• Journal of the Korean Chemical Society
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• v.47 no.4
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• pp.315-324
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• 2003

In this study, a new method is presented to produce stable hydrophobic metal alloy nanocluster in chloroform solution including surfactant NaAOT(sodium bis(2-ethylhexyl)-sulfosuccinate) via the chemical reduction of metal salt $(HAuCl_4,\AgNO_3,\Cu(NO_3)_2)$ by sodium borohydride. For the alloy nanocluster, several samples were prepared by changing the molar ratio of Au/Cu, Au/Ag alloy nanocluster, 3:1, 1:1, 1:3. The alloy nanoclusters were characterized by UV-Visible spectrophotometer, TEM(Transmission Electron Microscope), and XPS(X-ray Photoelectron Spectrometer). With the change of the mole ratio of the alloy component, the wavelengths of the surface plasmon absorption shift linearly from 520 nm of the pure Au nanocluster to 570 nm of the pure Cu nanocluster for Au/Cu alloy nanoclusters and from 405 nm to 520 nm for Au/Ag alloy nanoclusters. The chemical shifts of the Au4f, Ag3d, Cu2p XPS peaks were observed with changing the molar ratio of the alloy element. The alloy nanoclusters in chloroform solution were made uniformly in size and colloidally stable for long periods of time. These results indicate that the method here is a very effective method for synthesizing hydrophobic alloy nanoclusters with uniform or nearly uniform particle size distribution.

• The Journal of Advanced Prosthodontics
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• v.7 no.5
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• pp.392-399
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• 2015

PURPOSE. The aim of this study was to evaluate the effect of metal primers on the bonding of dental alloys and veneer resin. Polyvinylpyrrolidone solution's tarnish effect on bonding strength was also investigated. MATERIALS AND METHODS. Disk-shape metal specimens (diameter 8 mm, thickness 1.5 mm) were made from 3 kinds of alloy (Co-Cr, Ti and Au-Ag-Pd alloy) and divided into 4 groups per each alloy. Half specimens (n=12 per group) in tarnished group were immersed into polyvinylpyrrolidone solution for 24 hours. In Co-Cr and Ti-alloy, Alloy Primer (MDP + VBATDT) and MAC-Bond II (MAC-10) were applied, while Alloy Primer and V-Primer (VBATDT) were applied to Au-Ag-Pd alloys. After surface treatment, veneering composite resin were applied and shear bond strength test were conducted. RESULTS. Alloy Primer showed higher shear bond strength than MAC-Bond II in Co-Cr alloys and Au-Ag-Pd alloy (P<.05). However, in Ti alloy, there was no significant difference between Alloy Primer and MAC-Bond II. Tarnished Co-Cr and Au-Ag-Pd alloy surfaces presented significantly decreased shear bond strength. CONCLUSION. Combined use of MDP and VBATDT were effective in bonding of the resin to Co-Cr and Au-Ag-Pd alloy. Tarnish using polyvinylpyrrolidone solution negatively affected on the bonding of veneer resin to Co-Cr and Au-Ag-Pd alloys.

• Journal of Korea Foundry Society
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• v.28 no.4
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• pp.184-189
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• 2008

Ag-Cd alloy has been widely used as an electrical contact material, since Ag-Cd alloy has a good wear resistance and stable contact resistance. But nowadays Ag-Cd alloy is not considered as electrical contact material any more due to detrimental effect on environments. Currently, active researches are being performed on ($Ag-SnO_2$ and $Ag-SnO_{2}-In_{2}O_{3}$) as an alternative solution which can fix the remaining environmental problems. However, $In_{2}O_{3}$ is relatively expensive and Ag-Sn alloy has low wear resistance. Our recent research results show that Ag-X%Zn-Y%Sn has similar physical and chemical properties. In the present study, so we tried to change and to optimize the Zn oxide content to over 6 wt% and Sn oxide content with 0.5, 1.0, 1.5 wt%. Results obtained from the experiments on the Ag-X%ZnO-Y%$SnO_2$ are discussed.

• Korean Journal of Metals and Materials
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• v.46 no.7
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• pp.443-448
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• 2008

Contact materials are used in many electrical devices. Ag-Cd alloy has been widely used in electrical part, because Ag-Cd alloy has a good wear resistance and stable contact resistance. But nowadays Ag-Cd alloy isn't being used because of environmental challenges. Currently new research is being done on ($Ag-SnO_2$ and $Ag-SnO_2-In_2O_3$) as an alternative solution to fix any remainly environmental challenges. However $In_2O_3$ is more expensive and Ag-Sn alloy has low wear resistance. According to our research data Zn has a similar physical and chemical property. In this work, so we changed and optimized the Zn oxide to over 4 and added Sn oxide ratio 0.5, 1.0, 1.5wt%. Conclusions from the data recorded from the experiment of $Ag-ZnO-SnO_2$ are as follows.

• Applied Science and Convergence Technology
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• v.23 no.6
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• pp.345-350
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• 2014

The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin $InO_x$ layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.549-554
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• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• Journal of the Korean institute of surface engineering
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• v.49 no.3
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• pp.286-300
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• 2016

Pd-Ag alloy membranes have attracted a great deal of attention for their use in hydrogen purification and separation due to their high theoretical permeability, infinite selectivity and chemical compatibility with hydro-carbon containing gas streams. For commercial application, Pd-based membranes for hydrogen purification and separation need not only a high perm-selectivity but also a stable long-term durability. However, it has been difficult to fabricate thin, dense Pd-Ag alloy membranes on a porous stainless steel metal support with surface pores free and a stable diffusion barrier for preventing metallic diffusion from the porous stainless steel support. In this study, thin Pd-Ag alloy membranes were prepared by advanced Pd/Ag/Pd/Ag/Pd multi-layer sputter deposition on the modified porous stainless steel support using rough polishing/$ZrO_2$ powder filling and micro-polishing surface treatment, and following Ag up-filling heat treatment. Because the modified Pd-Ag alloy membranes using rough polishing/$ZrO_2$ powder filling method demonstrate high hydrogen permeability as well as diffusion barrier efficiency, it leads to the performance improvement in hydrogen perm-selectivity. Our membranes, therefore, are expected to be applicable to industrial fields for hydrogen purification and separation owing to enhanced functionality, durability and metal support/Pd alloy film integration.

• Korean Journal of Materials Research
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• v.8 no.11
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• pp.1011-1019
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• 1998

This work designed Sn-5%Pb-1.5%Ag-x%In solder alloy to develop the solder alloy with low Pb content. This solder alloy doesn't cause environmental pollution. and this study reviewed the probability of replacement of Sn-37%Pb solder as evaluation of melting range, wettability. microstructure, microhardne'ss, tensile strength, drossability of this new solder alloys. The level of international regulation in dissolution amount of Pb ion was 3ppm. But dissolution amount of Pb ion in Sn-5%Pb solder alloy confirmed not to threat the global environmental is 0.46ppm. The melting range of this solder alloy was $183-192^{\circ}C$. Also the range of solidification was very narrow within $5^{\circ}C$. The wettability was similar to Sn-37%Pb solder, and the effect of amount of In addition of wettability couldn't be founded. The probability of replacement in the melting range and wettability is very high. And microhardness of this solder alloy was 1.5 times of conventional type solder. Tensile strength of new solder alloys was a little high than that of conventional type solder. With increasing amount of In% addition, tensile strength was increased, but elongation was decreased. The solder alloy of l%In addition revealed AgSn and Pb on dendrite microstructure boundary, and $Ag_3Sn$, $Ag_3In$ and Pb were revealed on it at the solder alloy of 3% In addition. The drossability was superior to Sn-37%Pb solder alloy and the solder alloys of 2% In addition was not generated for 3hrs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.640-644
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• 2000

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, Ag$_3$Sn and Cu$\sub$6/Sn$\sub$5/ phases in the matrix Sn and 1∼2$\mu\textrm{m}$ thick Cu$\sub$6/Sn$\sub$5/ Phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5AAg/A11oy42, only Ag$_3$Sn Phase of low density in the matrix Sn and 0.5∼1.5$\mu\textrm{m}$ thick FeSn$_2$phase at the interface of solder/lead-frame were formed. Comparing to Cu, Alloy42 shear strength of Alloy 42 solder joints was smaller than that of Cu and all declined after aging. After aging at 180$^{\circ}C$ for 1 week, η-Cu$\sub$6/Sn$\sub$5/ layer was formed on Cu lead-frame, while AgSn$_3$ phase in the matrix and thickened FeSn$_2$at the interface were formed on Alloy42 lead-frame.

• The Journal of Korean Academy of Prosthodontics
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• v.33 no.4
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• pp.645-661
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• 1995

As the mechanical property of composite resin improved, composite resin has been widely used esthetic dentistry. In the field of esthetic dentistry, the color of prosthetic material is very important. The purpose of this study was to evaluate the color difference of specimens, by the types of alloys and gold electrodeposit. Experimental groups were as follows : Group Prec : Au-Pt alloy with no gold coating and no resin veneer. Group Semi : Pd-Ag alloy with no gold coating and no resin veneer. Group BAse : Ni-Cr alloy with no gold coating and no resin veneer. Group Gsem : Pd-Ag alloy with no gold coating and no resin veneer. Group Gbas : Ni-Cr alloy with no gold coating and no resin veneer. Group PreR : Resin veneer on the Pd-Ag alloy without gold coating. Group SemR : Resin veneer on the Pd-Ag alloy without gold coating. Group GbsR : Resin veneer on the Ni-Cr alloy with gold coating Group BasR : Resin veneer on the Ni-Cr alloy without gold coating. In this study, colors of metal surfaces and veneered resins were evaluated by the CIE $L^{*}a^{*}b$ system. The results obtained were as follows : 1. different alloy types and gold coating make the $L^{*}a^{*}b$ system. 2. The ${\Delta}E^*$ab value between groups semi and Base was less than 1.5 and there was no $a^*$ and $b^*$ value difference between groups Gsem and Gbas 3. The values of $L^*$ and $a^*$ ain groups GsemR and GbasR were so similar that the ${\Delta}E^*$ab value was as small as 0.58. 4. In resin specimens with gold coated semiprecious or base alloys showed yellower and redder deviation than the resin specimens with precious alloy. 5. The ${\Delta}E^*$ab values between goups PreR-GsemR and groups PreR-GbasR were as small as 2.68 and 2.22 respectively.