Prepared by Compound Casting  

Kim, Nam-Hoon (Dept. of Advanced Materials Engineering, Hanbat National University)
Kim, Jeong-Min (Dept. of Advanced Materials Engineering, Hanbat National University)
Publication Information
Journal of Korea Foundry Society / v.35, no.6, 2015 , pp. 141-146 More about this Journal
Abstract
Aluminum-based hybrid parts were fabricated through a compound casting process with Al or Cu inserts which can be used for applications requiring high conductivity. Because the interface stability between the insert and the aluminum matrix is important, the effects of process variables on the interfacial adhesion strength were investigated. Additions of Cu and Mg to Al melt were found to enhance the adhesion strength, though the melt fluidity was slightly deteriorated when a small amount of Mg was added. An isothermal heating process after casting further improved the strength. However AlCu intermetallic compounds formed and their thickness increased during the heating process. As a result, deterioration in the interfacial adhesion strength was observed after an excessive annealing treatment.
Keywords
Aluminum; Compound casting; Conductivity; Adhesion strength; Fluidity;
Citations & Related Records
연도 인용수 순위
  • Reference
1 S.S.M. Kartheek, K.V. Vamsi, B. Ravisankar, K. Sivaprasad and S. Karthikeyan, Procedia Mater. Sci., "Microstructural and nanoindentation studies across diffusion-bonded interfaces in Al/Cu metal intermetallic laminates", 6 (2014) 709-715.   DOI
2 Lee KS and Kwon YN, Trans. Nonferrous Met. Soc. China, "Solid-state bonding between Al and Cu vacuum hot pressing", 23 (2013) 341-346.   DOI
3 Kwon YD and Lee ZH, Mater. Sci. Eng. A, "The effect of grain refining and oxide inclusion on the fluidity of Al-4.5Cu- 0.6Mn and A356 alloys", 360 (2003) 372-376.   DOI
4 A. Heidarzadeh, M. Emamy, A. Rahimzadeh, R. Soufi, D. Sohrabi Baba Heidary and Sh. Naibi, J. Mater. Eng. Performance, "The effect of copper addition on the fluidity and viscosity of an Al-Mg-Si alloy", 23 (2014) 469-476.   DOI
5 W. Prukkanon, N. Srisukhumbowornchai and C. Limmaneevichitr, J. Alloys Compd., "Influence of Sc modification on the fluidity of an A356 aluminum alloy", 487 (2009) 453-457.   DOI
6 K.R. Ravi, R.M. Pillai, K.R. Amaranathan, B.C. Pai, and M. Chakraborty, J. Alloys Compounds, "Fluidity of aluminum alloys and composites, a review", 456 (2008) 201-210.   DOI
7 O. Dezellus, M. Zhe, F. Bosselet, D. Rouby and J.C. Viala, Mater. Sci. Eng. A, "Mechanical testing of titanium/aluminiumsilicon interface: Effect of T6 heat treatment", 528 (2011) 2795-2803.   DOI
8 O. Dezellus, L. Milani, F. Bosselet, M. Sacerdote-Peronnet, D. Rouby and J.C. Viala, J. Mater. Sci., "Mechanical testing of titanium/aluminium- silicon interfaces by push-out", 43 (2008) 1749-1756.   DOI
9 B.A. Huchler: Ph.D. Thesis, Univ. Birmingham, UK, "Pressure infiltration behaviour and properties of aluminium alloy - oxide ceramic preform composites", (2009).
10 F. Cardarelli, 'Materials Handbook', Springer (2000) 45-57.
11 V.Y. Mehr, M.R. Toroghinejad and A. Rezaejan, Mater. Sci. Eng. A, "Mechanical properties and microstructure evolutions of multilayered Al-Cu composites produced by accumulative roll bonding process and subsequent annealing", 601 (2014) 40-47.   DOI
12 Kim IK and Hong SI, Mater. Design, "Effect of heat treatment on the bending behavior of tri-layered Cu/Al/Cu composite plates", 47 (2013) 590-598.   DOI
13 E. Hajjari, M. Divandari, S.H. Razavi, T. Homma and S. Kamado, Intermetallics, "Intermetallic compounds and antiphase domains in Al/Mg compound casting", 23 (2012) 182-186.   DOI
14 M. Divandari and A.R. Vahid Golpayegani, Mater. Design, "Study on Al/Cu rich phases formed in A356 alloy by inserting Cu wire in pattern in LFC process", 30 (2009) 3279-3285.   DOI
15 K.J.M. Papis, B. Hallstedt, J.F. Loffler and P.J. Uggowitzer, Acta Mater., "Interface formation in aluminium-aluminium compound casting", 56 (2008) 3036-3043.   DOI
16 Kim HJ, Lee JY, Paik KW, Koh KW, Won JH, Choe SH, Lee J, Moon JT and Park YJ, IEEE Trans. Comp. Packag. Technol., "Effect of Cu/Al intermetallic compound on copper wire and aluminum pad bondability", 26 (2003) 367-374.   DOI
17 Y. Tanaka, M. Kajihara and Y. Watanabe, Mater. Sci. Eng. A, "Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al", 445-446 (2007) 355-363.   DOI