• 제목/요약/키워드: Aging Condition

검색결과 828건 처리시간 0.028초

室溫時效 및 變形時效가 微小 疲勞크랙의 開口變位에 미치는 影響 (Influence of Room Temperature and Strain Aging on the COD for a Small Fatigue Crack)

  • 김민건
    • 대한기계학회논문집
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    • 제19권2호
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    • pp.402-407
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    • 1995
  • The effects of room temperature and strain aging treatment are discussed on the critical condition for the onset of growth of non-propagating cracks on 0.15% C low carbon steel, with special emphasis on the length of the critical non-propagating crack and on the crack opening displacement(COD) at the crack tip. It is found from the experimental analysis that room temperature and strain aging of a fatigue pre-cracked specimen introduced the closure of a crack tip of the pre-crack and the reduction of crack opening displacement at the wake of crack, together with an improvement in crack growth resistance of the microstructure. This may cause an increase in the endurance limit of the specimen, through the enhancement of effective stress for the onset of growth of the critical non-propagating crack.

Study on Aging Characteristics and Chemical Composition of Hydrogenated Transformer Oil

  • Qian, Yi-Hua;Huang, Yi-Bin;Fu, Qiang;Zhong, Zhen-Sheng
    • Journal of Electrical Engineering and Technology
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    • 제8권3호
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    • pp.588-594
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    • 2013
  • Under the condition of Baader aging, the chemical composition variation and the influence of transformer oil aging on electrical properties such as dielectric loss factor and physic-chemical properties such as interfacial tension were studied in the aging precess. Moreover, the correlation between hydrogenated transformer oil electrical and physic-chemical properties and its chemical composition variation were also investigated. The results show that these parameters of physic-chemical and electrical properties of hydrogenated transformer oil relate to each other and have closed correlation with chemical composition.

마이크로 솔더 범프의 전단강도와 시효 특성 (Aging Characteristic of Shear Strength in Micro Solder Bump)

  • 김경섭;유정희;선용빈
    • Journal of Welding and Joining
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    • 제20권5호
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    • pp.72-77
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    • 2002
  • Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

Aging in Place를 위한 재가노인복지서비스에 관한 연구 (A Study on the Welfare Service of the Elderly People for Aging in Place)

  • 조인숙;박남희;신화경
    • 한국주거학회:학술대회논문집
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    • 한국주거학회 2005년도 추계학술대회 논문집
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    • pp.371-374
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    • 2005
  • As the aging of this society, instead of growing numbers old protective functions of families decreased according to increasing tendency of nuclear families, increasing rates of females' participation of economic activities. Now, the problem of supporting the old is in need of social supporting system the cope with this are based on these factors are like this: 1) It is necessarily the instruction of medical welfare service. 2) The overlapped service is avoided and the service of specialized. 3) Most of the welfare service institution is Seoul and local city hall, so it needs the institution is transferred. 4) It needs the increase the number of home helper. 5) When the service is offered, the government must considers finance, elderly health condition and preference. 6) It needs the department for the welfare service for the old who stay at home.

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고신뢰성 광모듈을 위한 솔더 범프의 전단강도와 시효 특성 (Shear Strength and Aging Characteristics in Solder Bumps for High Reliability Optical Module)

  • 유정희
    • Journal of Welding and Joining
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    • 제21권2호
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    • pp.97-101
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    • 2003
  • The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

광모듈 솔더 접합부의 시효 특성에 관한 연구 (Aging Characteristics of Solder bump Joint for High Reliability Optical module)

  • 김남규;김경섭;김남훈;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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    • pp.204-207
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    • 2003
  • The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.

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7050 AI 합금의 가공열처리가 미세조직변화와 피로성질에 미치는 영향 (The Effect of Thermomechanical Treatment on the Microstructural Changes and Fatigue Properties in 7050 Al Alloy)

  • 김문호;권숙인
    • 열처리공학회지
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    • 제4권4호
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    • pp.24-33
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    • 1991
  • The effects of thermomechanical treatments on microstructure and fatigue properties of 7050 Al alloy were investigated. The precipitation kinetics changed to a faster rate due to cold deformation employed in this special TAHA thermomechanical treatments including pre-aging, plastic deformation and two step final-aging. The G.P. zones in the under-aged condition were cut by dislocations and dissolved during the plastic deformation. During the low cycle fatigue, the T6' condition showed cyclic hardening behavior whereas the TMT5, TMT27 and T76 conditions showed cyclic softening at above 0.7% total strain amplitudes. The ${\Delta}K_{th}$ value of TMT27 was improved more than two times, compared with that of T76 condition. The T6' with small shearable precipitates resulted in the markedly high ${\Delta}K_{th}$ value. This is thought to be resulted from dislocation reversibility and roughness-induced crack closure due to planarity of slip.

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숙성 조건 변화에 의한 흑마늘의 이화학적 특성변화 (Changes in Physicochemical Properties and by the Aging Conditions of Garlic)

  • 서보영
    • 한국산업융합학회 논문집
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    • 제25권1호
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    • pp.21-26
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    • 2022
  • When garlic is aged for a certain period of time while maintaining proper humidity, it causes a browning reaction by its own ingredients and enzymes. In this study, the physicochemical properties were analyzed by varying the temperature conditions for aging garlic. It was found that about 20% of the weight of garlic was reduced through the aging process. During the aging process, both samples showed the highest water content on the 10th day of aging, and the water content of the two samples was similar after the aging was completed. In the analysis of total sugar content change, AG1 (22.0±0.7 vs 21.4±0.6) showed a significantly higher sugar content on the 10th day of aging, but showed a tendency to gradually decrease thereafter, whereas AG2 showed a steady increase in sugar content during the aging process (18.7 < 21.4 < 21.7 < 22.3 < 23.7). The pH change that occurred during the aging process showed the most pH change on the 10th day. In AG1, the pH gradually decreased as the aging period increased, whereas in AG2, the pH increased significantly after the 10th day. In the analysis of browning, AG1 increased sharply on the 10th day and maintained the state, and AG2 showed a significant increase in browning according to the aging process. In conclusion, based on the results of this study, if various ripening temperature conditions are set, it is judged that it will play a positive role in improving the productivity of black garlic.

예방 관리 기능을 갖는 시스템의 가용도 분석 (Availability Analysis of a System with Preventive Maintenance)

  • 이유태
    • 한국정보통신학회논문지
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    • 제23권7호
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    • pp.869-874
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    • 2019
  • 노화에 의한 시스템의 예기치 않은 장애 발생은 예방 관리 기능을 수행함으로써 줄일 수 있으며, 이를 통해 시스템의 가용도를 높일 수 있다. 예방 관리 기법은 크게 시간 기반과 조건 기반의 두 가지로 나눌 수 있다. 시간 기반 방식은 정해진 시간 간격마다 수행되고, 조건 기반 방식은 시스템 상태가 특정 조건을 만족할 때 수행된다. 조건 기반 방식은 시간 기반 방식과 비교했을 때 예방 관리의 효율성을 향상시킬 수 있다는 장점이 있다. 본 논문은 노화 상태에서 일정 시간이 지난 후 예방 관리를 수행하게 되는 시스템을 분석할 수 있는 확률 모형을 제시한다. 제시한 모형은 현실적인 상황을 반영하여 비 마르코비안 모형으로 모델링한다. 해당 확률 모형을 수학적으로 해석하여 정상 상태에서의 시스템 가용도와 수익을 분석한다.

중년 여성들의 노화인식에 영향을 미치는 복합적 요인 (The Convergent factors influencing of the Middle Aged Women's Perceived Aging)

  • 정문신;권혜진
    • 디지털융복합연구
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    • 제15권2호
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    • pp.493-501
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    • 2017
  • 본 연구는 서울 및 경기도에 거주하는 40~50대 중년기 여성 230명을 대상으로 건강상태, 생활습관, 심리적 상태에 따른 노화인식을 조사하여 중년기에 급격하게 진행되는 노화를 예방하고 신체적, 정신적으로 건강한 노후를 맞이할 수 있는 미용적 대안을 제시하고자 하였다. 자료수집은 2015년 7월 25일부터 2015년 9월1일까지 진행하였으며, 빈도분석, 독립표본 t-test, ANOVA 및 Duncan test로 분석하였다. 연령이 높을수록 폐경비율이 높았고, 음주, 운동량, 수면시간이 줄어든 반면 스트레스와 심리적 압박감은 더 큰 것으로 나타났다. 폐경여부에 따라 안면노화의 상태는 유의미한 차이를 보였고(${\chi}^2=39.692^{***}$, p<.001), 여가(취미)활동의 여부에 따라서도 차이를 나타냈다(${\chi}^2=22.470^{***}$, p<.01). 또, 노화의 진행정도, 노화에 대한 불안감, 개선을 위한 노력 등의 항목에서 연령이 높을수록, 폐경에 가까울수록 부정적인 인식을 보여 50세 전후의 노화와 폐경은 매우 자연스러운 현상이지만 제2의 사춘기와도 같은 이 시기를 겪는 40~50대 중년기 여성들을 위한 미용적 대안이 마련된다면 성공적 노후를 맞이하는데 도움이 될 것으로 생각된다.