• Title/Summary/Keyword: Al back contact

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Characteristics of Mono Crystalline Silicon Solar Cell for Rear Electrode with Aluminum and Aluminum-Boron (Aluminum 및 Aluminum-Boron후면 전극에 따른 단결정 실리콘 태양전지 특성)

  • Hong, Ji-Hwa;Baek, Tae-Hyeon;Kim, Jin-Kuk;Choi, Sung-Jin;Kim, Nam-Soo;Kang, Gi-Hwan;Yu, Gwon-Jong;Song, Hee-Eun
    • 한국태양에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.34-39
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    • 2011
  • Screen printing method is a common way to fabricate the crystalline silicon solar cell with low-cost and high-efficiency. The screen printing metallization use silver paste and aluminum paste for front and rear contact, respectively. Especially the rear contact between aluminum and silicon is important to form the back surface filed (Al-BSF) after firing process. BSF plays an important role to reduces the surface recombination due to $p^+$ doping of back surface. However, Al electrode on back surface leads to bow occurring by differences in coefficient of thermal expansion of the aluminum and silicon. In this paper, we studied the properties of mono crystalline silicon solar cell for rear electrode with aluminum and aluminum-boron in order to characterize bow and BSF of each paste. The 156*156 $m^2$ p-type silicon wafers with $200{\mu}m$ thickness and 0.5-3 ${\Omega}\;cm$ resistivity were used after texturing, diffusion, and antireflection coating. The characteristics of solar cells was obtained by measuring vernier callipers, scanning electron microscope and light current-voltage. Solar cells with aluminum paste on the back surface were achieved with $V_{OC}$ = 0.618V, JSC = 35.49$mA/cm^2$, FF(Fill factor) = 78%, Efficiency = 17.13%.

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Characterization and Optimization of the Contact Formation for High-Performance Silicon Solar Cells

  • Lee, Sung-Joon;Jung, Won-Cheol;Han, Seung-Soo;Hong, Sang-Jeen
    • Journal of the Speleological Society of Korea
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    • no.82
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    • pp.5-7
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    • 2007
  • In this paper, p-n junction formation using screen-printed metalization and co-firing is used to fabricate high-efficiency solar cells on single- crystalline silicon substrates. In order to form high-quality contacts, co-firing of a screen-printed Ag grid on the front and Al on the back surface field is implemented. These contacts require low contact resistance, high conductivity, and good adhesion to achieve high efficiency. Before co-firing, a statistically designed experiment is conducted. After the experiment, a neural network (NN) trained by the error back-propagation algorithm is employed to model the crucial relationships between several input factors and solar cell efficiency. The trained NN model is also used to optimize the beltline furnace process through genetic algorithms.

TCAD Simulation을 이용한 LBC Solar Cell의 Local BSF Doping Profile 최적화에 관한 연구

  • An, Si-Hyeon;Park, Cheol-Min;Kim, Seon-Bo;Jang, Ju-Yeon;Park, Hyeong-Sik;Song, Gyu-Wan;Choe, U-Jin;Choe, Jae-U;Jang, Gyeong-Su;Lee, Jun-Sin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.603-603
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    • 2012
  • 최근에 전면 emitter의 doping profile이 다른 selective emitter solar cell은 실제 제작시단파장 영역에서 많은 gain을 얻을 수 없어 LBC 구조의 태양전지에 관한 연구가 많이 진행되고 있다. 본 연구는 TCAD simulation을 이용하여 후면에 형성되는 locally doped BSF(p++) region의 doping profile의 변화에 따른 태양전지 특성에 관한 연구이다. Al으로 형성되는 local back contact의 doping depth 및 surface concentration에 따른 전기적, 광학적 분석을 통해 주도적인 인자를 분석하고 최적화하였다. 특히 doping depth에 따른 변화보다는 surface concentration의 변화에 따른 특성변화가 주도적으로 나타났다.

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실리콘 태양전지 후면 전계 형성 메카니즘 연구

  • Park, Seong-Eun;Song, Ju-Yong;Choe, Cheol-Jong;Tak, Seong-Ju;Kim, Hyeon-Ho;Kim, Seong-Tak;Gang, Min-Gu;Gwon, Sun-U;Yun, Se-Wang;Kim, Dong-Hwan
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2010.05a
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    • pp.38.2-38.2
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    • 2010
  • We have studied mechanisms of back contact formation in Al evaporation and screen printed Al paste for Si solar cells by TEM analysis. We observed that Si diffuse into Al during heat up. The Si diffusion process made vacancies in Si wafer. The Al began to seep into the Si wafer (Al spike). During heat down, the Al spike were shrink which causes the doped region (BSF).

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Pt/Al Reaction Mechanism in the FeRAM Device Integration (FeRAM 소자 제작 중에 발생하는 Pt/Al 반응 기구)

  • Cho Kyoung-Won;Hong Tae-Whan;Kweon Soon-Yong;Choi Si-Kyong
    • Korean Journal of Materials Research
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    • v.14 no.10
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    • pp.688-695
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    • 2004
  • The capacitor contact barrier(CCB) layers have been introduced in the FeRAM integration to prevent the Pt/Al reaction during the back-end processes. Therefore, the interdiffusion and intermetallic formation in $Pt(1500{\AA})/Al(3000{\AA})$ film stacks were investigated over the annealing temperature range of $100\sim500^{\circ}C$. The interdiffusion in Pt/Al interface started at $300^{\circ}C$ and the stack was completlely intermixed after annealing over $400^{\circ}C$ in nitrogen ambient for 1 hour. Both XRD and SBM analyses revealed that the Pt/Al interdiffusion formed a single phase of $RtAl_2$ intermetallic compound. On the other hand, in the presence of TiN($1000{\AA}$) barrier layer at the Pt/Al interface, the intermetallic formation was completely suppressed even after the annealing at $500^{\circ}C$. These were in good agreement with the predicted effect of the TiN diffusion barrier layer. But the conventional TiN CCB layer could not perfectly block the Pt/Al reaction during the back-end processes of the FeRAM integration with the maximum annealing temperature of $420^{\circ}C$. The difference in the TiN barrier properties could be explained by the voids generated on the Pt electrode surface during the integration. The voids were acted as the starting point of the Pt/Al reaction in real FeRAM structure.

ONO Back Surface Passivation and Laser Fired Contact for c-Si Solar Cells

  • Kim, Sang-Seop;Lee, Jun-Gi;Choe, Byeong-Deok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.402-402
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    • 2011
  • 본 연구에서는 결정질 태양전지 제작에 있어 재료비 절감과 기존의 Screen Printing 공정 기술에서의 단점을 보완하기 위한 방안으로 후면 passivation 구조와 레이저를 이용한 국부적 후면 전극 형성(Laser Fired Contact) 방법에 대한 실험을 진행하였다. 후면 passivation 층으로 SiO2/ SiNx/SiO2 삼중막 구조와 SiNx 단일막 구조를 형성시킨 후 anneal 온도에 따른 소수캐리어의 lifetime 변화를 비교하였다. LFC 형성은 2 ${\mu}m$ 두께의 Al이 증착된 기판 후면에 1,064 nm 파장의 레이저를 통해 diameter와 dot pitch 등의 파라미터를 가변 하여 실시하였다. 실험 결과 800$^{\circ}C$의 고온 열처리 후 ONO 삼중막에서의 lifetime 향상이 우세하여 SiNx 단일 막 보다 열적 안정성이 우수함을 확인하였다. LFC 결과 diameter가 40, 50, 60 ${\mu}m$로 가변된 조건에서는 40 ${\mu}m$ 일 경우와 dot pitch가 200, 500, 1,000 ${\mu}m$로 가변된 조건에서는 1,000 ${\mu}m$일 경우 610 mV의 Voc 값을 보였다. 이는 레이저를 통해 국부적으로 Al-Si 간 alloy를 형성시킴으로써 접촉 면적이 최소화됨에 따라 후면에서의 캐리어의 재결합속도를 감소시키고, passivation 효과를 극대화시키기 때문이다.

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Electrical and Optical Characteristics of ZnO:Al Films Prepared by rf Magnetron Sputtering for Thin Film Solar Cells Application (rf 마그네트론 스파터법에 의해 제조된 태양전지용 ZnO:Al 박막의 전기 광학적 특성)

  • Jeon, Sang-Won;Lee, Jeong-Chul;Park, Byung-Ok;Song, Jin-Soo;Yoon, Kyung-Hoon
    • Korean Journal of Materials Research
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    • v.16 no.1
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    • pp.19-24
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    • 2006
  • ZnO:Al(AZO) films prepared by rf magnetron sputtering on glass substrate and textured by post-deposition chemical etching were applied as front contact and back reflectors for ${\mu}c$-Si:H thin film solar cells. For the front transparent electrode contact, AZO films were prepared at various working pressures and substrate temperature and then were chemically etched in diluted HCl(1%). The front AZO films deposited at low working pressure(1 mTorr) and low temperature ($240^{\circ}C$) exhibited uniform and high transmittance ($\geq$80%) and excellent electrical properties. The solar cells were optimized in terms of optical and electrical properties to demonstrate a high short-circuit current.

Analysis of Aluminum Back Surface Field on Different Wafer Specification

  • Park, Seong-Eun;Bae, Su-Hyeon;Kim, Seong-Tak;Kim, Chan-Seok;Kim, Yeong-Do;Tak, Seong-Ju;Kim, Dong-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.216-216
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    • 2012
  • The purpose of this work is to investigate a back surface field (BSF) on variety wafer resistivity for industrial crystalline silicon solar cells. As pointed out in this manuscript, doping a crucible grown Cz Si ingot with Ga offers a sure way of eliminating the light induced degradation (LID) because the LID defect is composed of B and O complex. However, the low segregation coefficient of Ga in Si causes a much wider resistivity variation along the Ga doped Cz Si ingot. Because of the resistivity variation the Cz Si wafer from different locations has different performance as know. In the light of B doped wafer, we made wider resistivity in Si ingot; we investigated the how resistivities work on the solar cells performance as a BSF quality.

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Optimization of ZnO:Al properties for $CuInSe_2$ superstrate thin film solar cell

  • Lee, Eun-U;Park, Sun-Yong;Lee, Sang-Hwan;Kim, U-Nam;Jeong, U-Jin;Jeon, Chan-Uk
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2010.05a
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    • pp.36.1-36.1
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    • 2010
  • While the substrate-type solar cells with Cu(In,Ga)Se2 absorbers yield conversion efficiencies of up 20%[1], the highest published efficiency of Cu(In,Ga)Se2 superstrate solar cell is only 12.8% [2]. The commerciallized Cu(In,Ga)Se2 solar cells are made in the substrate configuration having the stacking sequence of substrate (soda lime glass)/back contact (molybdenum)/absorber layer (Cu(In,Ga)Se2)/buffer layer (cadmium sulfide)/window layer (transparent conductive oxide)/anti reflection layer (MgF2) /grid contact. Thus, it is not possible to illuminate the substrate-type cell through the glass substrate. Rather, it is necessary to illuminate from the opposite side which requires an elaborate transparent encapsulation. In contrast to that, the configuration of superstrate solar cell allows the illumination through the glass substrate. This saves the expensive transparent encapsulation. Usually, the high quality Cu(In,Ga)Se2 absorber requires a high deposition temperature over 550C. Therefore, the front contact should be thermally stable in the temperature range to realize a successful superstrate-type solar cell. In this study, it was tried to make a decent superstrate-type solar cell with the thermally stable ZnO:Al layer obtained by adjusting its deposition parameters in magnetron sputtering process. The effect of deposition condition of the layer on the cell performance will be discussed together with hall measurement results and current-voltage characteristics of the cells.

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The Fabrication of (Ga, Al) As/GaAs Modified Multi-Quantum Well Laser Diode by MOCVD (MOCVD법에 의한 (Ga, Al) As/GaAs 변형된 영지우물 레이저 다이오드의 제작)

  • Kim, Chung-Jin;Kang, Myung-Ku;Kim, Yong;Eom, Kyung-Sook;Min, Suk-Ki;Oh, Hwan-Sool
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.29A no.9
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    • pp.36-45
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    • 1992
  • The Modified Multi-Quantum Well(MMQWAl) structures have been grown by Mental-Organic chemical Vapor Deposition(MOCVD) method and stripe type MMQW laser diodes have been investigated. In the case of GaAs/AlGaAs superlattice and quantum well growth by MOCVD, the periodicity, interface abruptess, Al compositional uniformity and layer thickness have been confirmed though the shallow angle lapping technique, double crystal x-ray diffractometry (DCXD) and photoluminescence (PL) measurement. stripe-type MMQW laser diodes have been fabricated using the process technology of photolithography, chemical etching, ohmic contact, back side removing and cleaving. As the result of the electrical and opticalmeasurement of these laser diodes, we have achieved the series resistance of $1[\Omega}~2{\Omega}$ by current-voltage measurements, the threshold current of 200-300mA by currnt-light measurements and the lasing wavelength of 8000-8400$\AA$ by lasing spectrum measurements.

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