• Journal of the Korean institute of surface engineering
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• v.56 no.1
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• pp.77-83
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• 2023

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.

• Advances in nano research
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• v.4 no.4
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• pp.281-294
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• 2016

The advantages of nano-scale materials (size 1-99 nm in at least in one dimension) could be realized with their potential applications in diversified avenues. Herein, we report for the first time on the successful synthesis of homogeneous epoxy coatings containing phytogenic silver nanoparticles (Ag) on PVC and glass substrates by room-temperature curing of fully mixed epoxy slurry diluted by acetone. Alstonia scholaris bark extract was used to reduce and stabilize the silver ions. The surface morphology and mechanical properties of these coatings were characterized using the techniques like, UV-Vis (UV-Visible) spectrophotometry, X-ray diffraction (XRD), Fourier transform infrared spectrophotometry (FT-IR), Epifluorescence microscopy and scanning electron microscopy (SEM). The effect of incorporating Ag nanoparticles on the biofilm (scale) resistant epoxy-coated PVC was investigated by total viable counts ($CFU/cm^2$) from epoxy coating from (Initial) $1^{st}$ day to $25^{th}$ days. The phytogenic Ag nanoparticles were found to be significantly improving the microstructure of the coating matrix and thus enhanced the anti-biofilm performance of the epoxy coating. In addition, the antimicrobial mechanism of Ag nanoparticles played an important role in improving the anti-biofilm performance of these epoxy coatings.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.247-248
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• 2006

Bulk YBCO 초전도체는 top-seeded melt-growth 방법으로 제조되었다. YBCO bulk는 Epoxy resin과 $AgNO_3$를 보강해 초전도체의 기계적 강도를 향상하고자 하였다. Epoxy resin은 보강 재료인 STYCAST 2850-FT와 경화제인 CATALYST 24LV 를 100:5 비율로 혼합하여 제조한 후 mould에 넣고 $66^{\circ}C$에서 2시간 열처리 하였다 (rotary pump로 진공 분위기 조성). $AgNO_3$는 $350^{\circ}C$에서 2시간, $450^{\circ}C$에서 1시간 열처리 하여 Ag와 $NO_3$의 분리 후 YBCO bulk에 Ag가 보강되도록 하였다. Epoxy resin 과 분리된 Ag는 YBCO bluk의 crack과 void에 침투되는 것을 SEM과 광학현미경을 통해 관찰할 수 있었다. Three point bending test를 이용하여 보강 전후의 YBCO bulk의 기계적 강도를 측정하였다. 보강 후의 YBCO bluk의 기계적 강도는 보강 전에 비해 향상된 결과를 확인할 수 있었고, Epoxy resin과 $AgNO_3$를 보강한 YBCO는 기계적 강도 향상에 높은 신뢰성을 보이고 있다.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.33-37
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• 2011

In this study, the degradation mechanism of mounted chip resistors with Ag-epoxy isotropic conductive adhesives (ICAs) under the humidity exposure ($85^{\circ}C$/85%RH) was examined by electrical resistance change and microstructural study. The effect of the chloride content in Ag-epoxy ICA on joint stability was also examined. The increasing range of the electrical resistance in the typical ICA joint was greater than that in the low Cl content ICA joint. In the case of the typical ICA joint, Sn oxides such as SnO, $SnO_2$, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the $85^{\circ}C$/85%RH test. In contrast, no Sn-Cl-O was found in the low Cl content ICA joint during the $85^{\circ}C$/85%RH. It is suggested that Cl in Ag-epoxy ICA accelerate the electrical degradation of Sn plated chip components joined with Ag-epoxy ICA.

• Korean Chemical Engineering Research
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• v.55 no.3
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• pp.426-429
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• 2017

In this study, we investigated the effect of BN (boron nitride) on the thermal and the electrical conductivity of composites. In case of epoxy/BN composites, the thermal conductivity was increased as the BN contents were increased. Epoxy/AgNP (Ag nanoparticle) nanocomposites exhibited a slight change of thermal conductivity and showed a electrical percolation threshold at 20 vol% of Ag nanoparticles. At the fixed Ag nanoparticle content below the electrical percolation threshold, increasing the amount of BN enhanced the electrical conductivity as well as thermal conductivity for the epoxy/AgNP/BN composites.

• Bulletin of the Korean Chemical Society
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• v.33 no.2
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• pp.483-488
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• 2012

We successfully decorated multi-wall carbon nanotubes (MWNTs) with silver by reacting Ag-NPs with thiolfunctionalized MWNT-SH. Ag alkylcarbamate complex was used as an Ag precursor. Uniform Ag-NPs (5-10 nm) were effectively prepared by microwaving within 60 s using 1-amino-4-methylpiperazine (AMP), which acts as a reaction medium, reducing agent, and stabilizer. The MWNTs were functionalized with 2-aminoethanethiol. Exploiting the chemical affinity between thiol and Ag-NPs, Ag-MWNT nanohybrids were obtained by spontaneous chemical adsorption of MWNT-SH to Ag through Ag-S bonds. The Ag-S-MWNTs were characterized by TGA, XRD, and TEM to confirm that Ag-NPs were uniformly decorated onto the MWNTs. The Ag-S-MWNTs were then employed as conducting filler in epoxy resin to fabricate electrically conducting polymer composites. The electrical properties of the composites were measured and compared with that containing MWNT-SH. The electrical conductivity of composites containing 0.4 wt % Ag-S-MWNT was four orders of magnitude higher than those containing same content of MWNT-SH, confirming Ag-S-MWNT as an effective conducting filler.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.41-46
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• 2010

The interfacial adhesion strengths between screen-printed Ag film and epoxy resin-coated polyimide were evaluated by $180^{\circ}$ peel test method. Measured peel strength value was initially around $164.0{\pm}24.4J/m^2$, while the heat treatment during 24h at $120^{\circ}C$ increase peel strength up to $220.8{\pm}19.2J/m^2$. $85^{\circ}C/85%$ RH temperature/humidity treatment decrease peel strength to $84.1{\pm}50.8J/m^2$, which seems to be attributed to hydrolysis bonding reaction mechanism between metal and adhesive epoxy resin coating layer.

• Journal of Electrical Engineering and Technology
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• v.8 no.3
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• pp.603-609
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• 2013

In this paper, we describe the analysis of inkjet-printed silver (Ag) patterns on epoxy-coated substrates according to several reliability evaluation test method guidelines for conventional printed circuit boards (PCB). To prepare patterns for the reliability analysis, various regular test patterns were created by Ag inkjet printing on flame retardant 4 (FR4) and polyimide (PI) substrates coated with epoxy for each test method. We coated the substrates with an epoxy primer layer to control the surface energy during printing of the patterns. The contact angle of the ink to the coated epoxy primer was $69^{\circ}$, and its surface energy was 18.6 $mJ/m^2$. Also, the substrate temperature was set at $70^{\circ}C$. We were able to obtain continuous line patterns by inkjet printing with a droplet spacing of $60{\mu}m$. The reliability evaluation tests included the dielectric withstanding voltage, adhesive strength, thermal shock, pressure cooker, bending, uniformity of line-width and spacing, and high-frequency transmission loss tests.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.4
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• pp.345-350
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• 2001

Normal zone propagaton(NZP) properties were investigated on Bi-223/Ag tapes and prototype HTS cable. NZP experiments in tape were conducted in temperatures from 45K to 77K in zero field. Prototype HTS cable was molded using epoxy and the experiments were carried out under adiabatic condition in LN$_2$. NZP velocities in tapes with tow conditions of DC and AC currents were almost same at each temperature. NZP velocity in prototype HTS cable was 1.9-2.4 cm/sec in LN$_2$. Numerical analysis was carried out by a one-dimensional equation of heat balance. The simulation results of NZP velocity in Bi-2223/Ag tapes were similar to the experimental results.

• Composites Research
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• v.35 no.2
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• pp.69-74
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• 2022

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.