• Journal of Information Processing Systems
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• v.15 no.1
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• pp.181-188
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• 2019

A production system is a management system that supports all activities to perform production operations at the manufacturing site. From the point-of-view of a smart factory, smart manufacturing systems redesigned the concept of onsite production systems to fit the entire system and its necessary functional composition. In this study, we select the key functions needed to build a smart factory for a PCB line and propose a new six-step model for the deployment of a smart manufacturing system by integrating essential functions. The smart manufacturing system newly classified the production and operation tasks of PCB manufacturing and selected necessary functions through requirement analysis and benchmarking of advanced companies. The selected production operation tasks are mapped to the functions of the system and configured into seven modules, and the optimal deployment model is presented to allow flexible responses to the characteristics of the tasks. These methodologies are first presented in this study, and the proposed model was applied to the PCB line to confirm that they had significant changes in the work method, qualitative effects, and quantitative effects. Typically, lead time and WIP have reduced by about 50%.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 1995.04a
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• pp.709-709
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• 1995

• 제어로봇시스템학회:학술대회논문집
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• 1987.10b
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• pp.613-618
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• 1987

Rod consolidation is a method of increasing spent nuclear fuel storage capacity by disassembling fuel assemblies thus storing the fuel rods in a tighter array. It involves some basic operations which closely resemble to the material handling of a manufacturing process. But all the operations must be controlled remotely in shielded environment from outside due to the highly radioactive nature of the workpiece. In this study the status of the rod consolidation technology in other countries has been surveyed and a feasibility study for the conceptual design of this process have been made.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1005-1006
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• 2011

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.9
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• pp.107-115
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• 2020

The rotation accuracy of the main spindle that determines the accuracy of CNC machine tools is closely related to the quality of production because it directly affects the shape error and surface roughness of the workpiece. Therefore, the main spindle requires high rotation accuracy, rigidity, and rotation technology. This rotation accuracy is greatly affected by the bearing, center alignment between rotating parts, assembly tolerance, and unbalance of the rotation mass. In this study, the effects of the unbalance of the rotation mass of the main spindle on the rotation accuracy were investigated experimentally. In particular, we tried to study the technical reasons for improving the unbalance of the main spindle and maintaining the rotation accuracy as we verified the correlation between the vibration characteristics of CNC machine tools due to the specifically set unbalance amount and the surface roughness of the workpiece.

• Design & Manufacturing
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• v.17 no.3
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• pp.21-27
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• 2023

The mold industry in Japan, an advanced country in the mold industry, is also at a point of great change. The main causes are the Ukraine crisis and the collapse of the global supply chain (parts supply chain) caused by COVID-19. In addition, the prices of overseas products are rising sharply due to rapid exchange rate fluctuations (decrease in the value of the yen). Until now, Japan's monotsukuri industry has been actively pursuing overseas expansion, riding the trend of globalization. However, the trend began to rapidly reverse, and now the monotsukuri industry that had expanded overseas is showing a tendency to return to Japan. Another factor of change is the change in the automobile industry, which is the most demanded product in the mold industry. As the automobile industry evolves from gasoline cars to electric cars, the number of parts that make up a car will drastically decrease. This trend is expected to increase the demand for small-scale production of a variety of products in the mold industry, and furthermore, it is expected that short delivery times will be required in parts development. As in Korea, the production population working in the mold industry is rapidly decreasing in Japan as well. Even if you add up the total population working in manufacturing in Japan, it only accounts for about 15%. Even in Japan, it is judged that it will be difficult to sustain the monotsukuri industry with this small production population. Therefore, since improvement in production efficiency cannot be expected with the same manual dexterity as before, the mold industry is also demanding the development of mold technology at a different level than before to increase productivity. In this paper, I would like to introduce new Japanese mold technology collected through attending the Intermold exhibition. This is an example of applying a dedicated pin (Gastos) to a mold to prevent an increase in internal pressure during plastic injection molding, and a deep drawing press molding technology with an inherent hydraulic function.

• Asian Journal of Innovation and Policy
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• v.8 no.1
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• pp.1-30
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• 2019

The advent of digitalisation has transformed economies into more integrated, but increasingly complex systems. This new trend has brought dynamic changes in the manufacturing sector through advanced ICT infrastructure, smart factories, digitally-controlled logistics, and skilled ICT-labour. The impacts of the digital economy on manufacturing could be best illustrated through "Industry 4.0." With this wave of technological advancement, countries aim to establish an industrial ecosystem where every manufacturing process and function is connected and interacts through digital networks. Industry 4.0 presents opportunities for Emerging Asia, as the region has emerged as a fast-growing manufacturing hub and particularly a production base for ICT goods. However, growing production capacity, increased exports, and increases in FDI in the field of ICT goods manufacturing have so far contributed little to the development and diffusion of ICT. A huge gap exists in the ICT uptake amongst countries and between small and large firms. This paper highlights the level of Industry 4.0 readiness of Emerging Asia and key factors that determine its enhancement.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.9
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• pp.875-880
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• 2015

Traditional semiconductor process control has been performed through statistical process control techniques in a constant process-recipe conditions. However, the complexity of the interior of the etching apparatus plasma physics, quantitative modeling of process conditions due to the many difficult features constraints apply simple SISO control scheme. The introduction of the Advanced Process Control (APC) as a way to overcome the limits has been using the APC process control methodology run-to-run, wafer-to-wafer, or the yield of the semiconductor manufacturing process to the real-time process control, performance, it is possible to improve production. In addition, it is possible to establish a hierarchical structure of the process control made by the process control unit and associated algorithms and etching apparatus, the process unit, the overall process. In this study, the research focused on the methodology and monitoring improvements in performance needed to consider the process management of future developments in the semiconductor manufacturing process in accordance with the age of the APC analysis in real applications of the semiconductor manufacturing process and process fault diagnosis and control techniques in progress.

• Bulletin of the Korean Chemical Society
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• v.34 no.11
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• pp.3335-3339
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• 2013

Boron-doped ZnO (BZO) nanorods were grown on quartz substrates using hydrothermal synthesis, and the temperature-dependence of their photoluminescence (PL) was measured in order to investigate the origins of their PL properties. In the UV range, near-band-edge emission (NBE) was observed from 3.1 to 3.4 eV; this was attributed to various transitions including recombination of free excitons and their longitudinal optical (LO) phonon replicas, and donor-acceptor pair (DAP) recombination, depending on the local lattice configuration and the presence of defects. At a temperature of 12 K, the NBE produces seven peaks at 3.386, 3.368, 3.337, 3.296, 3.258, 3.184, and 3.106 eV. These peaks are, respectively, assigned to free excitons (FX), neutral-donor bound excitons ($D^{\circ}X$), and the first LO phonon replicas of $D^{\circ}X$, DAP, DAP-1LO, DAP-2LO, and DAP-3LO. The peak position of the FX and DAP were also fitted to Varshni's empirical formula for the variation in the band gap energy with temperature. The activation energy of FX was about ~70 meV, while that of DAP was about ~38 meV. We also discuss the low temperature PL near 2.251 eV, related to structural defects.

• Bulletin of the Korean Chemical Society
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• v.34 no.4
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• pp.1205-1211
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• 2013

The structural and optical properties of the ZnO, Al-doped ZnO, Ga-doped ZnO, and In-doped ZnO nanorods were investigated using field-emission scanning electron microscopy, X-ray diffraction, photoluminescence (PL) and ultraviolet-visible spectroscopy. All the nanorods grew with good alignment on the ZnO seed layers and the ZnO nanorod dimensions could be controlled by the addition of the various dopants. For instance, the diameter of the nanorods decreased with increasing atomic number of the dopants. The ratio between the near-band-edge emission (NBE) and the deep-level emission (DLE) intensities ($I_{NBE}/I_{DLE}$) obtained by PL gradually decreased because the DLE intensity from the nanorods gradually increased with increase in the atomic number of the dopants. We found that the dopants affected the structural and optical properties of the ZnO nanorods including their dimensions, lattice constants, residual stresses, bond lengths, PL properties, transmittance values, optical band gaps, and Urbach energies.