• Journal of Welding and Joining
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• 제21권2호
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• pp.97-101
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

• 열처리공학회지
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• 제7권4호
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• pp.270-276
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• 1994

The effects of thermomechanical and duplex aging treatment on precipitation behavior were investigated for the 8090 aluminium alloy by tensile test, hardness test, plane-strain fracture toughness test and electron microscope. Both pre-aging stretch and duplex aging with pre-aging stretch were effective to homogenize the distribution of S' phase in this alloys. The latter makes more homogeneous distribution of S' phase than that of the former, but the sizes of S' phase in both specimens are almost same. The size and distribution of 0' phase were not changed by thermomechanical or duplex aging treatment. The strength was increased by thermomechanical treatment, but the elongation was decreased. Duplex aging treatment couldn't change the strength and elongation. Pre-aging stretch and duplex aging with pre-aging stretch have same effect on the strength and elongation. The increase of strength by thermomechanical treatment in 8090 alumunium alloy was caused by homogeneously precipitated S' phase.

• 한국구조물진단유지관리공학회 논문집
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• 제3권3호
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• pp.157-165
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• 1999

The nondestructive testing methods are commonly used to determine the in-situ compressive strength of concrete. The correlation curves to evaluate the effect of aging on the development of concrete strength was proposed. Thirty two ${\Phi}10{\times}20cm$ cylinder specimens were cast from 5 batches having different strength levels. The correlation curves for rebound hammer method, ultrasonic pulse velocity method and combined method were derived from the laboratory tests and multiple regression analysis. To account for the change of condition such as surface hardness, internal moisture contents, the aging coefficients are applied to the correlation curves. From the comparison the nondestructive strength with the core strength taken from the existing reinforced concrete structures, the validity of the proposed correlation curves are verified.

• Journal of Welding and Joining
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• 제18권3호
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• 콘크리트학회논문집
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• 제12권6호
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• pp.23-34
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• 2000

This paper reports the effects of curing temperature and aging on the strength and the modulus of elasticity. In oder to determine the strength and the modulus of elasticity with curing temperature and aging, experimental and analytical methods are adopted. The tests of 480 cylinders are carried out for type I, V and V with 15 percent replacement of fly ash cement concretes, which are cured at isothermal conditions of 10, 23, 35 and 5$0^{\circ}C$. and the concrete cylinders are tested at the ages of 1, 3, 7 and 28 days. According to the experimental results, the concrete subjected to high temperature at early ages attaines higher early-age compressive and splitting tensile strength but eventually attaines lower later-age compressive and splitting tensile strength. Even if modulus of elasticity has the same tendency, the variation of modulus of elasticity with curing temperature is smaller than that of compressive strength. Based on these experimental results, the relationships among compressive strength, modulus of elasticity and splitting tensile strength are proposed considering the effects of curing temperature, aging and cement type.

• 한국전기전자재료학회논문지
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• 제16권12호
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• pp.1136-1141
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• 2003

The primary insulation materials used in an oil filled transformer are kraft paper, wood, porcelain and oil. Modern transformers use chemically treated paper to improve its tensile strength and resistance to aging caused by immersion in oil. But these insulation papers are mainly aged by thermal stress. Over the life time of the insulation paper and oil, it is exposed to high temperatures, oxygen and water. Its interaction with the steel of the tank and core plus the copper and aluminium of the windings will eventually cause the chemical properties of the oil to decay. High temperature have an effect on mechanical strength of cellulous paper used in the layer insulation. We made two aging cells in which insulation papers and mineral oil are conducted to test thermal properties. It is measured dielectric strength, number of acid, moisture, etc. of insulation paper and oil aged in the aging cells.

• Journal of Welding and Joining
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• 제20권5호
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• pp.72-77
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• 전기학회논문지
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• 제59권4호
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• pp.693-699
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• 2010

General transformer's life is known as paper insulation' life. If a transformer is degraded by these aging factors, it is known that electrical, mechanical and chemical characteristics for transformer's oil-paper are changed. When the kraft paper is aged, the cellulose polymer chains break down into shorter lengths. It causes decrease in both tensile strength and degree of polymerization of paper insulation. The paper breakdown is accompanied by an increase in the content of furanic compounds within the dielectric liquid. In this paper it is aimed at analysis on correlation between aging characteristics for insulating diagnosis of thermally aged paper. For investigating the accelerated aging process of oil-paper samples accelerating aging cell was manufactured for estimating variation of paper insulation during 500 hours at $140^{\circ}C$ temperature. To derive the results, it was performed analysis such as tensile strength(TS), depolymerization(DP), dielectric strength(DS), relative permittivity, water content(WC) and furan compound(FC) for aged paper. Also for analyzing correlation between insulating degradation characteristics, we used linear regression method. As as results of linear regression analysis, there was a close correlation between TS and DP. WC, FC. But dielectric strength was a weak correlation with aging time.

• The Journal of Advanced Prosthodontics
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• 제7권2호
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• pp.108-114
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• 2015

PURPOSE. The aim of this study was to evaluate effect of different surface treatment methods on the bond strength between aged composite-resin core and luting agent. MATERIALS AND METHODS. Seventy-five resin composites and also seventy-five zirconia ceramic discs were prepared. 60 composite samples were exposed to thermal aging (10,000 cycles, 5 to $55^{\circ}C$) and different surface treatment. All specimens were separated into 5 groups (n=15): 1) Intact specimens 2) Thermal aging-air polishing 3) Thermal aging- Er:YAG laser irradiation 4) Thermal aging- acid etching 5) Thermal-aging. All specimens were bonded to the zirconia discs with resin cement and fixed to universal testing machine and bond strength testing loaded to failure with a crosshead speed of 0.5 mm/min. The fractured surface was classified as adhesive failure, cohesive failure and adhesive-cohesive failure. The bond strength data was statistically compared by the Kruskal-Wallis method complemented by the Bonferroni correction Mann-Whitney U test. The probability level for statistical significance was set at ${\alpha}$=.05. RESULTS. Thermal aging and different surface treatment methods have significant effect on the bond strength between composite-resin cores and luting-agent (P<.05). The mean baseline bond strength values ranged between $7.07{\pm}2.11$ and $26.05{\pm}6.53$ N. The highest bond strength of $26.05{\pm}6.53$ N was obtained with Group 3. Group 5 showed the lowest value of bond strength. CONCLUSION. Appropriate surface treatment method should be applied to aged composite resin cores or aged-composites restorations should be replaced for the optimal bond strength and the clinical success.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.204-207
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• 2003

The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.