• Title/Summary/Keyword: Adhesively Bonded Joint

Search Result 60, Processing Time 0.025 seconds

Establishment for Failure Criterion of Adhesively Bonded Joint (접착이음의 파괴 기준 설정을 위한 연구)

  • 이강용;공병석
    • Transactions of the Korean Society of Automotive Engineers
    • /
    • v.8 no.1
    • /
    • pp.183-190
    • /
    • 2000
  • The objective of this work is to develop a criterion for predicting the failure strength of the joints bonded by ductile adhesives. To obtain a criterion, first, fracture tests were carried out for T-peel joint and Single-lap joint with widely differing joints geometries. Then using the fracture loads obtained at tests, the finite element analysis were performed, in which the stresses in the adhesive bonds were calculated in great detail. After examining four epoxy adhesives, it is concluded that the fracture of adhesively bonded joint occurs when the maximum of the ratio of the mean to effective stresses exceeds a constant value which can be determined from analysis and test for each adhesive.

  • PDF

Analyses of Stress Intensity Factors and Evaluation of Fracture Toughness in Adhesively Bonded DCB Joints (DCB 접착이음에 대한 응력세기계수의 해석 및 파괴인성의 평가)

  • Jeong, Nam-Yong;Lee, Myeong-Dae;Gang, Sam-Geun
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.24 no.6 s.177
    • /
    • pp.1547-1556
    • /
    • 2000
  • In this paper, an evaluation method of fracture toughness to apply interfacial fracture mechanics was investigated in adhesively bonded double-cantilever beam (DCB) joints. Four types of adhesively bonded DCB joints with an interface crack were prepared for analyses of the stress intensity factors using boundary element method(BEM) and the fracture toughness test. From the results of BEM analysis and fracture toughness experiments, it is found that the stress intensity factor, K1 is a parameter driving the fracture of adhesively bonded joints. Also, the evaluation method of fracture toughness by separated stress intensity factors of mixed mode cracks was proposed and the influences of mode components for its fracture toughness are investigated in adhesively bonded DCB joints.

An Impact Analysis of Adhesively-Bonded Single Lap Joint (단면 겹치기 접착 조인트의 충돌해석)

  • Lee, Ju-Won;Na, Won-Bae
    • Journal of Ocean Engineering and Technology
    • /
    • v.24 no.1
    • /
    • pp.172-177
    • /
    • 2010
  • This study presents an explicit dynamic analysis of an adhesively bonded single-lap joint under an impact load. The finite element software, ANSYS LS-DYNA, was used for the analysis and Von Mises stresses were obtained from the analysis. To model the adherents, solid elements were used and a rigid body was assumed for impactor modeling. Three impact heights (1 m, 5 m, and 10 m) were applied to consider different impact conditions and infinite boundary conditions were applied to the end-area of each adherent to save computational time in the analysis. In addition to investigating the stresses in the normal state, we also investigated the stresses in a damaged state (elasticity deterioration), simulated by a change in Young's modulus for 36 of the 3600 elements in the upper layer of the adhesive. The results showed that the location of damage is critical to the stress state of each layer (upper, middle, and lower).

Stress Analysis Crack of Double-lap Joint with an End Mismatch (End mismatch를 갖는 접착이음의 강도 평가)

  • Hyun, Cheol-Seung;Heo, Sung-Pil;Yang, Won-Ho;Ryu, Myung-Hae
    • Proceedings of the KSME Conference
    • /
    • 2001.06a
    • /
    • pp.465-470
    • /
    • 2001
  • The adhesively-bonded joints considered in this investigation include single-lap joint and double-lap joint. For an adhesively bonded double-lap joint, end mismatch between the two cuter adherends(upper, lower) can not removed completely although it can be controlled within a manufacturing tolerance. This paper shows that the end mismatch introduces local bending and end mismatch affects the shear and peel stresses in the adhesive. The double-lap joint with an end mismatch is affected of adhesive thickness, material properties of adhesive and adherend etc. Also, we concluded that there are critical value of an end mismatch to provoke the interface fracture.

  • PDF

DETECTION OF INTERFACIAL CRACK LENGTH BY USING ULTRASONIC ATTENUATION COEFFICIENTS ON ADHESIVELY BONDED JOINTS

  • Chung, N.Y.;Park, S.I.
    • International Journal of Automotive Technology
    • /
    • v.5 no.4
    • /
    • pp.303-309
    • /
    • 2004
  • In this paper, an interfacial crack length has been detected by using the ultrasonic attenuation coefficient on the adhesively bonded double-cantilever beam (DCB) joints. The correlations between energy release rates which were investigated by experimental measurement, the boundary element method (BEM) and Ripling's equation are compared with each other. The experimental results show that the interfacial crack length for the ultrasonic attenuation coefficient and energy release rate increases proportionally. From the experimental results, we propose a method to detect the interfacial crack length by using the ultrasonic attenuation coefficient and discuss it.

The Effects of Surface Roughness and Bond Thickness on the Fatigue Life of Adhesively Bonded Tubular Single Lap Joints (비틀림 접착 조인트의 피로 수명에 대한 표면 조도와 접착 두께의 영향)

  • Gwon, Jae-Uk;Lee, Dae-Gil
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.24 no.8 s.179
    • /
    • pp.2022-2031
    • /
    • 2000
  • Since the surface roughness of adherends affects much the strength of adhesivelybonded joints, the effect of surface roughness on the fatigue life of adhesively bonded tubular single lap joints was investigated analytically and experimentally by fatigue torsion test. The stiffness of the interfacial layer between adherends and adhesive was modeled as a normal statistical distribution function of surface roughness of adherends. From the investigation, it was found that the optimum surface roughness of adherends for the fatigue strength of tubular single lap joints was dependent on bondthickness and applied load.

A Study on the Effect of Adhesion Condition on the Mode I Crack Growth Characteristics of Adhesively Bonded Composites Joints (복합재 접착 체결 구조의 접착 상태가 모드 I 균열 성장 특성에 미치는 영향에 대한 연구)

  • No, Hae-Ri;Jeon, Min-Hyeok;Cho, Huyn-Jun;Kim, In-Gul;Woo, Kyeong-Sik;Kim, Hwa-Su;Choi, Dong-Su
    • Composites Research
    • /
    • v.34 no.5
    • /
    • pp.323-329
    • /
    • 2021
  • In this paper, the characteristics of fracture in mode I loading were analyzed for adhesively bonded joints with non-uniform adhesion. The Double Cantilever Beam test was performed and mode I fracture toughness was obtained. In the case of non-uniform adhesively bonded joints, the stable crack growth sections and unstable crack growth section were shown. The fracture characteristics of each section were observed through the load-displacement curve of the DCB test and the fracture surface of the specimen. Finite Element Analysis was performed at the section based on segmented section by crack length measured through the test and using the mode I fracture toughness of each section. Through DCB test results and finite element analysis results, it was confirmed that the fracture behavior of specimens with non-uniform adhesion can be simulated.

On-line Cure Monitoring of Adhesive Joints by Dielectrometry (유전기법을 이용한 접착 조인트의 실시간 경화 모니터링)

  • 권재욱;진우석;이대길
    • Composites Research
    • /
    • v.16 no.4
    • /
    • pp.51-58
    • /
    • 2003
  • Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesive, the on-line cure monitoring during the cure of adhesively joints could improve the quality of adhesively bonded joints. In this work, the dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is a strong function of the degree of cure and temperature of adhesive. From the investigation, it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.

Fatigue Strength Evaluation of Tensile-Peel Loaded Adhesively Bonded and Mechanical Pressed Joints (접착 및 기계적 프레스 접합부에서의 인장-박리 피로강도 평가)

  • Kang, Jung;Kim, Ho-Kyung
    • Journal of the Korean Society of Safety
    • /
    • v.24 no.3
    • /
    • pp.7-12
    • /
    • 2009
  • The tensile and fatigue experiments were conducted with tensile-peel specimens for investigating on strength of adhesively bonded and mechanical press joints of aluminum sheet used in the field of the automobile industry. The combining epoxy adhesive bonding and mechanical press joining exhibits an increase in joining force as a result of interaction between static forces of the two joining methods. The fatigue strength of pure adhesive joint was measured as 91% of that of the combination of adhesive bond and mechanical press joint, suggesting that the interaction between the bonding and mechanical joining was about 9%.

Relaxation of Singular Stress in Adhesively Bonded Joint at High Temperature

  • Lee, Sang Soon
    • Journal of the Semiconductor & Display Technology
    • /
    • v.17 no.1
    • /
    • pp.35-39
    • /
    • 2018
  • This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.