• Restorative Dentistry and Endodontics
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• 제9권1호
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• pp.81-87
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• 1983

The purpose of this study was to observe and identify the phases of amalgam and to know the transformation of microstructure in the set amalgam by lapse of time. In this study, shofu spherical-D alloy was used. After trituration of amalgam alloy and mercury (Wig-L-Bug), it was filled in the stone dies. This specimens being polished and etched by usual method was observed under optical microscope using metallurgical microscope. And then X-ray diffractometer was used to analyze the phases contents and transformation of microstructure at $2{\frac{1}{2}}$ hours, 15 hours, 28 hours and 2 years after being amalgamated. The following results were obtained: 1. Shofu spherical-D alloy powder was composed of ${\gamma}$ phase, ${\epsilon}$phase and Ag-Cu eutectic phases. 2. ${\gamma}_2$ phases were appeared at $2{\theta}$ values ($32.0^{\circ}$ and $43.8^{\circ}$) in the amalgam which was analyzed at $2{\frac{1}{2}}$ hours and 15 hours after trituration with mercury. 3. In the amalgam at 28 hours, ${\gamma}_2$ phase was found at $2{\theta}$ value ($43.8^{\circ}$) at 35 hour, $r_2$ phase was appeared at $2{\theta}$ value $32.0^{\circ}$. 4. No ${\gamma}_2$ phases were observed in the 2 years old amalgam. But ${\eta}$ ($Cu_6Sn_5$) phases were found at $2{\eta}$ values $29.4^{\circ}$ and $42.4^{\circ}$.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.93-99
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• 2004

At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• 한국초전도ㆍ저온공학회논문지
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• 제4권1호
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• pp.40-44
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• 2002

Influences of bending strain on the critical current (Ic) were investigated in Bi-2223 superconducting tapes at 77K. The effect of bending mode on the Ic degradation behavior was discussed in viewpoints of test procedure, n-value and damage morphology Especially, in this paper, we reported the Ic behavior in Ag alloy/Bi-2223 multifilamentary superconducting tapes under bending occurred within a width plane of the tape which was called as a hard bending. The Ic degradation under hard bending appeared significantly as compared with that under easy bending. The n-value decreased slightly with the increase in bending strain under the hard bending.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2002년도 학술대회 논문집
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• pp.144-148
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• 2002

Influences of bending strain on the critical current (I$_{c}$) were investigated in Bi-2223 superconducting tapes at 77K. The effect of bending mode on the I$_{c}$ degradation behavior was discussed in viewpoints of test method, n-value and damage morphology. Especially, in this paper, we reported the I$_{c}$ behavior in Ag alloy/Bi-2223 multifilamentary super- conducting tapes under bending occurred within width x length plane of the tape which was called as a hard bending.nding.

• 한국초전도ㆍ저온공학회논문지
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• 제3권2호
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• pp.1-4
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• 2001

For the practical use of a superconducting wire to magnet application, it is important to assess the Young modulus and other mechanical properties of HTS tapes. In order to establish a test method of mechanical properties for oxide composite superconductors. tensile tests of Bi-2223 multi- filamentary tapes were carried out at room temperature, as an activity of the International round robin test proposed by the committee of VAMAS/TWA 16-Subrgroup. The tapes consisting of mutli-filamentary showed a three stage tensile behavior. At the initial stage of the stress-streain curve. The elastic deformation existed in a quite nattrow strain region. But the plastic deformation was observed in a wide strain region due to the platic flow of the Ag alloy matrix. The results of RRT were also reported and discussed.

• 대한치과기공학회지
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• 제7권1호
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• pp.13-18
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• 1985

Casting alloys, both precious and non-precious, were by heat in order to observe the change in HB and the results were : 1. The hard treatment showed 1.4 - 1.5 times as high as the soft treatment in HB. 2. The experiment shows that Au-Pt should be contained more than 75% to prevent color change. 3. Cu by hard teatment played the greatect part in creasing the solidity of Ag-Cu alloy. 4. Casting Co-Cr alloys showed little difference of HB in heat treatment.

• 한국주조공학회지
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• 제22권1호
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• pp.35-41
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• 2002

To improve the reliability of solder joints, a composite solder which consists of solder matrix and intermetallic reinforcements was manufactured by a new method. The cast ingot of Sn-6.9Cu-2.9Ag alloy had primary Cu6Sn5 intermetallics in the form of dendrites. After rolling the ingot, the intermetallic dendrites were crushed into fine particles and distributed uniformly throughout the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached a critical size which did not decrease any more by further rolling. The critical size was nearly the same as the average width of intermetallic dendrite trunk. The crushed intermetallic particles did not melt and remained in solid state during reflow soldering due to their high meltingterm-perature. The coarsening and gravitational segregation of the particles were observed during reflow soldering.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1307-1308
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• 2006

The purpose of this study was to examine the interfacial reaction between diamond grits and Ni-based, Ag-based, brazing filler metal, respectively. The morphology of the interface between diamond grits and Ni-based, filler metal exhibited a very good condition after this heat treatment. Cr-carbide and Ni-rich compounds were detected by XRD analysis in the vicinity of the interface between diamond grits and Ni-based, filler metal after vacuum induction brazing. Chromium carbide is considered to play an important role in the high bonding strength achieved between diamonds grits and the brazing alloy.

• 한국분말재료학회지
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• 제25권1호
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• pp.19-24
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• 2018

Cu-Fe alloys (CFAs) are much anticipated for use in electrical contacts, magnetic recorders, and sensors. The low cost of Fe has inspired the investigation of these alloys as possible replacements for high-cost Cu-Nb and Cu-Ag alloys. Here, alloys of Cu and Fe having compositions of $Cu_{100-x}Fe_x$ (x = 10, 30, and 50 wt.%) are prepared by gas atomization and characterized microstructurally and structurally based on composition and powder size with scanning electron microscopy (SEM) and X-ray diffraction (XRD). Grain sizes and Fe-rich particle sizes are measured and relationships among composition, powder size, and grain size are established. Same-sized powders of different compositions yield different microstructures, as do differently sized powders of equal composition. No atomic-level alloying is observed in the CFAs under the experimental conditions.