• Title/Summary/Keyword: Ag-ink

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Synthesis of Concentrated Cu-Ag Nano Sol for Ink-Jet Method

  • Park, Han-Sung;Choi, Young-Min;Ryu, Beyong-Hwan
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1370-1373
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    • 2006
  • The Cu-Ag nanoparticles have been synthesized in aqueous medium using a hydrazine reduction method. The assisted role of polymeric dispersant on synthesis of highly concentrated Cu-Ag nanoparticles was studied. The 30wt% of Cu-Ag nanoparticles with the range of 10 nm in diameter was prepared.

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Microstructure and Electrical Resistivity of Ink-Jet Printed Nanoparticle Silver Films under Isothermal Annealing (잉크젯 프린팅된 은(Ag) 박막의 등온 열처리에 따른 미세조직과 전기 비저항 특성 평가)

  • Choi, Soo-Hong;Jung, Jung-Kyu;Kim, In-Young;Jung, Hyun-Chul;Joung, Jae-Woo;Joo, Young-Chang
    • Korean Journal of Materials Research
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    • v.17 no.9
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    • pp.453-457
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    • 2007
  • Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.

A Printing Process Combining Screen Printing with Reverse Off-set for a Fine Patterning of Electrodes on Large Area Substrate (스크린 인쇄와 리버스 오프셋 인쇄를 혼합한 대면적 미세 전극용 인쇄공정)

  • Park, Ji-Eun;Song, Chung-Kun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.5
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    • pp.374-380
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    • 2011
  • In this paper a printing process for patterning electrodes on large area substrate was developed by combining screen printing with reverse off-set printing. Ag ink was uniformly coated by screen printing. And then etching resist (ER) was patterned in the Ag film by reverse off-set printing, and then the non-desired Ag film was etched off by etchant. Finally, the ER was stripped-off to obtain the final Ag patterns. We extracted the suitable conditions of reverse Using the process we successfully fabricated gate electrodes and scan bus lines of OTFT-backplane used for e-paper, in which the diagonal size was 6 inch, the resolution $320{\times}240$, the minimum line width 30 um, and sheet resistance 1 ${\Omega}/{\Box}$.

Laser Sintering of Silver Nanoparticle for Flexible Electronics (유연소자 응용을 위한 은 나노입자의 레이저 소결)

  • Jia, Seok Young;Park, Won Tea;Noh, Yong-Young;Chang, Won Seok
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.1
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    • pp.135-139
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    • 2015
  • We present a fine patterning method of conductive lines on polyimide (PI) and glass substrates using silver (Ag) nanoparticles based on laser scanning. Controlled laser irradiation can realize selective sintering of conductive ink without damaging the substrate. Thus, this technique easily creates fine patterns on heat-sensitive substrates such as flexible plastics. The selective laser sintering of Ag nanoparticles was managed by optimizing the conditions for the laser scan velocity (1.0-20 mm/s) and power (10-150 mW) in order to achieve a small gap size, high electrical conductivity, and fine roughness. The fabricated electrodes had a minimum channel length of $5{\mu}m$ and conductivity of $4.2{\times}10^5S/cm$ (bulk Ag has a conductivity of $6.3{\times}10^5S/cm$) on the PI substrate. This method was used to successfully fabricate an organic field effect transistor with a poly(3-hexylthiophene) channel.

Analysis of Ink Transfer Mechanism in Gravure-offset Printing Process (그라비아 옵셋 프린팅 공정에서의 잉크전이 메커니즘 해석 연구)

  • Lee, Seung-Hyun;Nam, Ki-Sang;Lee, Taik-Min;Yoon, Deok-Kyun;Jo, Jeong-Dai
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.10
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    • pp.1146-1152
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    • 2011
  • Ink transfer process is very important to determine quality of printed pattern, therefore its mechanism should be understood to control printing quality. Although there have been many attempts to understand ink transfer mechanism by numerical simulation and experimental studies, their model was too much simple to model realistic printing process and our understanding is not enough yet. In this paper we designed ink transfer visualization system to present flow visualization of ink transfer process for gravure offset printing. We considered rotational effect of blanket roll which is related with printing speed and used non-Newtonian fluid as working fluid such as Ag paste. For printing unit, cantilever-type blanket roll is used for convenient visualization of ink transfer. Serial images were captured continuously by using high-speed CMOS camera and long range microscope. We investigated the effects of various design parameters such as printing speed and pattern angle on the ink transfer process. We found more stretched ink filament for non-Newtonian fluid than Newtonian fluid. As increasing printing speed, length of stretched ink filament and height of break-up point are also increased. We also compared ink transfer process between CD and MD pattern and its relationship with ink transfer mechanism.

Optimising Ink Setting Properties on Double Coated Wood-free Papers

  • Bluvol, Guillermo;Carlsson, Roger
    • Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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    • 2006.06b
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    • pp.215-225
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    • 2006
  • Today's requirements for print-press runnability and print quality demand an optimised absorption and adhesion of printing ink on the paper surface. Modern coating concepts for high glossing offset grades use ultra fine pigments, whereas binder level has continuously been decreased to a minimum in recent years to achieve the highest possible sheet gloss development and for economical reasons. Both the ultra fine pigments and the reduced binder levels lead in many cases to a faster ink setting rate. On the other hand, matt paper grades use relatively coarse pigments leading to a slow ink setting compared to the high glossing papers. Both too fast and too slow ink setting properties implicate drawbacks in print quality and print press runnability. The mechanisms behind the interactions between ink and coating have been presented in many previous publications. The purpose of this study was to determine and quantify how the ink setting rate is influenced by pigment system (GCC and GCC/clay blends), latex level and latex properties in the topcoat of double coated sheet fed offset paper. The roles of binder level and type in the precoat were also assessed. The effect of calendering (temperature and pressure) was studied with one formulation. The resulting ink setting characteristics were tested using three different laboratory testing instruments. The correlation amongst the different laboratory testing methods is discussed. The results show that by varying the latex properties, the pigment system and/or latex addition level, the ink tack development of ink applied to a topcoat pigment system can be significantly influenced. It can be slowed down as often desired with ultra fine pigments or speeded up in the case of coarse pigments. There was no visible effect on the ink setting rate by using different binder systems in the precoat..

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Fabrication of ZnO TFTs by micro-contact printing of silver ink electrodes

  • Shin, Hong-Sik;Yun, Ho-Jin;Nam, Dong-Ho;Choi, Kwang-Il;Baek, Kyu-Ha;Park, Kun-Sik;Do, Lee-Mi;Lee, Hi-Deok;Wang, Jin-Suk;Lee, Ga-Won
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1600-1603
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    • 2009
  • In this work, we have fabricated inverted staggered ZnO TFTs with 1-${\mu}m$ resolution channel length by micro contact printing (${\mu}$-CP) method. Patterning of micro scale source/drain electrodes without etching is successfully achieved by micro contact printing method by using silver ink and polydimethylsiloxane (PDMS) stamp. And the time dependent characteristics of the sheet resistance show that Ag inklayer could be used as source and drain electrodes for ZnO TFTs.

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Silver nano-ink formulation based on alcohol and its application to inkjet printing (알코올 용제의 은 나노 잉크 제조와 프린팅 기술의 응용)

  • Cho, Hye-Jin;Kim, Tae-Hoon;Joung, Jae-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.551-552
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    • 2006
  • This study was attended to demonstrate synthesis of silver nanoparticles stabilized with polymer and their applicability to printed electronics. Silver nanoparticles were synthesized by reduction of silver nitrate in aqueous solution in the presence of polyvinyl pyrrolidone (PVP) as a stabilizer. The ink used here is composed of 50 wt% Ag NP, 15 wt% humectant and then were printed on polyimide film. Particle deposit morphologies were controlled by varying the ink compositions. Printed silver patterns and dots were cured on a convection oven in air at $300^{\circ}C$ for 60 min. The printed patterns show good shape definition and the resistivity of the printed films is about $5{\mu}{\Omega}{\cdot}cm$.

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printing 방식을 이용한 은 나노 잉크 직접 패터닝 기술

  • O, Sang-Cheol;Yang, Gi-Yeon;Han, Gang-Su;Lee, Heon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.63-63
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    • 2010
  • 나노 구조를 제작은 나노 기술을 기반으로 하는 electronics, optoelectronics, sensing, ultra display등의 여러 분야에서 이용되고 있다. 특히 나노 구조를 갖는 금속 패터닝의 경우 전자빔 리소 그래피 (electron beam lithography)나 레이저 패터닝(laser patterning)과 같은 방법들이 많이 사용되고 있다. 하지만 공정이 복잡하고 그로 인해 공정 비용이 많이 든다는 단점이 있었다. 나노 임프린트 리소그래피 기술은 master mold 표면의 나노 패턴을 가열, 가압 공정을 통해 기판 위의 고분자 레지스트 층으로 전사하는 기술이다. 이 기술은 간단한 공정을 통해 나노 패턴을 형성할 수 있는 기술이기 때용에 차세대 나노 패터닝 기술로써 각광받고 있다. 특히 이 기술은 레지스트 층과의 직접적인 접촉을 통해 나노 패턴을 형성하기 때문에 다양한 방법을 통해 기능성 나노 패턴을 직접적으로 형성할 수 있는 가능성을 지니고 있다. 본 연구는 novel meta1의 하나인 Ag 입자가 첨가된 ink solution를 master mold로부터 복제한 PDMS mold를 이용하여 다양한 구조의 나노 패턴을 만드는 방법에 대한 연구이다.

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Fabrication of 1-${\mu}m$ channel length OTFTs by microcontact printing

  • Shin, Hong-Sik;Baek, Kyu-Ha;Yun, Ho-Jin;Ham, Yong-Hyun;Park, Kun-Sik;Lee, Ga-Won;Lee, Hi-Deok;Wang, Jin-Suk;Lee, Ki-Jun;Do, Lee-Mi
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1118-1121
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    • 2009
  • We have fabricated inverted staggered pentacene Thin Film Transistor (TFT) with 1-${\mu}m$ channel length by micro contact printing (${\mu}$-CP) method. Patterning of micro-scale source/drain electrodes without etching was successfully achieved using silver nano particle ink, Polydimethylsiloxane (PDMS) stamp and FC-150 flip chip aligner-bonder. Sheet resistance of the printed Ag nano particle films were effectively reduced by two step annealing at $180^{\circ}C$.

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