• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.4
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• pp.165-171
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• 2002

The study on the adsorption, the surface properties and the antibacterial effects of the metal-treated pitch based activated carbon fibers was carried out. From the adsorption studies on the series of metal-treated activated carbon fiber, the specific surface areas of the metal treated activated carbon fiber obtained from BET equation were in the range of 113.2~1574 $m^2$/g for the Ag-ACFs. And that of Cu treated ACF are distributed to 688.2-887.8 $\m^2$/g. And, the specific surface areas of the Ni-treated pitch based ACFs were in the range of 692.6~895.2 $\m^2$/g. From the ${\alpha}_s$- method, 0.06~1.1 cm^3/g of the micropore volumes were obtained from Ag-ACFs. And, 0.1~0.2 cm^3/ and 0.2~0.6 cm^3/g of the micropore volumes were obtained from Cu and Ni-ACFs, respectively. And, from the SEM morphology results, it was observed that the surface of activated carbon fiber are partially blocked and coated by metal after the treatment. Finally, from the antibacterial effects of metal-treated activated carbon fiber against E. coli, the areas of antibacterial effect become larger with the increase in mole ratio of metal treated. And, from the antibacterial effects using Shake flask method against E. coli, the percentage of the effects was 92.5~100 % and the antibacterial effect was increased with the increase in mole concentration of metal treated.

• Journal of the Korean Applied Science and Technology
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• v.31 no.4
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• pp.541-548
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• 2014

This study was performed to obtain high conversion efficiency of $C_7H_8$ using non-thermal plasma and metal-supported catalyst. Adsorption-desorption characteristics of toluene was performed using 4A type (Zeolite) filled in a concentration reactor. Through this test, it was found that the concentration reactor has 0.020 g/g of adsorption capacity (at ambient temperature and pressure) and 3,600 ppm of desorption property at $150^{\circ}C$ (with in 20 min). In case of developed catalyst, toluene decomposition rate of Pd-AO (Pd coated catalyst) was better than Pd/Cu-AO and Pd/Ag-AO (Pd/Ag composite metal catalyst). Developed non-thermal plasma system was obtained flame amplification effect using injection process of desorbed tolune, and 98% of removal efficiency.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1501-1503
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• 1999

The $(Sr_{0.85}Ca_{0.15})TiO_3$(SCT) thin films are deposited on Pt-coated electrode$(Pt/TiO_2/SiO_2/Si)$ using RF sputtering method. Ag, Cu, Al, Pt films for the formation of top eletrode were doposited on SCT thin films by thermal evaporator and sputtering. The effects of top electodes have be studied on SCT samples with a variety of top electrode materials.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.05a
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• pp.40-44
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• 2002

The motivation of this work is to use SAM(Self-Assembled Monolayer) for developing a rapid and flexible non-photolithographic nano-structure fabrication technique which can be utilized in micro-machining of metals as well as silicon-based materials. The fabrication technique implemented in this work consists of a two-step process, namely, mechanical scribing followed by chemical etching. From the experimental results, it was found that thiol on copper surface could be removed even under a few nN normal load. The nano-tribological characteristics of thiol-SAM on various metals were largely dependent on the native oxide layer of metals. Based on these findings, nano-patterns with sub-micrometer width and depth on metal surfaces such as Cu, Au and Ag could be obtained using a diamond-coated tip.

• Journal of the Korean institute of surface engineering
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• v.24 no.1
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• pp.25-30
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• 1991

The evaporation characteristics of Ag, Al, Au, Cr. Cu, In, Mg, Mn, Pb, Pd, Si, SiO, Sn, Ti and Zn with the various resistive heating sources have been studied. The employed sources are refractory metal (Mo, Ta and W) boats, W-wire, ceramic (usually Al2O3)-coated and -barriered refractory metal boats, and special boats such as baffled boats and intermetallic boats (nitride compound and graphite). We investigated the melting mode, evaporation rate at a specific power, and lifetime of the sources. A special boat holder is also discussed which is needed to cool the sources at a large heat capacity.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.187-187
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• 2011

지르코니아 ($ZrO_2$) 표면에 금속 (Au)으로 표면 코팅한 후 Ti-6Al-4V와 진공 브레이징 접합을 행하였다. 표면에 코팅한 Au 층의 영향을 비교 분석하기 위하여 Au를 코팅하지 않은 지르코니아도 모재로 사용하였다. 접합소재로는 Ag-Cu-Ti계 active filler를 사용하였다. $ZrO_2$/Ti-6Al-4V 브레이징 결과, active filler는 양측 모재 표면에 wetting 되었으며, Ti-6Al-4V 내부로 filler 확산으로 인하여 두 모재의 direct joint가 관찰되었다. 접합 계면 사이에 접합부 결함은 관찰되지 않았다.

• Journal of the Korean Electrochemical Society
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• v.17 no.3
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• pp.164-171
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• 2014

A highly sensitive and selective non-enzymatic glucose sensor has gained great attention because of simple signal transformation, low-cost, easily handling, and confirming the blood glucose as the representative technology. Until now, glucose sensor has been developed by the immobilization of glucose oxidase (GOx) on the surface of electrodes. However although GOx is quite stable compared with other enzymes, the enzyme-based biosensors are still impacted by various environment factors such as temperature, pH value, humidity, and toxic chemicals. Non-enzymatic sensor for direct detecting glucose is an attractive alternative device to overcome the above drawbacks of enzymatic sensor. Many efforts have been tried for the development of non-enzymatic sensors using various transition metals (Pt, Au, Cu, Ni, etc.), metal alloys (Pt-Pb, Pt-Au, Ni-Pd, etc.), metal oxides, carbon nanotubes and graphene. In this paper, we show that Ni-based nano-particles (NiNPs) exhibit remarkably catalyzing capability for glucose originating from the redox couple of $Ni(OH)_2/NiOOH$ on the surface of ITO electrode in alkaline medium. But, these non-enzymatic sensors are nonselective toward oxidizable species such as ascorbic acid the physiological fluid. So, the anionic polymer was coated on NiNPs electrode preventing the interferences. The oxidation of glucose was highly catalyzed by NiNPs. The catalytically anodic currents were linearly increased in proportion to the glucose concentration over the 0~6.15 mM range at 650 mV versus Ag/AgCl.

• Applied Chemistry for Engineering
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• v.23 no.6
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• pp.554-560
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• 2012

Recently, it has been increasing trend to use conductive materials as electronics and communication technology in electronics industry are developing. The noble metal such as Ag, Pt, Pd etc. are mostly used as conductive materials, To reduce production cost, alternative materials with similar characteristics of noble metals are needed. Copper has advantages, i.e its electronic properties are similar to noble metals and low cost than noble metal, but its use has been restricted because of oxidation in air. In this study, the tin film was coated on copper by electroless plating to protect copper from oxidation and to confirm the effects of temperature, pH, amount of $SnCl_2$, and feeding speed in plating conditions. Additionally, we apply $Cu_{core}Sn_{shell}$ powder as conductive filler with low-temperature densification and analysis by SEM, XRD, FIB and 4-Point Probe techniques. As result of the study, tin film was coated well on copper and was protected from oxidation. After low-temperature densification treatment, the meted tin made chemical interconnections with copper. Accordingly, conductivity was increased than before condition. We hope $Cu_{core}Sn_{shell}$ powder to replace noble metals and use in the electronic field.