• The Journal of Korean Academy of Prosthodontics
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• v.39 no.4
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• pp.417-432
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• 2001

The pcf metal primers on the bond strength and durability of 4-META/MMA-TBB resins adhered to an Au-Ag-Pd alloy. For this study, the specimens were divided into 8 groups as follows: Thermocyle 0 : (1) control group : sandblast, (2) Group I : sandblast + Cesead Opaque Primer; (3) Group II : sandblast + Metal Primer; (4) Group III : sandblast + V-Primer; Thermocyle 10,000 (5) control sandblast: (6) Group I : sandblast + Cesead Opaque Primer: (7) Group II : sandblast + Metal Primer; (8) Group III sandblast + V-Primer. The shear bond strength was determined using an Instron were observed with the use of scanning electron microscope. Finally, the strengths of bonded joints were evaluated with regard to their adherence energy using a wedge test. The results obtained were as follows ; (1) The shear bond strength of 4-META/MMA-TBB resin to the Au-Ag-Pd alloy was significantly improved in all the groups treated with the primers (p<0.05). (2) Regardless of the adhesive primers used, a significant difference was observed in the bond strength of the thermocycle 0 groups and 10,000 groups (p<0.05). (3) Both before and after thermocycling, the strongest bond strength between the resin an the alloy was obtained after treatment with a metal primer containing MEPS (p<0.05). (4) In the wedge test, the adherence energies of the control group and Group III decreased more rapidly than those of Group I and II during the 2nd day of storage in water.

• Journal of the Korean institute of surface engineering
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• v.40 no.5
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• pp.225-233
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• 2007

Effects of alloying elements on the corrosion layer formation of Pb-grid/active materials interface has been researched for improvement of corrosion resistance of Pb-Ca alloy. For this research, various amounts of alloying elements such as Sn, Ag and Ba were added to the Pb-Ca alloys and investigated their corrosion behaviors. Batteries fabricated by using these alloys as cathode grids were subjected to life cycle test. Overcharge life cycle test was carried out at $75^{\circ}C$, 4.5 A, for 110 hrs. with KS standard (KSC 8504). And then, after keeping the battery with open circuit state for 48 hr, discharge was carried out at 300A for 30 sec. Corrosion morphology and interface between Pb-grid and active materials were investigated by using ICP, SEM, WDX, and LPM. Corrosion layer of Pb-Ca alloy got thicken with increasing Ca content. For Pb-Ca-Sn alloy, thickness of corrosion layer decreased as Sn and Ag content increased gradually. In case of Pb-Ca-Sn-Ba alloy, thickness of corrosion layer decreased up to 0.02 wt% Ba addition, whereas, it was not changed in case of above 0.02 wt% Ba addition.

• Journal of the Korean Ceramic Society
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• v.37 no.4
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• pp.381-387
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• 2000

Si3N4/stainless steel 316 joints with Ni buffer layer were fabricated by direct active brazing method (DIB) using Ag-Cu-Ti brazing alloy only and double brazing method (DOB) using Ag-Cu brazing alloy with Si3N4 pretreated with Ag-Cu-Ti brazing alloy. For the joint brazed by DIB method, Ti was segregated at the Si3N4/brazing alloy interface, but was not enough to form a stable joint interface. In addition, large amounts of Ni-Ti inter-metallic compounds were formed in tehbrazing alloy near the joint interface, which could deplete the contents of Ti involved in the interfacial reaction. However, for the joint brazed by DOB method, segregation of Ti at the joint interface were enough to enhance the formation of stable interfacial reaction products such as TiN and Ti-Si-Ni-N-(Cu) multicompounds, which restricted the formation of Ni-Tio inter-metallic compounds in the brazing alloy during brazing with Ni buffer layer. Fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was much improved by using DOB method rather than DIB method. It could be deduced that the differences of fracture strength of the joint with Ni buffer layer depending on brazing process adapted were directly affected by the formation of stable joint interface and the change in microstructure of the brazing alloy near the joint interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of Ni buffer layer in the joint was increased from 0.1 mm to 10 mm. It seems to due to the increased residual stress in the joint as the thickness of Ni buffer layer is increased. The maximum fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was 386 MPa, and the fracture of joint was originated at Si3N4/brazing alloy joint interface and propagated into Si3N4 matrix.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.2
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• pp.119-125
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• 2017

We have studied the effects of Ag on the characteristics of $Sn_{43}Bi_{57}Ag_x$(wt%) lead-free solders for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of Ag3Sn after reacting with some part of Sn atoms, while they did not react with Bi atoms, but decreased the mean size of Bi solid phase and the thickness of solder. When Ag atoms of 3.0 wt% was added to eutectic $Sn_{43}Bi_{57}$(wt%) solder, it showed the optimally useful results that the peel strength of photovoltaic ribbon greatly increased and the sheet resistance of the solder decreased. In the meanwhile, the eutectic $Sn_{43}Bi_{57}$(wt%) solder showed a low melting temperature of $138.9^{\circ}C$, and showed a very similar result regardless of the added amount of Ag atoms.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.15-18
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• 1996

The elemental segregation in the sputter-deposited AgInSbTe recording thin films was studied by means of Auger electron spectroscopy and ESCA for the specimens of as-deposited and as heat-treated conditions. Auger electron spectroscopy and ESCA revealed an extremely thin layer of elemental inhomogeneity, especially for the silver, even in as-deposited condition. The chemical analysis results obtained in this alloy system are discussed in terms of process parameters and target microstructure.

• Journal of the Korean institute of surface engineering
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• v.50 no.3
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• pp.155-163
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• 2017

In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps' surface. Furthermore the effect of any impurities present in the methanesulfonic acid used as a base acid in the Sn-Ag solder plating solution on the stability of plating solution as well as the characteristics of the Sn-Ag alloys films was also explored. As expected, the uniform bump was obtained by means of removing impurities in the plating solution. Consequently the resultant solder bump was obtained in an optimal current density of the range of $1A/dm^2$ to $15A/dm^2$, which has acceptable bump shape and surface roughness with 12inch wafer trial results.

• Journal of the Korean Electrochemical Society
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• v.18 no.3
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• pp.102-106
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• 2015

The performance of Li-B alloy as anode for molten salt electrolysis was firstly investigated. The crystalline phase of the prepared Li-B alloy was identified as $Li_7B_6$. The potential profile of Li-B alloy anode was monitored during the electrodeposition of $Nd^{3+}$ onto an LCC (liquid cadmium cathode) in molten LiCl-KCl salt at $500^{\circ}C$. The potential of Li-B alloy was increased from -2.0 V to -1.4 V vs. Ag/AgCl by increasing the applied current from 10 to $50mA{\cdot}cm^{-2}$. It was found that not only the anodic dissolution of Li to $Li^+$ but also the dissolution of the atomic lithium ($Li^0$) into the LiCl-KCl eutectic salt was observed, following the concomitant reduction of $Nd^{3+}$ by the $Li^0$ in Li-B alloy. It was expected that the direct reduction could be restrained by maintaining the anode potential higher that the deposition potential of neodymium.

• Korean Journal of Materials Research
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• v.25 no.1
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• pp.32-36
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• 2015

Hot rolling of Mg-6Zn-0.6Zr-0.4Ag-0.2Ca-(0, 8 wt%)Li powder was conducted at the temperature of $300^{\circ}C$ by putting the powder into the Cu pipe. The microstructure and mechanical properties of the samples were observed. Mg-6Zn-0.6Zr-0.4Ag-0.2Ca without Li element was consisted of ${\alpha}$ phase and precipitates. The microstructure of the 8 wt%Li containing alloy consisted of two phases (${\alpha}$-Mg phase and ${\beta}$-Li phase). In addition, $Mg_2Zn_3Li$ was formed in 8%Li added Mg-6Zn-0.6Zr-0.4Ag-0.2Ca alloy. By addition of the Li element, the non-basal planes were expanded to the rolling direction, which was different from the based Mg alloy without Li. The tensile strength was gradually decreased from 357.1 MPa to 264 MPa with increasing Li addition from 0% to 8%Li. However, the elongation of the alloys was remarkably increased from 10 % to 21% by addition of the Li element to 8%. It is clearly considered that the non-basal texture and ${\beta}$ phase contribute to the increase of elongation and formability.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Advances in materials Research
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• v.9 no.3
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• pp.171-187
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• 2020

The microstructural evolution of different compositions of Mg-Sn alloys (30%Sn-70%Mg, 40%Sn-60%Mg and 50%Sn-50%Mg) is studied at first to understand the changes observed with change in tin content and deformation conditions. The Mg₂Sn phase increases with increase in tin content and a significant substructure development is found in 50%Sn-50%Mg alloy. The above observation led to further deformation studies on Mg₂Sn based thermoelectric materials with higher tin percentage. The microstructure in terms of Electron backscatter diffraction (EBSD)measurements is studied in detail followed by the determination of thermoelectric properties i.e., Seebeck coefficient and electrical conductivity for both as cast and extruded Mg_(2+x)Sn-Ag alloys. The electrical conductivity of the extruded Mg_(2+x)Sn-.3wt%Ag {x =1} alloy was found to be more than its as cast counterpart while the Seebeck coefficient values remained almost the same.