• Title/Summary/Keyword: Al-Al bond

Search Result 335, Processing Time 0.027 seconds

Electrochemical Behaviors of PEO-treated Ti-6Al-4V Alloy in Solution Containing Zn and Si Ions

  • Hwang, In-Jo;Choe, Han-Cheol
    • Proceedings of the Korean Institute of Surface Engineering Conference
    • /
    • 2017.05a
    • /
    • pp.160-160
    • /
    • 2017
  • Commercially pure titanium (Cp-Ti) and Ti alloys (typically Ti-6Al-4V) display excellent corrosion resistance and biocompatibility. Although the chemical composition and topography are considered important, the mechanical properties of the material and the loading conditions in the host have, conventionally. Ti and its alloys are not bioactive. Therefore, they do not chemically bond to the bone, whereas they physically bond with bone tissue. The electrochemical deposition process provides an effective surface for biocompatibility because large surface area can be served to cell proliferation. Plasma electrolyte oxidation (PEO) enables control in the chemical composition, porous structure, and thickness of the TiO2 layer on Ti surface. Silicon (Si) in particular has been found to be essential for normal bone and cartilage growth and development. Zinc (Zn) plays very important roles in bone formation and immune system regulation, and is also the most abundant trace element in bone. The objective of this work was to study on electrochemical behaviors of PEO-treated Ti-6Al-4V Alloy in solution containing Zn and Si ions. The morphology, the chemical composition, and the microstructure analysis of the sample were examined using FE-SEM, EDS, and XRD. The potentiodynamic polarization and AC impedance tests for corrosion behaviors were carried out in 0.9% NaCl solution at similar body temperature using a potentiostat. The promising results successfully demonstrated the immense potential of Si/Zn-TiO2 coatings in dental and biomaterials applications.

  • PDF

Effects of various zirconia surface treatments for roughness on shear bond strength with resin cement (지르코니아의 거칠기 증가를 위한 다양한 표면처리방법이 레진 시멘트와의 전단결합강도에 미치는 영향)

  • Bae, Gang-Ho;Bae, Ji-Hyeon;Huh, Jung-Bo;Choi, Jae-Won
    • Journal of Technologic Dentistry
    • /
    • v.42 no.4
    • /
    • pp.326-333
    • /
    • 2020
  • Purpose: The purpose of this study was to evaluate the effects of various zirconia surface treatment methods on shear bond strength with resin cements. Methods: We prepared 120 cylindrical zirconia specimens (⌀10 mm×10 mm) using computer-aided design/computer-aided manufacturing (CAD/CAM). Each specimen was randomly subjected to one of four surface treatment conditions: (1) no treatment (control), (2) airborne-particle abrasion with 50 ㎛ of Al2O3 (A50), (3) airborne-particle abrasion with 125 ㎛ of Al2O3 (A125), and (4) ZrO2 slurry (ZA). Using a polytetrafluoroethylene mold (⌀6 mm×3 mm), we applied three resin cements (Panavia F 2.0, Super-Bond C&B, and Variolink N) to each specimen. The shear bond strength tests were performed in a universal testing machine. The surfaces of representative specimens of each group were evaluated under scanning electron microscope. We used one-way analysis of variance (ANOVA), two-way ANOVA, and post hoc Tukey honest significant difference test to analyze the data. Results: In the surface treatment method, the A50 group showed the highest bond strength, followed by A125, ZA, and control groups; however, no significant difference was observed between A50 and A125, A125 and ZA, and ZA and control (p>0.05). Among the resin cements, Super-Bond C&B showed the highest shear bond strength, followed by Panavia F 2.0 and Variolink N (p<0.05). Conclusion: Within the limitations of this study, application of airborne-particle abrasion and ZrO2 slurry improved the shear bond strength of resin cement on zirconia.

Bond strength of veneer ceramic and zirconia cores with different surface modifications after microwave sintering

  • Saka, Muhammet;Yuzugullu, Bulem
    • The Journal of Advanced Prosthodontics
    • /
    • v.5 no.4
    • /
    • pp.485-493
    • /
    • 2013
  • PURPOSE. To evaluate the effects of surface treatments on shear bond strength (SBS) between microwave and conventionally sintered zirconia core/veneers. MATERIALS AND METHODS. 96 disc shaped Noritake Alliance zirconia specimens were fabricated using YenaDent CAM unit and were divided in 2 groups with respect to microwave or conventional methods (n=48/group). Surface roughness (Ra) evaluation was made with a profilometer on randomly selected microwave (n=10) and conventionally sintered (n=10) cores. Specimens were then assessed into 4 subgroups according to surface treatments applied (n=12/group). Groups for microwave (M) and conventionally (C) sintered core specimens were as follows; $M_C$,$C_C$: untreated (control group), $M_1,C_1:Al_2O_3$ sandblasting, $M_2,C_2$:liner, $M_3,C_3:Al_2O_3$ sandblasting followed by liner. Veneer ceramic was fired on zirconia cores and specimens were thermocycled (6000 cycles between $5^{\circ}-55^{\circ}C$). All specimens were subjected to SBS test using a universal testing machine at 0.5 mm/min, failure were evaluated under an optical microscope. Data were statistically analyzed using Shapiro Wilk, Levene, Post-hoc Tukey HSD and Student's t tests, Two-Way-Variance- Analysis and One-Way-Variance-Analysis (${\alpha}$=.05). RESULTS. Conventionally sintered specimens ($1.06{\pm}0.32{\mu}m$) showed rougher surfaces compared to microwave sintered ones ($0.76{\pm}0.32{\mu}m$)(P=.046), however, no correlation was found between SBS and surface roughness (r=-0.109, P=.658). The statistical comparison of the shear bond strengths of $C_3$ and $C_1$ group (P=.015); $C_C$ and $M_C$ group (P=.004) and $C_3$ and $M_3$ group presented statistically higher (P=.005) values. While adhesive failure was not seen in any of the groups, cohesive and combined patterns were seen in all groups. CONCLUSION. Based on the results of this in-vitro study, $Al_2O_{3-}$ sandblasting followed by liner application on conventionally sintered zirconia cores may be preferred to enhance bond strength.

Shear bond strength of composite resin to titanium according to various surface treatments

  • Lee, Seung-Yun;Vang, Mong-Sook;Yang, Hong-So;Park, Sang-Won;Park, Ha-Ok;Lim, Hyun-Pil
    • The Journal of Advanced Prosthodontics
    • /
    • v.1 no.2
    • /
    • pp.68-74
    • /
    • 2009
  • STATEMENT OF PROBLEM. When veneering composite resin-metal restoration is prepared, the fact that bond strength between Ti and composite resin is relatively weak should be considered. PURPOSE. The purpose of this study is to evaluate the shear bond strength between the veneering composite resin and commercial pure (CP) Ti / Ti-6Al-4V alloy according to the method of surface treatment. MATERIAL AND METHODS. The disks were cast by two types of metal. Their surfaces were treated by sandblasting, metal conditioner, TiN coating and silicoating respectively. After surface treatment, the disks were veneered by composite resin (Tescera$^{TM}$, Bisco, USA) which is 5 mm in diameter and 3 mm in thickness. The specimens were stored in water at $25^{\circ}C$ for 24 hours, and then evaluated for their shear bond strength by universal testing machine (STM-$5^{(R)}$, United Calibration, USA). These values were statistically analyzed. RESULTS. 1. All methods of surface treatment were used in this study satisfied the requirements of ISO 10477 which is the standard of polymer-based crown and bridge materials. 2. The metal conditioner treated group showed the highest value in shear bond strength of CP Ti, silicoated group, TiN coated group, sandblasted group, in following order. 3. The silicoated group showed the highest value in shear bond strength of Ti-6Al-4V alloy, metal conditioner treated group, sandblasted group, TiN coated group, in following order. CONCLUSION. Within the limitations of this study, all methods of surface treatment used in this study are clinically available.

Improved Stability Sputtered IZO Thin Film Transistor Using Solution Processed Al2O3 Diffusion Layer (Solution-Processed Al2O3 확산층을 이용한 Sputtering IZO Thin Film Transistor의 안정성 향상)

  • Hwang, Namgyung;Lim, Yooseong;Lee, Jeong Seok;Lee, Sehyeong;Yi, Moonsuk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.31 no.5
    • /
    • pp.273-277
    • /
    • 2018
  • This research introduces the sputtered IZO thin film transistor (TFT) with solution-processed $Al_2O_3$ diffusion layer. IZO is one of the most commonly used amorphous oxide semiconductor (AOS) TFT. However, most AOS TFTs have many defects that degrade performance. Especially oxygen vacancy in the active layer. In previous research, aluminum was used as a carrier suppressor by binding the oxygen vacancy and making a strong bond with oxygen atoms. In this paper, we use a solution-processed $Al_2O_3$ diffusion layer to fabricate stable IZO TFTs. A double-layer solution-processed $Al_2O_3$-sputtered IZO TFT showed better performance and stability, compared to normal sputtered IZO TFT.

Preparation of Si(Al)ON Precursor Using Organoaluminum Imine and Poly (Phenyl Carbosilane), and the Compositional Change of the Film with Different Heat Treatment Condition

  • Lee, Yoonjoo;Shin, Dong-Geun;Kwon, Woo Teck;Kim, Soo Ryong;Kim, Younghee
    • Journal of the Korean Ceramic Society
    • /
    • v.52 no.4
    • /
    • pp.243-247
    • /
    • 2015
  • Si(Al)ON precursor was synthesized by formation of new Si-N bond using organoaluminum imine and liquid type poly(phenyl carbosilane). It was decomposed between $200-600^{\circ}C$, and the ceramic yield was 51% after pyrolysis. 150 - 200 nm in thickness of coating film was obtained by spin coating method. The precursor was easily oxidized during process because it was unstable in air. However the oxygen content was limited to 0.5 - 0.7 to silicon in heat treatment step. Even though the content of nitrogen was decreased by pyrolysis, Al-N and Si-N bonds were formed in ammonia atmosphere, and Si(Al)ON film was formed with 0.2 in content to silicon.

A study on the high temperature properties of CoNiCrAlY coating fabricated by HVOF and LPPS process (LPPS용사법과 HVOF 용사법으로 제조된 CoNiCrAlY 코팅의 고온물성에 관한 연구)

  • 강현욱;권현옥;송요승
    • Journal of Surface Science and Engineering
    • /
    • v.34 no.2
    • /
    • pp.161-168
    • /
    • 2001
  • A Thermal Barrier Coating (TBC) can play an important role in protecting parts from harmful environments at high temperatures such as oxidation, corrosion, and wear in order to improve the efficiency of aircraft engines by lowering the surface temperature of the turbine blade. The TBC can increase the life span of the product and improve the operating properties. Therefore, in this study the mechanical and thermal properties of the TBC such as oxidation, fatigue and shock at high temperatures were evaluated. A samples of a bond coat (CoNiCrAlY) produced by the High Velocity Oxygen Fuel (HVOF) and Low Pressure Plasma Spray (LPPS) method were used. The thickness of the HVOF coating layer was approximately $450\mu\textrm{m}$ to 500$\mu\textrm{m}$ and the hardness number of the coating layer was between 350Hv and 400Hv. The thickness of the LPPS coating was about 350$\mu\textrm{m}$ to 400$\mu\textrm{m}$ and the hardness number of the coating was about 370Hv to 420Hv. The X-ray diffraction analysis showed that CoNiCrAlY coating layer of the HVOF and LPPS was composed of the $\beta$and ${\gamma}$phase. After the high temperature oxidation test, the oxide scale with about l0$\mu\textrm{m}$ to 20$\mu\textrm{m}$ thickness appeared at the coating surface on the Al-depleted zone was observed under the oxide scale layer.

  • PDF

Effect of Bonding Process Conditions on the Interfacial Adhesion Energy of Al-Al Direct Bonds (접합 공정 조건이 Al-Al 접합의 계면접착에너지에 미치는 영향)

  • Kim, Jae-Won;Jeong, Myeong-Hyeok;Jang, Eun-Jung;Park, Sung-Cheol;Cakmak, Erkan;Kim, Bi-Oh;Matthias, Thorsten;Kim, Sung-Dong;Park, Young-Bae
    • Korean Journal of Materials Research
    • /
    • v.20 no.6
    • /
    • pp.319-325
    • /
    • 2010
  • 3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.