• The Journal of the Convergence on Culture Technology
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• v.10 no.2
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• pp.237-244
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• 2024

We studied the effects on their academic achievement of chemistry II and advanced chemistry subjects of science high school students according to the type of class (face-to-face and non-face-to-face). The subjects of this study were 195 first-year students of G Science High School located in Gyeongnam. The average scores of Chemistry II and Advanced Chemistry in non-face-to-face classes in 2020 and face-to-face classes in 2021 were compared and analyzed. As a result of comparing and analyzing the academic achievement according to the class type, students' grades in Chemistry II and Advanced Chemistry were higher in non-face-to-face classes. In the comparison of academic achievement by level according to class type, Chemistry II showed higher average grades in non-face-to-face classes as the lower level were, and in advanced chemistry, the higher the upper grades in non-face-to-face classes. In addition, in terms of the effect of changes in class form on the upper and lower 10% levels of academic achievement of Chemistry II, the upper 10% showed high grades in face-to-face classes and the lower 10% in non-face-to-face classes. On the other hand, in advanced chemistry, the average grade of non-face-to-face classes was higher than that of face-to-face classes in the top 10%, and the average grade of face-to-face classes was higher than that of non-face-to-face classes in the bottom 10%. Through these results, it was found that in the teaching-learning of science high school students, instructors need to design and treat teaching-learning appropriate to the level of academic achievement.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.17 no.3
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• pp.91-94
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• 2007

Single-crystalline $SnO_2$ nanowires were successfully grown on Si(001) substrates via vapor-liquid-solid mechanism in a thermal chemical vapor deposition. Large quantity of $SnO_2$ nanowires were synthesized at temperature ranges of $950{\sim}1000^{\circ}C$ in Ar atmosphere. It was found that the grown $SnO_2$ nanowires are of a tetragonal rutile structure and single crystalline by diffraction and transmission electron microscopy measurements. Broad emission located at about 600 m from the grown nanowires was clearly observed in room temperature photoluminescence measurements, indicating that the emission band originated from defect level transition into $SnO_2$ nanowires.

• Smart Structures and Systems
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• v.20 no.6
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• pp.683-696
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• 2017

In this study, the reliability of nonlinear ultrasonic modulation based fatigue crack detection is improved using a feature-level data fusion approach. When two ultrasonic inputs at two distinct frequencies are applied to a specimen with a fatigue crack, modulation components at the summation and difference of these two input frequencies appear. First, the spectral amplitudes of the modulation components and their spectral correlations are defined as individual features. Then, a 2D feature space is constructed by combining these two features, and the presence of a fatigue crack is identified in the feature space. The effectiveness of the proposed fatigue crack detection technique is experimentally validated through cyclic loading tests of aluminum plates, full-scale steel girders and a rotating shaft component. Subsequently, the improved reliability of the proposed technique is quantitatively investigated using receiver operating characteristic analysis. The uniqueness of this study lies in (1) improvement of nonlinear ultrasonic modulation based fatigue crack detection reliability using feature-level data fusion, (2) reference-free fatigue crack diagnosis without using the baseline data obtained from the intact condition of the structure, (3) application to full-scale steel girders and shaft component, and (4) quantitative investigation of the improved reliability using receiver operating characteristic analysis.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.42-48
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• 2023

Recently, there has been an increasing demand for performance improvement and miniaturization in response to the growing variety of signals and power demands in many industries such as mobile, IoT, and automotive. As a result, there is a high demand for high-performance chips and advanced packaging technologies that can package such chips. In this context, the FOWLP process technology is a suitable technology, and this paper discusses the plasma application technologies that are being used and studied to improve the shortcomings of this process. The paper is divided into four parts, with an introduction and case studies for each of the plasma application technologies used in each part.

• KSTLE International Journal
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• v.2 no.2
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• pp.150-153
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• 2001

The effects of humidity on friction performance of automotive brake materials were studied using a pad-on-disk type friction tester. Three different friction materials based on a simple formulation were investigated by changing the solid lubricant graphite, MoS$_2$, and Sb$_2$S$_3$. Friction materials without solid lubricants were also examined to study the effect of other ingredients in the matrix on humidity. The friction material containing graphite was strongly affected by the humidity showing lower friction coefficient at high humidity level than other conditions. On the other hand, the friction material containing MoS$_2$exhibited higher friction coefficient at initial stage under high humidity level. The friction material without solid lubricant or with Sb$_2$S$_3$ was not affected by humidity conditions. However, the friction material containing barite showed strong speed dependence.

• Journal of Electrical Engineering and Technology
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• v.10 no.5
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• pp.1958-1968
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• 2015

In this paper, a new definition of short-circuit ratio concept for multi-converter HVDC systems is proposed. Analysis results of voltage interaction between converters show that the reactive power-voltage characteristic of a converter has a dominant effect on voltage interaction level compared with its active power-voltage characteristic. Such a relation between converter reactive power and voltage interaction level supports taking the former into account in the definition of short-circuit ratio concept for multi-converter systems. The proposed definition is verified by the method of maximum power curve for various system configurations. Furthermore, a formula to calculate transient overvoltage for multi-converter systems is derived based on the proposed definition, and the efficiency of the derived formula is verified.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1120-1123
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• 2008

Efficient, color stable multi-EML WOLED have been fabricated using newly synthesized yellowish green dopant Ir(chpy)3 or Ir(mchpy)3. The devices have high external quantum efficiency of 11.7%, color rendering index of 87, variation of CIE coordinate of (0.02, 0.01) between 10 to 5000 cd/m2, and low roll-off in efficiency with increasing brightness.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• IEIE Transactions on Smart Processing and Computing
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• v.3 no.3
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• pp.103-109
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• 2014

This study derived the inter-conversion matrices, which can be used in heterogeneous image transcoding between the compressed images using different transforms, such as the $8{\times}8$ block discrete cosine transform (BDCT) and the one-level discrete wavelet transform (DWT). Basically, to obtain the one-level DWT coefficients from $8{\times}8$ BDCT, inverse BDCT should be performed followed by forward DWT, and vice versa. On the other hand, if the proposed interconversion approach is used, only one inter-conversion matrix multiplication makes the corresponding transcoding possible. Both theoretical and experimental analyses showed that the amount of computation of the proposed approach decreases over 20% when the inter-conversion matrices are used under specific conditions.

• Industrial Engineering and Management Systems
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• v.9 no.3
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• pp.204-214
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• 2010

A manufacturing/remanufacturing system is investigated with the consideration of required minimum quality of end-of-used products. A constant demand is satisfied by remanufacturing end-of-used products and manufacturing raw materials outsourced from outside. It is assumed in this system that the buyback price and remanufacturing cost are related to the different quality level of end-of-used products. For remanufacturing, only the used products that satisfy a required minimum quality level will be recycled. Thus, the returning rate is a function of the required minimum quality level. Functions of returning rate, buyback price and remanufacturing cost, which are closely connected to the quality level of end-of-used products, are investigated here. Treating the required minimum quality level of end-of-used products, the length of a cycle, the number of manufacturing lots and remanufacturing lots in a cycle as decision variables, the mathematical models with the objective of minimizing the average total cost are constructed. Through construction of a solution process based on Tabu Search algorithm and calculating examples, the validity of the models is illustrated.