• Title/Summary/Keyword: Adhesive method

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Mechanical Properties of Metal/Ceramic FGM made by Thermal Spraying Method (용사법에 의해 제작된 금속/세라믹 경사기능 재료의 기계적 특성)

  • Kim, Y.S.;Nam, K.W.;Kim, H.S.;Oh, M.S.;Kim, K.S.
    • Journal of Power System Engineering
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    • v.2 no.3
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    • pp.41-48
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    • 1998
  • This study was aimed at development of fabrication process of functionally graded materials(FGM), consisting of metal and ceramic by thermal spraying method. NiCrAIY/$Al_2O_3$ FGM were made by using plasma spraying onto the SS400 carbon steel substrate. And mechanical properties such as microhardness, thermal shock resistance and adhesive strength of the coating layer were investigated. Adhesive strength was evaluated by acoustic emission method. It was resulted that NiCrAIY/$Al_2O_3$ FGM made by thermal spraying method showed excellent thermal shock resistance and adhesive strength compared to the other lamellar structures of sprayed coatings and that AE is useful tool to evaluate the defect of thermal sprayed coating layer.

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A Novel Patterning Method for Silver Nanowire-based Transparent Electrode using UV-Curable Adhesive Tape (광경화 점착 테이프를 이용한 은 나노와이어 기반 투명전극 패터닝 공법)

  • Ju, Yun Hee;Shin, Yoo Bin;Kim, Jong-Woong
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.73-76
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    • 2020
  • Silver nanowires (AgNWs) intrinsically possess high conductivity, ductility, and network structure percolated in a low density, which have led to many advanced applications of transparent and flexible electronics. Most of these applications require patterning of AgNWs, for which photolithographic and printing-based techniques have been widely used. However, several drawbacks such as high cost and complexity of the process disturb its practical application with patterning AgNWs. Herein, we propose a novel method for the patterning of AgNWs by employing UV-curable adhesive tape with a structure of liner/adhesive layer/polyolefin (PO) film and UV irradiation to simplify the process. First, the UV-curable adhesive tape was attached to AgNWs/polyurethane (PU), and then selectively exposed to UV irradiation by using a photomask. Subsequently, the UV-curable adhesive tape was peeled off and consequently AgNWs were patterned on PU substrate. This facile method is expected to be applicable to the fabrication of a variety of low-cost, shape-deformable transparent and wearable devices.

New optimization method of patch shape to improve the effectiveness of cracked plates repair

  • Bouchiba, Mohamed S.;Serier, Boualem
    • Structural Engineering and Mechanics
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    • v.58 no.2
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    • pp.301-326
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    • 2016
  • An optimization method of patch shape was developed in this study, in order to improve repair of cracked plates. It aimed to minimize three objectives: stress intensity factor, patch volume and shear stresses in the adhesive film. The choice of these objectives ensures improving crack repair, gaining mass and enhancing the adhesion durability between the fractured plate and the composite patch. This was a multi-objective optimization combined with Finite elements calculations to find out the best distribution of patch height with respect to its width. The implementation of the method identified families of optimal shapes with specific geometric features around the crack tip and at the horizontal end of the patch. Considerable mass gain was achieved while improving the repair efficiency and keeping the adhesive shear stress at low levels.

Fracture Mechanics Analysis of Cracked Plate Repaired by Patch(II) - The Analysis of Debonding Effect - (보강재로 보수된 균열평판의 파괴역학적 해석(II)-분리 영향에 대한 연구-)

  • Jeong, Gi-Hyeon;Yang, Won-Ho;Jo, Myeong-Rae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.9 s.180
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    • pp.2246-2251
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    • 2000
  • Adhesive bonding repair methods has been used for a number of decades for construction of damaged structures. In order to evaluate the life of cracked aging aircraft structures, the repair technique which uses adhesively bonded boron/epoxy composite patches is being widely considered as a cost-effective and reliable method. But, this repair method contains many shortcomings. One of these shortcomings, debonding is major issue. When the adhesive shear stress increases, debonding is caused at the end of patch and plate interface. And this debonding is another defect except cracks propagation. In this paper, we assess safety at the cracked AI-plate repaired by Br/Epoxy composite patch. Firstly, from the view of fracture mechanics, reduction of stress intensity factors is determined by the variety of patch feature. Secondly, using the elastic analysis and finite element analysis, the distribution of adhesive shear stresses is acquired. Finally, The problem of how to optimize the geometric configurations of the patch has been discussed.

Effect of Finger Dimensions of Tip and Root Widths on Bending Strength Properties (핑거공차가 휨강도성능에 미치는 영향)

  • 변희섭;류현수;안상열;이균필;박한민;김종만
    • Journal of the Korea Furniture Society
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    • v.12 no.2
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    • pp.1-10
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    • 2001
  • As finger joint method has a high rate of yield and high strength and ease in working, it has been widely used as an end joint method for solid wood and wood based-material. Therefore, we end-joined the material of Pinus densiflora, Quercus variabilis and populus euramericana with polyvinyl acetate adhesive and resorcinol phenol resin adhesive. The effect of difference (0, 0.15, 0.3, 0.45mm) between the dimensions of tip width and root width of the finger (DTRW) on bending strength properties was as follows: 1. In the case of polyvinyl acetate adhesive, DTRW had no effect on bending modulus of elasticity(MOE) and modulus of rupture(MOR) of the three kinds of species, because their bonding layers were destroyed by slippage, not their woody parts. 2. In the case of resorcinol phenol resin adhesive, the material of Quercus variabilis showed an optimal result at 0.15 or 0.3 of DTRW, while the poplar did at 0 of DTRW 3. The differences in efficiency ratio of bending MOR of populus euramericana, Pinus densiflora and Quercus variabilis species according to the kind of adhesive were 13-29%, 23-30% and 45-53%, respectively.

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Thickness Measurement of Adhesive Layer of Multilayer Using Power Cepstrum Technique (전력 켑스트럼 기법을 이용한 다층구조물 접착면의 두께측정)

  • Shin, Jin-Seob;Jun, Kye-Suk
    • The Journal of the Acoustical Society of Korea
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    • v.16 no.2
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    • pp.26-30
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    • 1997
  • In this paper, the thickness measurement method of adhesive layers of multilayers using power cepstrum signal processing technique has been proposed. The peak values for reflected signal from each layer have been separated by power cepstrum technique. Therefore, thickness of adhesive layers have been measured by the intervals of peak signal. In the experiment, the adhesive layers of 0.5mm-0.75mm thickness using epoxy(2-Ton and Plastic Steel Putty(A)) between the aluminum and the brass were formed. The adhesive layer thickness which is calculated with data of reflected signal by ultrasonic pulse-echo method was within error 1.34% of the measured values.

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Effect of adhesive application method on repair bond strength of composite

  • Hee Kyeong Oh;Dong Hoon Shin
    • Restorative Dentistry and Endodontics
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    • v.46 no.3
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    • pp.32.1-32.10
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    • 2021
  • Objectives: This study aimed to evaluate the effect of the application method of universal adhesives on the shear bond strength (SBS) of repaired composites, applied with different thicknesses. Materials and Methods: The 84 specimens (Filtek Z350 XT) were prepared, stored in distilled water for a week and thermocycled (5,000 cycles, 5℃ to 55℃). They were roughened using 400-grit sandpapers and etched with phosphoric acid. Then, specimens were equally divided into 2 groups; Single Bond Universal (SU) and Prime&Bond Universal (PB). Each group was subdivided into 3 subgroups according to application methods (n = 14); UC: 1 coat + uncuring, 1C: 1 coat + curing, 3C: 3 coats + curing. After storage of the repaired composite for 24 hours, specimens were subjected to the SBS test and the data were statistically analyzed by 2-way analysis of variance and independent t-tests. Specimens were examined with a stereomicroscope to analyze fracture mode and a scanning electron microscope to observe the interface. Results: Adhesive material was a significant factor (p = 0.001). Bond strengths with SU were higher than PB. The highest strength was obtained from the 1C group with SU. Bonding in multiple layers increased adhesive thicknesses, but there was no significant difference in SBS values (p = 0.255). Failure mode was predominantly cohesive in old composites. Conclusions: The application of an adequate bonding system plays an important role in repairing composite resin. SU showed higher SBS than PB and the additional layers increased the adhesive thickness without affecting SBS.

Effects of Adhesive Substrates and Bottom Materials on Release of Fertilized Eggs by Pacific Cod, Gadus macrocephalus (대구 (Gadus macrocephalus) 수정란 방류 시 부착기질과 저질의 영향)

  • Lee, So-Gwang;Park, Kyung-Dae;Gwak, Woo-Seok
    • Korean Journal of Fisheries and Aquatic Sciences
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    • v.42 no.1
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    • pp.63-67
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    • 2009
  • The effects of adhesive substrates and bottom materials on the release of fertilized eggs by the Pacific cod, (Gadus macrocephalus) were examined to find an effective release method. Palm twin as an adhesive substrate displayed a significantly elevated adhesive rate compared to gulf weed. However, the survival rate of the fertilized eggs attached to palm twin was as low as 17.5% 8 days after fertilization (DAF). In contrast, fertilized eggs in the absence of adhesive substrate displayed the highest survival rate (47.0%). Concerning bottom materials, the survival rate of fertilized eggs on sand was significantly high (approximately 51.1%) on 8 and 9 DAF. The observations indicates that adhesive substrates are not needed and spawning ground bottom materials such as sand or mud should be considered when releasing fertilized eggs of Pacific cod.

On-line Cure Monitoring of Adhesive Joints by Dielectrometry (유전기법을 이용한 접착 조인트의 실시간 경화 모니터링)

  • 권재욱;진우석;이대길
    • Composites Research
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    • v.16 no.4
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    • pp.51-58
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    • 2003
  • Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesive, the on-line cure monitoring during the cure of adhesively joints could improve the quality of adhesively bonded joints. In this work, the dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is a strong function of the degree of cure and temperature of adhesive. From the investigation, it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.