• Title/Summary/Keyword: Advanced Manufacturing Industry

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Development of software for computing forming information using a component based approach

  • Ko, Kwang-Hee;Park, Jung-Seo;Kim, Jung;Kim, Young-Bum;Shin, Jong-Gye
    • International Journal of Naval Architecture and Ocean Engineering
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    • v.1 no.2
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    • pp.78-88
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    • 2009
  • In shipbuilding industry, the manufacturing technology has advanced at an unprecedented pace for the last decade. As a result, many automatic systems for cutting, welding, etc. have been developed and employed in the manufacturing process and accordingly the productivity has been increased drastically. Despite such improvement in the manufacturing technology, however, development of an automatic system for fabricating a curved hull plate remains at the beginning stage since hardware and software for the automation of the curved hull fabrication process should be developed differently depending on the dimensions of plates, forming methods and manufacturing processes of each shipyard. To deal with this problem, it is necessary to create a "plug-in" framework, which can adopt various kinds of hardware and software to construct a full automatic fabrication system. In this paper, a framework for automatic fabrication of curved hull plates is proposed, which consists of four components and related software. In particular the software module for computing fabrication information is developed by using the ooCBD development methodology, which can interface with other hardware and software with minimum effort. Examples of the proposed framework applied to medium and large shipyards are presented.

A Study on the Multi-row Progressive Die for Thin Sheet Metal Forming by Computer Simulation

  • Sim, Sung-Bo;Kim, Chung-Hwan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.7 no.3
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    • pp.75-80
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    • 2008
  • The progressive die performs a work of sheet metal processes with a piercing, notching, embossing, bending, drawing, cut-off etc. in many kinds of pressing. Now a days, these processes have been evaluated as a advanced tooling method to increase the productivity and high quality assurance. The first step analyzing of die design is production part review, then the arrangement drawing of product design and strip process layout design should be done as a next steps with a FEM simulation for its problem solution. After upper procedure were peformed, it was started to make the die, then tryout and its revision of the die and product quality, safety, productivity etc. were done continually. For the all of these process, we mobilized the theory and practice of sheet metal forming, die structure, the function and activity of die components, and the others of die machining, die material, heat treatment and know‐how so on. In this study the features of representative are production part analyzing through the FEM simulation of bending area with a considering spring back problem by DEFORM.

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How Total Quality Management Mediates Antecedent Variables of Employee Performance?

  • KUSTONO, Alwan Sri
    • The Journal of Asian Finance, Economics and Business
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    • v.7 no.12
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    • pp.523-534
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    • 2020
  • The research objective was to find out how Total Quality Management (TQM) mediates antecedents of employee performance variables? The research was conducted with a quantitative approach while the research design was cross sectional. The research model was tested using the structural equation modeling approach with partial least square analysis tools to test the influence among research variables. The research sample consisted of 315 respondents who answered a questionnaire in August-September 2019 at manufacturing companies in East Java. The results showed that situational leadership did not affect employee performance, but did affect the successful implementation of TQM. The performance measurement system has no direct effect on employee performance. The performance measurement system has a direct effect on employee performance. Organizational culture has a direct effect on both employee performance and the application of TQM, so that the application of TQM can improve employee performance. TQM implementation variable acts as a mediation between situational leadership and organizational culture on employee performance. The relationship that was originally a direct influence turned into an indirect effect through TQM. The TQM variable is not proven to be an intervening variable between the performance measurement system and employee performance. There is a direct relationship between these two variables.

Test and Evaluation based on Standard Regulation of USA Federal Automotive Safety of Assistant Driver's Seat Airbag at Low Risk Deployment Passenger Airbag using Passenger Protection Wrap (승객보호용 랩을 적용한 저위험성 조수석 에어백의 미국 연방 자동차안전 기준법규에 의거한 시험과 평가)

  • Kim, Dong-Eun;Kim, Jin-Hyeong;Kang, Myung-Chang
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.15 no.1
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    • pp.61-67
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    • 2016
  • The airbag is a widely accepted device for occupant protection in the automotive industry. As the injuries induced by airbag deployment have become a critical issue, revisions to Federal Motor Vehicle Safety Standard (FMVSS) 208 were required to create advanced airbags that can protect occupants of varying statures. In this paper, we developed a new low-risk deployment passenger airbag by adding the Passenger Protection Wrap (PPW). The PPW reduces the cushion impact force to the occupant in order to ensure pressure dispersion. A series of tests were conducted by using FMVSS 208 test procedures to demonstrate the proposed system. It was found that the system not only satisfied the injury criteria of FMVSS 208 but was also effective for protecting passengers of all sizes (male, small female, 3-year-old, 6-year-old).

Corporate strategy for competitiveness of textile products (섬유제품의 경쟁력 제고를 위한 기업의 전략방안)

  • 강병서
    • Korean Management Science Review
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    • v.12 no.2
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    • pp.1-14
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    • 1995
  • Recently Korean textile industry has been in the phase that requires its strategy change from the less-develped country style of the labor-intensive products to the developed country style of the technology-intensive products. It needs to make more efforts to develop the value-added products to meet the customer's various needs. In addition, development of technology, equipment, and design is required to implement its corporate strategy successfully. Although Korean textile companies have currently kept skillful labor and advanced equipments, they are losing their share in the international textile markets. This is mainly because corporate management has not been involved with efficient strategy. Strategy is an adoption of a company to environment by its corporate members, thus leading to the requirement of coordination of the main functions such as manufacturing and marketing. In fact, the coordination of the two departments toward reaching the corporate goal is not easy since the two are interested in different areas, respectively. Manufacturing people show their interests in production capacity, equipment layout, process technology, quality, purchasing, and labor while marketing people, target customer, product mix, advertisement, product specification, and customer service. For this reason, conflicts sometimes happen between the two departments. There are, however, many area that need a horizontal cooperation, for instance, in layout, process technology, product mix, and potential demand. Therefore, reciprocal coordination is necessary for achieving the firm's common objectives. This study was concerned with determining the factors that enhance the competitiveness of textile firms so that they could reach the common goal of the two departments with a horizontal collaboration.

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Characteristics of Friction Materials for Brake Disc in F-16 B32 Fighter (F-16 B32 전투기용 브레이크 디스크 소재의 물성특성 연구)

  • Kam, Moon-Gap;Kim, Won-Il;Kim, Tae-Gyu
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.6 no.3
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    • pp.98-104
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    • 2007
  • The carbon fiber reinforced carbon composite (CFRC) materials are necessary for the advanced industries that require the thermal resistance. And the development and research for CFRC has been in progress in the field of aerospace and defense industry. CFRC have several advantages and special properties such as excellent anti ablation, outstanding strength retention at very high temperature, high heat capacity and thermal transport, high specific stiffness and strength, and high thermal shock resistance. They have been used as aircraft brake, rocket nozzle, nose cones, jet engine turbine wheels, and high speed craft. Since the technology related to CFRC was prohibited from importing and exporting, we developed our own technology to produce F-16 B32 brake disk made out of CFRC, and then we performed various tests to observe the characteristics of CFRC-based brake disk developed in this study in view of density, strength, friction, specific heat, and heat conductivity.

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WLP and New System Packaging Technologies

  • WAKABAYASHI Takeshi
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.53-58
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    • 2003
  • The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

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Flame image precise measurement and flame control to raise combustion efficiencies of a blast furnace (고로의 연소효율을 높이기 위한 화염영상 정밀 검출 및 화염제어)

  • Kim, Jae-Yeol;Lee, Seung-Chul;Kwak, Nam-Su;Han, Jae-Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.13 no.6
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    • pp.8-14
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    • 2014
  • Pulverized coal (PC) has become an important auxiliary fuel in the iron and steel industry since the technique of pulverized coal injection (PCI) was developed for iron making. The combustion efficiencies of pulverized coal in blowpipes and tuyeres under various operational conditions are numerically predicted to determine the performance levels with regard to different locations of the nozzles in a blast furnace. A variety of parameters, including the pulverized coal quantities, oxygen amounts, inlet temperatures of the tuyeres, and the mass flow rate of coal carrier gas are taken into consideration. Also, in order to develop greater efficiency than those of existing coal injection systems, this study applies a flame measurement system using a charge-coupled device (CCD) camera and a frame grabber. It uses auto sampling algorithms from the flame shape information to determine the device for the optimal location control for PCI. This study finds further improvements of the blast furnace performance via the control of the PCI locations.

Measurement of Step Difference using Digital Holography of ITO Thin Film Fabricated by Sputtering Method (스퍼터링 공법으로 제작한 ITO 박막의 디지털 홀로그래피를 이용한 단차에 대한 측정)

  • Jung, Hyun Il;Shin, Ju Yeop;Park, Jong Hyun;Jung, Hyunchul;Kim, Kyeong-suk
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.9
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    • pp.84-89
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    • 2021
  • Indium tin oxide (ITO) transparent electrodes, which are used to manufacture organic light-emitting diodes, are used in light-emitting surface electrodes of display EL panels such as cell phones and TVs, liquid crystal panels, transparent switches, and plane heating elements. ITO is a major component that consists of indium and tin and is advantageous in terms of obtaining sheet resistance and light transmittance in a thin film. However, the optical performance of devices decreases with an increase in its thickness. A digital holography system was constructed and measured for the step measurement of the ITO thin film, and the reliability of the technique was verified by comparing the FE-SEM measurement results. The error rate of the step difference measurement was within ±5%. This result demonstrated that this technique is useful for applications in advanced MEMS and NEMS industrial fields.

Possibility of Benzene Exposure in Workers of a Semiconductor Industry Based on the Patent Resources, 1990-2010

  • Choi, Sangjun;Park, Donguk;Park, Yunkyung
    • Safety and Health at Work
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    • v.12 no.3
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    • pp.403-415
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    • 2021
  • Background: This study aimed to assess the possibility of benzene exposure in workers of a Korean semiconductor manufacturing company by reviewing the issued patents. Methods: A systematic patent search was conducted with the Google "Advanced Patent Search" engine using the keywords "semiconductor" and "benzene" combined with all of the words accessed on January 24, 2016. Results: As a result of the search, we reviewed 75 patent documents filed by a Korean semiconductor manufacturing company from 1994 to 2010. From 22 patents, we found that benzene could have been used as one of the carbon sources in chemical vapor deposition for capacitor; as diamond-like carbon for solar cell, graphene formation, or etching for transition metal thin film; and as a solvent for dielectric film, silicon oxide layer, nanomaterials, photoresist, rise for immersion lithography, electrophotography, and quantum dot ink. Conclusion: Considering the date of patent filing, it is possible that workers in the chemical vapor deposition, immersion lithography, and graphene formation processes could be exposed to benzene from 1996 to 2010.