• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.8
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• pp.651-656
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• 2012

A study on capacitive characteristics of stylus pen for touch panel are progressed in this paper. Also the main factors for capacitive sensitivity are studied. Namely, highly sensitive stylus pen which can be applied to capacitive touch panel are studied based on the analysis of materials and process conditions regardless of pattern shapes. Stylus pen was made of PDMS(Poly-Di-Methyl-Siloxane) and conductive metal powders which does not damage the touch panel surface. We tried to get the advantages of both the properties of soft PDMS and conductive metal powders. We found that potential difference of capacitance change with conductivity of the composite materials(PDMS + metal powders) it implies that during touch process, large voltage difference can be caused by the high conductive materials of stylus pen. Stylus pen made by PDMS with mixed with Ag powders which has large conductivity shows more capacitance change of 1 pF than PDMS with other materials of Ni or C powders.

• Journal of the Korean Society for Heat Treatment
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• v.19 no.4
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• pp.219-224
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• 2006

Silver paste with low sintered temperature has been developed in order to apply electronic parts, such as bus electrode, address electrode in PDP (Plasma Display Panel) with large screen area. In this study, nano-sized silver particles with 10-30 nm were synthesized from silver nitrate ($AgNO_3$) solution by chemical reduction method and silver paste with low sintered temperature was prepared by mixing silver nanoparticles, conventional silver powder with the particle size 1.6 um and Pb-free frit. Conductive thick film from silver paste was fabricated by screen printing on alumina substrate. After firing at $540^{\circ}C$, the cross section and surface morphology of the thick films were analyzed by FE-SEM. Also, the sheet resistivity of the fired thick films was measured using the four-point technique.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.230-235
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• 2000

The extrusion process for long-length multi-filaments of BSCCO 2223 superconductor tape has been investigated with aids of Finite Element Method and experimental inspection. Since the arrangement of filaments in matrix material has characteristic of rotational symmetry, a 2-dimensional commercial FEM package, DEFORM-2D, was adopted to simulate extrusion process with different variables such as hardness of sheath material, lengths of each filament and arrangement. From the FEM analysis, since the inner filaments move faster than the outer one, distribution of filaments is needed to be optimized. In the case of pure Ag matrix, undesirable non-uniform distribution of filament was obtained due to low hardness of sheath material. Dummy sample(brass (sheath) and talc powder(filament)), however, which has relatively high hardness of sheath material, had been produced with desirable results. Therefore, it is necessary to optimize hardness of sheath material, extrusion temperature and billet design.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.189-190
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• 2005

Ploycrystalline $Pb(Zr_{0.5},Ti_{0.5))O_3$ and $BaTiO_3$ powder were prepared by sol-gel process. The alumina substrate were sintered at $1400^{\circ}C$ with bottom electrode of Pt for 2 hours. The Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films with laminating times were fabricated on alumina substrate by screening printing method. The obtained thick films were sintered at $800^{\circ}C$ with upper electrode of Ag paste for 1 hour. Structural properties of Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films were investigated. As a result of the Differential Thermal Analysis(DTA) of Pb(Zr0.5,Ti0.5)O3, exothermic peak was observed at around 650 $^{\circ}C$. The X-ray diffraction (XRD) patterns indicated that BaTiO3 and Pb(Zr0.5,Ti0.5)O3 phases and porosities were formed in the interface of Pb(Zr0.5,Ti0.5)O3 / BaTiO3multilayered thick films.

• Composites Research
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• v.17 no.5
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• pp.61-67
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• 2004

This paper reports the electrical conductivity and the stress-strain behavior of silver particle-filled silicone composite pastes for electromagnetic interference (EMI) shielding gasket materials. The percolation threshold (critical concentration) of the composite paste obtained by incorporating irregular sphere-shaped silver particles and room temperature vulcanizing (RTV) silicone resin was determined from the electrical conductivity result. At about 28 vol% Beading of untreated silver particles, the percolation phenomenon occurred and at this critical concentration, the volumetric resistivity, the tensile strength, and the elongation of the pastes were investigated. This work also suggests that the stress-strain characteristics of a composite paste filled with metal particles above the percolation threshold may be effectively improved by properly selecting a coupling agent.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.57-59
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• 2005

Ploycrystalline $Pb(Zr_{0.5},Ti_{0.5})O_3$ and $BaTiO_3$ powder were prepared by sol-gel process. The alumina substrate were sintered at $1400^{\circ}C$ with bottom electrode of Pt for 2 hours. The Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films with laminating times were fabricated on alumina substrate by screening printing method. The obtained thick films were sintered at $800^{\circ}C$ with upper electrode of Ag paste for 1 hour. Structural properties of Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films were investigated. As a result of the Differential Thermal Analysis(DTA) of Pb(Zr0.5,Ti0.5)O3, exothermic peak was observed at around $650^{\circ}C$. The X-ray diffraction (XRD) patterns indicated that BaTi03 and Pb(Zr0.5,Ti0.5)O3 phases and porosities were formed in the interface of Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films.

• Carbon letters
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• v.4 no.4
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• pp.168-174
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• 2003

Silver nitrate ($AgNO_3$) powder was mixed into a reformed pitch precursor. Then, the silver-containing pitch was melt spun to form round and "C" shape fibers. A wire mesh was inserted prior to the nozzle to improve the spinnability of the silvercontaining precursor pitch. Silver particles in the carbon fibers (CFs) were detected by XRD and TEM. These tests showed that silver particles were uniformly distributed and the total amount of silver remained constant during stabilization and carbonization. Next, the silver-containing CFs were activated by steam diluted in nitrogen gas. Silver particles accelerated the activation rate, but the specific surface areas of the silver-containing ACFs were similar to those of non-silver containing ACFs at the same burn-off levels. The specific surface area of the C-shaped activated carbon fibers was larger than that of the round activated carbon fibers. The likely reason is that the surface area of a C-shaped CF is about two times larger than that of a round CF when equivalent cross-sectional areas are compared. A small amount of silver particles in the periphery of the CFs was removed during the activation, but the remainder of silver was stayed within the ACFs.

• ETRI Journal
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• v.35 no.4
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• pp.625-631
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• 2013

For the formation of solder bumps with a fine pitch of 130 ${\mu}m$ on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of $220^{\circ}C$. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 ${\mu}m$, 18.3 ${\mu}m$, and 12.0 ${\mu}m$, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.

• Progress in Superconductivity and Cryogenics
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• v.7 no.3
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• pp.29-33
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• 2005

Critical current$(I_c)$ degradation of High $T_c$ Superconducting(HTS) tapes and AC loss under mechanical load is one of the hottest issues in HTS development and application. Mechanical load reduces the critical current of superconducting wire, and the $I_c$ degradation affects the AC loss of the wire. We measured the $I_c$ degradation and AC loss under tension and bending of Bi-2223 tapes made by 'Powder-in-Tube' technique at 77K with self-field. Also, we have studied the frequency characteristics on self-field AC loss in multi-filamentary Bi-2223/Ag tape at 77K. The measurement results and discussions on the relationship between $I_c$ degradation and AC loss are presented.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.11
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• pp.589-595
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• 2000

In this papre, AC losses of Bi-2223 tapes with different twist pitch of superconducting core were fabricated, measured and analyzed. These samples produced by a powder-in-tube method are multi-filamentary tape with Ag matrix. Also, it's produced by non-twist and different twist pitch(8, 10, 13, 30, 50, 70 mn). The critical current measurement was carried out under the environment in Liquid nitrogen and in zero field by 4-probe method. And the AC loss measurement was carried out under the environment of applied time-varying transport current by transport method. From experiment, the critical current is larger non-twist than twisted filament. And, the AC loss by Norris equation is higher non-twisted tape than 13mm twisted tape. Also, it is confirmed that of AC loss of tape having non-twist pitch larger than those having differnet twist pitch.