• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.640-640
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• 2013

본 연구에서는 유리 기판과 Si 기판에 Ag-doped ZnO 나노로드를 수열합성법을 이용하여 성장하였다. ZnO는 UV 영역에서 exciton 발광을 하며, 가시광선에서도 발광을 하는 것으로 알려져 있다. 그리고 Ag 금속은 입자형태로 ZnO 박막에 도포되었을 때 UV영역의 발광 세기를 강화시킨다는 사실이 알려져 있다. 이러한 내용을 바탕으로 ZnO 나노로드 합성 용액에 Ag powder의 양을 변화시켜 첨가하고, 유리와 Si기판을 넣고 80도에서 30분간 성장하였다. XRD, XPS를 통해 구조적 특성 변화를 보았고 SEM을 통해 나노로드의 형태를 확인하였다. 또한 PL, 투과도 측정을 통해 Ag 도핑에 따른 광학적 특성 변화를 확인하였다. SEM 측정으로 샘플의 단면을 확인한 결과 Ag 도핑 농도에 따른 차이가 거의 없음을 알았다. ZnO 나노로드가 성장된 유리 기판은 본래의 유리기판보다 투과도가 높았으며, Ag를 많이 첨가할수록 투과도가 낮아졌다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.130-133
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• 2002

Solder leaching resistance of the metal electrode is an important factor with regard to adhesion properties of ceramic substrate. In the Low Temperature Co-fired Ceramics (LTCC), Ag-Pd or Ag-Pt pastes are used instead of pure Ag paste to prevent leaching. Solder leaching behavior of the Ag-Pd paste in relation to LTCC raw material powder size was investigated. First fabrication of LTCC green tape with different particle size was done. LTCC substrates with Ag-Pd electrode were prepared using conventional multilayer ceramic process. Dipping test was performed to test solder leaching behavior of the electrode. Ag-Pd electrode on LTCC substrate with smaller particle size achieved higher solder leaching resistance.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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• pp.163-164
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• 2011

본 연구에서는 Ag paste의 전도성 필러로 사용되는 Ag 파우더를 대체하고자 Ag-coated SnO 파우더가 합성되었다. Ag-coated SnO 파우더의 합성을 위해서는 (1) 균일한 SnO 파우더 합성, (2) SnO 파우더 위에 Ag 무전해도금 과정이 수행 되어야 한다. 본 발표에서는 무전해 도금과정 중 Ag입자의 초기 핵생성 및 성장 관점에서, SnO 파우더의 전처리 조건, 반응 온도 및 pH, 첨가되는 환원제 양의 효과가 조사되었다.

• 한국분말재료학회지
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• 제27권4호
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• pp.333-338
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• 2020

In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu₃P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/㎠. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.

• Advances in nano research
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• 제1권4호
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• pp.211-218
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• 2013

A low-cost, green and reproducible citric acid assisted synthesis of nanocrystalline $Al_{0.5}Ag_{0.5}TiO_3$ (n-AAT) powder is reported. X-ray, FTIR, energy dispersive X-ray, transmission electron microscopy and scanning electron microscopy analyses are performed to ascertain the formation of n-AAT. X-ray diffraction data analysis indicated the formation of monoclinic structure. Spherical shaped particles having the sizes of 3-15 nm are found. The mechanism of nano-transformation for the soft-chemical synthesis of n-AAT has been explained using simple organic chemistry rules and nucleation and growth theory. Dielectric study revealed that AAT ceramic might be a suitable candidate for capacitor applications.

• 한국분말재료학회지
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• 제4권3호
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• pp.196-204
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• 1997

Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1251-1252
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• 2006

In order to investigate 95% retained critical current of Bi-2223/Ag tapes under various stress-strain conditions, load cell attached tension and bending apparatus was used. The critical current of stress-strained tape was degraded below 95% retained critical current when tension and bending was simultaneously applied together. But only one of this tension or bending did not degrade the tape below 95% retained critical current. Deformation temperature was important to maintain the 95% retained Ic of Bi-2223/Ag tapes after bending or tension deformation because mechanical strength of tapes can be changed drastically between room temperature and 77 K.

• 한국분말재료학회지
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• 제10권3호
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• pp.190-194
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• 2003

Thin Ag films deposited onto $SiO_2/Si$ substrates by DC magnetron sputtering and thereafter annealed ,it temperatures 100-50$0^{\circ}C$ are investigated by scanning tunneling and atomic forte microscopy. It is shown that the film surface topography and microstructure are considerably changed as a result of annealing. To provide a quantitative estimation of the surface topography changes of Ag films the surface fractal dimension was calculated. Elasticity and hardness of the films are studied by a nanoindentation technique. The films are found to have value of elastic modulus close to that of bulk silver while their hardness and yield stress are essentially higher.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2003년도 춘계학술강연 및 발표대회
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• pp.34-34
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• 2003

전기설()폭발(Electric Wire Explosion)법은 고밀도 전류를 금속와이어에 인가시키면 저항 발열에 의해서 금속와이어가 빠르게 가열되고, 수$\mu$sec 이내에 초기체적에 비해 2~3배나 팽창한 후 폭발하는 현상을 이용하여 나노분말을 제조하는 방법으로써, 다른 제조방법에 비해 값싼 비용으로 1~50$\mu$sec의 짧은 시간동안 극히 높은 온도($10^4~10^6K$)에 도달하기 때문에, 와이어 전체가 동시에 기화하여 원재료의 조성을 갖는 분말의 합성이 가능하며, 공급되는 에너지와 시간, 챔버의 용적과 압력을 제어함으로써 평균 분말 크기를 조절할 수 있다는 잇점이 있다. 또한, 금속 와이어 주위의 분위기를 조절함으로써 금속나노분말뿐만 아리나 산화물$\cdot$질화물$\cdot$탄화물 분말, 합금 분말, 화학적 화합물이나 복합재료 나노분말들을 만들 수 있어서 여러 산업분야에 대한 응용이 크게 기대되고 있다. 본 연구에서는 전기선()폭발 챔버(Fig. 1) 와 최대 20kV까지 제어 가능한 고출력 펄스 전원장치를 자체 제작하고, 이를 이용하여 은(Ag)나노분말 합성에 대한 실험을 행하였다. 이렇게 제조된 분말은 SEM, XRD, PSA, BET 등을 이용하여 비교분석 하였다.

• 반도체디스플레이기술학회지
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• 제20권2호
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• pp.73-76
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• 2021

This thesis described the optical and electrical properties of the alternating current powder electroluminescent device based on Ag nanowire as a transparent electrode. The Ag nanowire electrode showed the morphology of 20 nm in diameter and 15 ㎛ in length. The transparent electroluminescent devices that were fabricated using the nanomilled ZnS : Cu, Mn phosphor by bar-coating process showed the transmittance of 67%. In order to improve the luminous efficiency, it is necessary to apply the transparent dielectric layer and increase the amount of the nanophosphor while maintaining the transmittance.