• 제목/요약/키워드: Ag diffusion

검색결과 180건 처리시간 0.027초

AsGeSeS 박막의 광학적 조건에 따른 저항변화 특성에 대한 연구

  • 남기현;정홍배
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
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    • pp.248-248
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    • 2010
  • We have demonstrated new functionalities of Ag-doped chalcogenide glasses based on their capabilities as solid electrolytes. The influence of silver on the properties of the newly formed materials is regarded in terms of diffusion kinetics, and Ag saturation is related to the composition of the hosting material. Silver saturated in chalcogenide glass has been used in the formation of solid electrolyte, which is the active medium in the programmable metallization cell (PMC) device. In this paper, we investigated the optical properties of Ag-doped chalcogenide thin film by He-Ne laser beam exposure, which is concerned with the Ag-doping effect of PMCs before or after annealing. Chalcogenide bulk glass was fabricated by a conventional melt quenching technique. Amorphous chalcogenide and Ag thin films were prepared by e-beam evaporation at a deposition rate of about $4\;{\AA}/sec$. As a result of resistance change with laser beam exposure, the resistance abruptly dropped from the initial value of $1.4\;M{\Omega}$ to the saturated value of $400\;{\Omega}$.

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Development of Cube Texture in a Silver-Nickel Bi-layer Sheet

  • Lee, Hee-Gyoun;Jung, Yang-Hong;Hong, Gye-Won
    • Progress in Superconductivity
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    • 제1권1호
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    • pp.47-50
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    • 1999
  • An Ag/Ni bi-layer sheet was fabricated by the combination of powder metallurgy, diffusion bonding, cold rolling and texture annealing processes. After heat treating the cold rolled thin Ag/Ni bi-layer sheet at $900^{\circ}C$ for 4h, the excellent cube texture was developed on nickel surface. Qualitative chemical analysis using EPMA showed that inter diffusions of Ni and Ag in Ag/Ni bi-layer composite were negligible. It showed that Ag can be used as a chemical barrier for Ni and vice versa.

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Ag(100) 기판위에 증착된 Nb Cluster에 관한 STM연구

  • 윤홍식;유미애;한권환;이준희;양경득;여인환
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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    • pp.140-140
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    • 2000
  • The initial growth mode of Nb on Ag(11) in sub-monolayer regime and the influence of subsequent 520K annealing are studied using UHV Scanning Tunneling Microscopy. E-beam evaporated Nb is deposited onto the substrate at RT, and STM measurements are carried out at RT and 78 K. With Nb being immiscible in bulk Ag, 3D islands formation begins at early stage and no particular ordered structure is found. After annealing to 520K, most of islands are disappeared from terrace. There exist 2 possibilities. : (1) Diffusion of Nb into the 2nd or 3rd layer of Ag substrate or (2) agglomeration of Nb on Ag at higher temperature. A model will be given to explain the evidence. In addition, we investigated the change of STM image according to bias voltage depending on island size. Possible physical mechanism responsible for such behavior together with interaction between Nb islands and reactive gases will be also discussed.

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AgPd 내부전극을 이용한 적층형 압전 액츄에이터의 제조 (Fabrication of Multilayer Piezoelectric Actuator with AgPd Internal Electrode)

  • 임인호;윤현상;박종주;백동수;박창엽
    • 한국전기전자재료학회논문지
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    • 제13권1호
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    • pp.33-38
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    • 2000
  • In this study, multilayer piezoelectric actuators were fabricated with 75 layers by a conventional multi-layer capacitor (MLC) techniques, using 70Ag/30Pd paste as an internal electrode which can be sintered at low temperature and have cost down effect in mass productions. The multilayer piezoelectric actua-tors had no defects such as diffusions of internal electrode to ceramic bodies and shortages of internal electrodes. The multilayer piezoelectric actuators did not show the crack in the ceramics parts and the gapping phenomena in the external eletrodes when Ag paste was used as external electrodes. The multilayer piezoelectric actuators showed a maximum displacement of 4${\mu}{\textrm}{m}$ at 100V dc voltage and kept the maximum displacement constant for 300 seconds. The multilayer piezoelectric actuators showed good matching properties between ceramic bodies and AgPd internal electrodes. We confirmed the possibility of large-scaled production of the multilayer piezoelectric actuators with superior electrical properties and cost down effect using 70Ag/30Pd paste as an internal electrodes.

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A$_2$O$_3$세라믹과 Ni-Cr-Mo鋼과의 인서트 合金을 이용한 擴散接合에 關한 硏究 (A study on the diffusion bonding of the $Al_2$O$_3$ ceramics to metal)

  • 김영식;박훈종;김정일
    • Journal of Welding and Joining
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    • 제10권3호
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    • pp.63-72
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    • 1992
  • The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

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Ag-Cu-Ti 브레이징 합금의 산화거동 (Oxidation Behavior of Ag-Cu-Tio Brazing Alloys)

  • 우지호;이동복;장희석;박상환
    • 한국세라믹학회지
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    • 제35권1호
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    • pp.55-65
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    • 1998
  • Ag-36.8a%Cu-7.4at%Ti 조성의 브레이징 합금을 Si3N4 기판위에 브레이징한 후 브레이징 합금의 산화거동을 대기중 400, 500, 600$^{\circ}C$에서 조사하였다. 브레이징 합금의 구성원소인 Ag는 산화되지 않고 Cu와 Ti가 산화되며, 산화거동은 포물선적 산화법칙을 따랐다. 브레이징 합금의 산화에 따른 활성화에너지는 80kj/ mol 으로서 소량 첨가된 활성원소인 Ti에 의하여 순수한 Cu의 산화시 활성화에너지보다 감소하였다. 산화 초기에 생성되는 외부산화물은 Cu이온의 외부확산에 의해 성장이 지배되는 Cu산화물로 구성되어 있었다. 산화기간이 경과함에 따라 외부산화물층 아래에서 Cu의 농도는 감소되고 Ag의 농도는 증가하는 농도구배가 발생하여, 브레이징 합금의 산화물은 Cu산화물층(CuO)/Ag잉여층/Cu산화물층(Cu2O)/Ag잉여층의 다층구조를 갖았다. 또한, 분위기중의 산소는 Cu산화물 및 Ag잉여층을 통해 브레이징 합금 내부로 확산되어 브레이징 합금내의 Ti와 반응하여 내부산화물 TiO2를 생성하였다.

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$Sb_2S_3$ 박막과 Ag 도핑한 $Sb_2S_3$ 박막의 광학적인 특성 (Optical Properties of $Sb_2S_3$ and Ag Doped $Sb_2S_3$ Thin Films)

  • 김종기;박정일;이현용;이영종;정홍배
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 D
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    • pp.1959-1961
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    • 1999
  • We prepared the $Ag[100\AA])/Sb_2S_3[3000\AA]$ films using the thermal evaporator. The films were exposed by the blue-pass filtered mercury lamp and the polarized He-Ne laser. We have investigated the dependence of the induced optical energy with Ag-doping and have observed the transmittance variation near the optical absorption edge with the light source. It was shown that the energy gap of this thin film was largely changed by exposing He-Ne laser, the light source of the near energy gap of this thin film. It is because of the structural change from Ag-doping. It is investigated that the dissolution, the diffusion, and the field effect of the Ag thin film generate the Ag spatial distribution.

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Rapid Thermal Annealing at the Temperature of 650℃ Ag Films on SiO2 Deposited STS Substrates

  • Kim, Moojin;Kim, Kyoung-Bo
    • Applied Science and Convergence Technology
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    • 제26권6호
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    • pp.208-213
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    • 2017
  • Flexible opto-electronic devices are developed on the insulating layer deposited stainless steel (STS) substrates. The silicon dioxide ($SiO_2$) material as the diffusion barrier of Fe and Cr atoms in addition to the electrical insulation between the electronic device and STS is processed using the plasma enhanced chemical vapor deposition method. Noble silver (Ag) films of approximately 100 nm thickness have been formed on $SiO_2$ deposited STS substrates by E-beam evaporation technique. The films then were annealed at $650^{\circ}C$ for 20 min using the rapid thermal annealing (RTA) technique. It was investigated the variation of the surface morphology due to the interaction between Ag films and $SiO_2$ layers after the RTA treatment. The results showed the movement of Si atoms in silver film from $SiO_2$. In addition, the structural investigation of Ag annealed at $650^{\circ}C$ indicated that the Ag film has the material property of p-type semiconductor and the bandgap of approximately 1 eV. Also, the films annealed at $650^{\circ}C$ showed reflection with sinusoidal oscillations due to optical interference of multiple reflections originated from films and substrate surfaces. Such changes can be attributed to both formation of $SiO_2$ on Ag film surface and agglomeration of silver film between particles due to annealing.

Ag 코팅한 W-Ag 전기접점/Cu 모재간의 브레이징 접합 특성 (Brazing Adhesion Properties of Ag Coated W-Ag Electric Contact on the Cu Substrate)

  • 강현구;강윤성;이재성
    • 한국분말재료학회지
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    • 제13권1호
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    • pp.18-24
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    • 2006
  • The brazing adhesion properties of Ag coated W-Ag electric contact on the Cu substrate have been investigated in therms of microstructure, phase equilibrium and adhesion strength. Precoating of Ag layer ($3{\mu}m$ in thickness) on the $W-40\%Ag$ contact material was done by electro-plating method. Subsequently the brazing treatment was conducted by inserting BCuP-5 filler metal (Ag-Cu-P alloy) layer between Ag coated W-Ag and Cu substrate and annealing at $710^{\circ}C$ in $H_2$ atmosphere. The optimum brazing temperature of $710^{\circ}C$ was semi-empirically calculated on the basis of the Cu atomic diffusion profile in Ag layer of commercial electric contact produced by the same brazing process. As a mechanical test of the electric contact after brazing treatment the adhesion strength between the electric contact and Cu substrate was measured using Instron. The microstructure and phase equilibrium study revealed that the sound interlayer structure was formed by relatively low brazing treatment at $710^{\circ}C$. Thin Ag electro-plated layer precoated on the electric contact ($3{\mu}m$ in thickness) is thought to be enough for high adhesion strength arid sound microstructure in interface layer.

Graphene, Cu와 Ag 나노 파우더를 이용한 열전도재의 방열 특성에 관한 연구 (A study on the heat dissipation characteristic of thermal interface materials with Graphene, Cu and Ag nano powders)

  • 박상혁;임성훈;김현지;노정필;허선철
    • 한국산업융합학회 논문집
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    • 제22권6호
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    • pp.767-773
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    • 2019
  • The thermal diffusion performance of the electronic device is a factor for evaluating the stability of the electronic device. Therefore, many of research have been conducted to improve the thermal characteristics of thermal interface materials, which are materials for thermal diffusion of electronic products. In this study, nano thermal grease was prepared by blending graphene, silver and copper nano powders into a thermal grease, a type of thermal interface materials, and the heat transfer rate was measured and compared for the purpose of investigating the improved thermal properties. As a result, the thermal properties were good in the order of graphene, silver and copper, which is thought to be due to the different thermal properties of the nano powder itself.