• 한국세라믹학회지
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• 제36권5호
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• pp.490-496
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• 1999

The sintering behavior of LTCC (low temperature cofired ceramics) chip couplers was investigated in relation with Ag diffusion at the interface of glass ceramic substrate-Ag electrode. Sintering temperature was in the range of 825$^{\circ}C$-975$^{\circ}C$. The commercial green sheet and silver electrode were used. Below 875$^{\circ}C$ the diffusion of the Ag ion into the substrate and the penetration of glassy phases into the electrode occurred due to an increase of fluidity. Thus the lectrode line was severely deformed and damaged. At 975$^{\circ}C$ the transformation of crystalline phases into glassy phases and the melting of the Ag electrode resulted in the diffusion of the considerable amount of Ag ions.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 초전도 자성체
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• pp.46-49
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• 2002

The aim of this paper is to investigate the influence of various deformation ratio on texture of Ag tapes that can be used as a RE-$Ba_2Cu_3O_{7-{\delta}}$ coated conductor tapes without any buffer layer. We fabricated as-rolled Ag substrate with various deformation ratio per step. Thickness and total deformation ratio of Ag tapes were $100{\mu}m$ and >98%, respectively. And as-rolled Ag substrate was annealed at $750^{\circ}C$ for 30min. The as-rolled and recrystallization textures were measured using x-ray pole figures and orientation distribution function (ODF) analysis. With the increase of rolling ratio from 5 to 20%, deformation texture are changed from {1l0}<311> to {1l0}<112>, {032}<100>, {051}<211>. After recrystallization by annealing, main texture was observed to {013}<100> under present condition.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.379-379
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• 2007

The characteristics of indium-zinc-tin-oxide (IZTO)-Ag-IZTO multilayer grown on a PET substrate were investigated for flexible organic light-emitting diodes. The IZTO-Ag-IZTO (IAI) multilayer anode exhibited a remarkably reduced sheet resistance of 4 ohm/sq and a high transmittance of 84%, despite the very thin thickness of the IZTO (30 nm) layer. In addition, it was shown that electrical and optical properties of IAI anodes are critically dependent on the thickness of the Ag layer, due to the transition of Ag atoms from distinct islands to continuous films at a critical thickness (14 nm). Moreover, the IAI/PET sample showed more stable mechanical properties than an amorphous ITO/PET sample during the bending test due to the existence of a ductile Ag layer. The current density voltage-luminance characteristics of flexible OLEDs fabricated on an IAI/PET substrate was better than those of flexible OLEDs fabricated on an ITO/PET substrate. This indicates that IAI multilayer anodes are promising flexible and transparent electrodes for flexible OLEDs.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.17-23
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• 2013

신축성 전자패키징 기술개발을 위한 기초연구로서 Cu/Sn 범프에 CNT-Ag 복합패드를 형성한 칩을 이방성 전도접착제를 사용하여 플립칩 본딩한 후, CNT-Ag 복합패드의 유무 및 본딩압력에 따른 플립칩 접속부의 접속저항을 측정하였다. CNT-Ag 복합패드가 형성된 Cu/Sn 칩 범프를 25MPa과 50MPa의 본딩압력으로 플립칩 본딩한 시편들은 접속저항이 너무 높아 측정이 안되었으며, 100MPa의 본딩압력으로 플립칩 본딩한 시편은 $213m{\Omega}$의 평균 접속저항을 나타내었다. 이에 비해 CNT-Ag 복합패드가 없는 Cu/Sn 칩 범프를 사용하여 25MPa, 50 MPa 및 100 MPa의 본딩압력으로 플립칩 본딩한 시편은 각기 $1370m{\Omega}$, $372m{\Omega}$ 및 $112m{\Omega}$의 평균 접속저항을 나타내었다.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 추계학술대회 논문집
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• pp.79-82
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• 2003

We prepared YBCO coated conductor by direct deposition of YBCO on Ag substrate by a MOCVD method. The Ag substrate was only prepared by cold rolling. The XRD data of the as-rolled Ag tape showed the formation of dominant (420) oriented grains. Processing variables were the oxygen partial pressure (Po$_2$) and deposition temperature (T$_{d}$). It was found that the a-axis oriented films were grown at lower T$_{d}$ below 80$0^{\circ}C$, while the c-axis oriented films were grown about 80$0^{\circ}C$. The surface of the films consisted of a second inclusion phase dispersed in the YBCO matrix. The Cu-rich phase regions were observed at the YBCO/Ag interface probably due to the inter-diffusion of Ag and Cu. Cu.

• 한국진공학회지
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• 제6권S1호
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• pp.27-33
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• 1997

Recently ion beam assistant deposition (IBAD) was successfully used to produce a dense ultra-adherent and pinhole-free hydroxyapatite (HAp) layer on alumina substrate. After that the HAp-coated alumina was immersed in 20ppm and 100ppm $AgNO_3$ solution at room temperature for 48 hours to carry out the ions exchange between $Ag^+\;and\;Ca^+$ in HAp. The obvious antimicrobial effect against E.Coli, P. Aeruginosa and S. Epidermidis was observed in the samples treated with 20ppm $AgNO_3$ Solution, In contrast to this the untreated samples did not show any bactericidal effect. Scanning electron microscope(SEM) study showed that Ag homogeneously distributed on the surface. X-ray diffraction (XRD) demonstrated that the surface structure in the samples without Ag was HAp whereas with Ag is HAp and AgCaP. It appears that silver ions exchange with calcium ions in HAp does not cause significant changes in the structure of HAp coatings.

• Bulletin of the Korean Chemical Society
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• 제15권1호
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• pp.20-22
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• 1994

The preparation of $YBa_2Cu_4O_8$ thick film on Ag substrate by electrophoretic deposition was directly studied. Electrophoretic deposition was carried out in solution, which was composed of presintered $YBa_2Cu_4O_8$ powder, sodium, and 2-propanol as a solvent. The deposited thick films were heat-treated in $O_2$ at 815$^{\circ}$C for 12 hours and at 450$^{\circ}$C for 12 hours. We succeeded in obtaining superconducting $YBa_2Cu_4O_8$ films on Ag substrate. Even though the chemical reactions at the $YBa_2Cu_4O_8$/Ag interface occurred in the range of 10 ${\mu}$m, superconductivity was not depressed. The thickness of the films was in the range of 60-80 ${\mu}$ m. The characteristics of the films were examined by electric resistance measurements, X-ray diffraction, and SEM observations.

• 한국주조공학회지
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• 제22권2호
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• pp.89-96
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• 2002

This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at $150^{\circ}C$. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of $150^{\circ}C$. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was $Cu_6Sn_5$ phase and aged specimens showed that intermetallic layer grew in proportion to $t^{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_6Sn_5$ phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the $Cu_6Sn_5$ layer during the aging treatment.

• 대한금속재료학회지
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• 제47권3호
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2003년도 High Temperature Superconductivity Vol.XIII
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• pp.90-90
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• 2003