• Analytical Science and Technology
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• v.20 no.1
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• pp.49-54
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• 2007

For the practical use as a biosensor, a rubber electrode bound by polybutadiene was newly devised for the determination of hydrogen peroxide. Then its electrochemical behaviors were investigated. The signal could be obtained at low electrode potential between 0.0 ~ -0.5 V (vs. Ag/AgCl) with a detection limit of $1.4{\times}10^{-4}M$ and its potential dependence was linear in the experimental range. Especially its Lineweaver-Burk plot showed a very good linearity giving the evidence of a good enzyme immobilization on the surface of the electrode. And mechanical stability of the electrode resulted from using rubber binder presented a new possibility for the practical use of biosensor.

• Journal of Welding and Joining
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• v.29 no.5
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• pp.95-98
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• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.92-92
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• 2008

PDP의 저가화, 친환경화, 고화질화는 타 디스플레이와 경쟁을 위해 필수적이고 그로 인한 소재의 개발이 필요하다. 저가화는 부품, 공정에서도 가능하지만 소재에서의 원가가 상당부분을 차지하고 있기 때문에 소재 개발이 중요하며, 친환경화는 현재 유전체에서 많이 사용되고 있는 유해소재를 친환경 소재로 대체함으로써 개발이 이루어지고 있다. 그래서 우리는 현재 PDP에서 전극물질로 사용되어지는 고가의 Ag를 Gu입자에 Ag 박막으로 코팅한 Ag/Cu 전극 powder를 사용하여 저가의 전극 paste를 만들고 스크린 프린터와 노광장비를 사용하여 전극을 형성하였다. 그 후 친환경적인 Pb free 투명유전체를 입히고 전극과의 상호 매칭성을 연구 하였다. 결과적으로 기존 PDP 공정에서 볼 수 없었던 황변현상, 전극착색현상, 전극입자의 터짐성 등 많은 현상이 일어났지만, 기존 공정 온도보다 낮은 온도로 공정한 결과, 이러한 문제들이 줄어드는 것을 확인하였다. 이로써 공정단가의 저가화와 제품의 친환경을 가면서도 기존과 차이가 제품을 실현할 수 있을 것이다.

• 프린팅코리아
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• v.12 no.2
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• pp.102-107
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• 2013

한국인쇄학회는 지난해 11월 2일 추계학술논문을 발표했다. 추계학술논문에는 Reverse Offset에서 잉크전이 유동에 관한 시뮬레이션 연구, 그라비어 오프셋 인쇄에 의한 미세전극용 Ag Paste 개발, 국내 하프톤 스크린 인쇄를 위한 최적의 스크린 망사 선택 방법에 관한 연구, 친환경과 표준인쇄를 고려한 인쇄 최적화에 관한 연구 등이 발표됐다. 본지에서는 김준곤, 구철회, 조가람(부경대학교 공과대학 인쇄정보공학과)의 '친환경과 표준인쇄를 고려한 인쇄 최적화에 관한 연구'를 게재한다.

• 프린팅코리아
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• v.11 no.12
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• pp.116-119
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• 2012

2012년 한국인쇄학회 추계학술논문발표회가 지난 11월 2일 동국대학교 문화관 덕암세미나실에서 열렸다. 올해 창립 30주년을 맞은 한국인쇄학회는 이번 추계학술논문발표회에서 Reverse Offset에서 잉크전이 유동에 관한 시뮬레이션 연구, 그라비어 오프셋 인쇄에 의한 미세전극용 Ag Paste 개발, 국내 하프톤 스크린 인쇄를 위한 최적의 스크린 망사 선택 방법에 관한 연구, 친환경과 표준인쇄를 고려한 인쇄 최적화에 관한 연구 등을 발표했다. 본지에서는 김준곤, 구철회, 조가람(부경대학교 공과대학 인쇄정보공학과)의 '친환경과 표준인쇄를 고려한 인쇄 최적화에 관한 연구'를 게재한다.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Journal of Applied Biological Chemistry
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• v.60 no.3
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• pp.279-282
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• 2017

Chloride is known as the most important anion in salt-affected soils. We observed the degree of EC change upon AgCl precipitation was quantitatively related with the chloride concentration. Method validation and intercomparison with ion chromatography revealed the proposed method can provide rapid and moderately precise chloride concentrations in salt-affected soils.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.323-323
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• 2013

High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

• Journal of Surface Science and Engineering
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• v.49 no.1
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• pp.54-61
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• 2016

Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.91-97
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• 2022

The wettability and rheological properties of solder paste with the size of the solder powder were evaluated. To formulate the solder paste, three types of solder powder were used: T4 (20~28 ㎛), T5 (15~25 ㎛), and T6 (5~15 ㎛). The viscosities of the T4, T5, and T6 solder pastes at 10 RPM were 155, 263, and 418 Pa·s, respectively. After 7 days, the viscosity of the T4 solder paste slightly increased by 2.6% and that of T5 was increased by 20.6%. The viscosity of the T6 solder paste after 7 days could not be measured due to high viscosity. The viscosity variation with solder particle size also affected on the printability of the solder. In the case of the T4 solder paste, printability, slump, bridging, and soldering properties were excellent. On the other hand, T5 showed slight dewetting and solder ball defects. Especially, T6, which the smallest powder size, showed poor printability and dewetting at the edge of solder.