• Title/Summary/Keyword: Adhesive Properties

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유한요소법에 의한 Adhesive Bonded 복합재료 Lap Joint 의 해석

  • 김원태;김기수;이대길
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.10a
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    • pp.111-115
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    • 2001
  • The stress and torque transmission capability of the tubular, hexagonal and elliptic single lap joints were analyzed by the finite element method (ANSYS 4.4A) and compared to those with the experimental results. The adherends of the joints were composed of the carbon fiber epoxy composite shafts and the steel shafts. In calculating the torque capability, the linear laminate (smeared) properties of the composite and the nonlinear shear properties of the adhesive were used. The experiments revealed that the torque capability calculation performed by this method gave accurate results.

Effect of PPG, MDI, 2-HEMA and butyl acrylate content on the properties of polyurethane adhesive (폴리우레탄 접착제의 물성에 미치는 PPG, MDI, 2-HEMA 및 butyl acrylate량의 영향)

  • Park, Chan Young
    • Elastomers and Composites
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    • v.49 no.3
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    • pp.245-252
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    • 2014
  • FT-IR measurement and the physical properties of polyurethane adhesive prepared from the polyol, isocyanate, 2-HEMA and other acrylate monomers were examined. The softening point, viscosity, adhesion strength and mechanical properties of the PU adhesives were reviewed by Ring and Ball method, Brookfield viscometer and universal test machine, respectively. Results revealed that increment of both PPG amount and butyl acrylate content decreased softening point, adhesion strength, tensile strength and 100% modulus. However as 2-HEMA and MDI content increased the mechanical properties including tensile strength, 100% modulus increased, and also the viscosity and NCO content increased.

Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Flip Chip on Flex Interconnections

  • Caers, J.F.J.M.;De Vries, J.W.C.;Zhao, X.J.;Wong, E.H.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.3 no.3
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    • pp.122-131
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    • 2003
  • In this study, some characteristics of conductive and non-conductive adhesive inter-connections are derived, based on data from literature and own projects. Assembly of flip chip on flex is taken as a carrier. Potential failure mechanisms of adhesive interconnections reported in literature are reviewed. Some methods that can be used to evaluate the quality of adhesive interconnections and to evaluate their aging behavior are given. Possible finite element simulation approaches are introduced and the required critical materials properties are summarized. Response to temperature and moisture, resistance to reflow soldering and resistance to rapid change in temperature and humidity are elaborated. The effect of post cure during accelerated testing is discussed. This study shows that only a combined approach using finite element simulations, and use of appropriate experimental evaluation methods can result in revealing, understanding and quantifying the complex degradation mechanisms of adhesive interconnections during aging.

Strength properties of magnesium oxide matrix according to type of phosphate (인산염 종류에 따른 산화마그네슘 경화체의 강도 특성)

  • Lim, Jeong-Jun;Pyeon, Su-Jeong;Kim, Dae-Yeon;Lee, Sang-Soo
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2018.11a
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    • pp.79-80
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    • 2018
  • Recently, the interest in remodeling of new and old buildings is increasing worldwide. As a result, the frequency of use of architectural adhesives has increased. Currently, adhesives used in buildings are made of organic materials in most cases, and epoxy resin adhesives are most widely used. However, epoxy resin adhesives contain formaldehyde and VOCs in the room during construction, which can cause sick house syndrome. In case of building fire, it may cause damage due to carbon monoxide generated from organic materials. It is urgent to study the problem of epoxy fill adhesive made of such organic materials. Therefore, the purpose of this study is to investigate the effect of the adhesion of epoxy resin adhesive, which is a problem of epoxy resin adhesive, which is an existing organic adhesive by using inorganic materials such as magnesia and phosphate, And the inorganic adhesive which does not emit the release amount as an inorganic material.

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Preparation and Construction Method of Polymer tile Adhesive for Reducing tile Defects (타일하자 저감을 위한 폴리머계 타일접착제 제조 및 시공방법)

  • Cho, Yong-Kwang;Jeon, Jin-Ho;Park, Chang-hwan;Jo, Sung-Hyun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2021.05a
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    • pp.183-184
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    • 2021
  • Defects such as falling and cracking of tiles installed in the bathrooms of apartment houses are frequently occurring. Therefore, in order to solve this problem, the A/S cost of construction companies and consumer complaints are increasing. The causes of tile defects include problems such as the selection of tile adhesive and lack of adhesive strength, the carelessness of the installer, the base surface, and the absorption rate of the tile. Therefore, in this study, an adhesive construction method using tile adhesives with high resistance to deformation of floors and tiles was studied. In addition, the properties and construction methods of tile adhesives were evaluated.

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Adhesion Properties of Epoxy Resin Adhesive Reinforced Tile (에폭시 수지 접착제를 보강한 타일의 부착성능 평가)

  • Lee, Sang-Kyu;Kim, Gyu-Yong;Hwang, Eui-Chul;Son, Min-Jae;Lee, Sang-yun;Nam, Jeong-Soo
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2020.06a
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    • pp.128-129
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    • 2020
  • In this study, flexural strength and tile adhesion strength were evaluated by using a mortar, dry mortar and an epoxy resin reinforced mortar to examine the adhesion performance by reinforcing the epoxy resin adhesive. As a result, it was clearly confirmed that the effect of improving the adhesion strength by reinforcing the epoxy resin adhesive regardless of the type of tile, and in particular, when applying the epoxy resin adhesive to the porcelain and polishing tiles, it is judged that sufficient adhesion performance can be secured.

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Influence of 10-MDP concentration on the adhesion and physical properties of self-adhesive resin cements

  • Shibuya, Kazuhiko;Ohara, Naoko;Ono, Serina;Matsuzaki, Kumiko;Yoshiyama, Masahiro
    • Restorative Dentistry and Endodontics
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    • v.44 no.4
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    • pp.45.1-45.10
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    • 2019
  • Objectives: Self-adhesive resin cements contain functional monomers that enable them to adhere to the tooth structure without a separate adhesive or etchant. One of the most stable functional monomers used for chemical bonding to calcium in hydroxyapatite is 10-methacryloyloxydecyl dihydrogen phosphate (10-MDP). The aim of this study was to evaluate the influence of the10-MDP concentration on the bond strength and physical properties of self-adhesive resin cements. Materials and Methods: We used experimental resin cements containing 3 different concentrations of 10-MDP: 3.3 wt% (RC1), 6.6 wt% (RC2), or 9.9 wt% (RC3). The micro-tensile bond strength of each resin cement to dentin and a hybrid resin block (Estenia C&B, Kuraray Noritake Dental) was measured, and the fractured surface morphology was analyzed. Further, the flexural strength of the resin cements was measured using the three-point bending test. The water sorption and solubility of the cements following 30 days of immersion in water were measured. Results: The bond strength of RC2 was significantly higher than that of RC1. There was no significant difference between the bond strength of RC2 and that of RC3. The water sorption of RC3 was higher than that of any other cement. There were no significant differences in the three-point bending strength or water solubility among all three types of cements. Conclusions: Within the limitations of this study, it is suggested that 6.6 wt% 10-MDP showed superior properties than 3.3 wt% or 9.9 wt% 10-MDP in self-adhesive resin cement.

A Study on the Measurement of the Elastic Moduli and Characteristics for Space Adhesives (우주용 접착제의 탄성계수 측정 및 특성 규명에 관한 연구)

  • Kim, Hyun-Jung;Seo, Yu-Deok;Park, Sang-Hoon;Kim, Ji-Yeon;Uhm, Tae-Kyoung;Lee, Sang-Ryool;Lee, Seung-Hoon;Lee, Deog-Gyu;Lee, Eung-Shik;Jang, Hong-Sul;Jung, Dae-Jun;Youn, Sung-Kie
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.35 no.2
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    • pp.101-106
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    • 2007
  • The optical performance of the mirror for satellite camera is highly dependent on the adhesive properties between the mirror and its support. Therefore, in order to design a mirror with high optical performance, the mechanical properties of adhesives should be well defined. In this paper, the mechanical properties of three kinds of space adhesives are studied. Elastic moduli of the adhesives are determined by tensile tests. Stress-strain relation is obtained by using exponential curve fitting for the adhesive which shows non-linear behavior. In case of the linear behavior material, elastic modulus is calculated through linear curve fitting. For the tensile tests, several points have been selected in the operating temperature range of the adhesive. The elastic modulus of each adhesive is expressed as a function of temperature. Characteristics of the adhesives are discussed regarding their temperature sensitivity.

Manufacture and Properties of Water Soluble Acrylic Type PSA's - Effect of Functional Monomer Change and Atmospheric Plasma Treatment - (수용성 아크릴계 점착제의 제조와 물성 연구 - 기능성 단량체 변화와 대기압 플라즈마 처리영향 -)

  • Sim, Dong-Hyun;Seul, Soo-Duk
    • Polymer(Korea)
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    • v.33 no.1
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    • pp.45-51
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    • 2009
  • Water soluble adhesive was polymerized from butyl acrylate (BA), methyl methacrylate (MMA) and one of various functional monomers such as acrylic acid (AA), 2-hydroxylethyl methacrylate (2-HEMA), glycidyl methacrylic acid (GMA) and acrylamide (AAm). The amount of the functional monomers was 1$\sim$5 wt%/monomer. In order to improve the adhesive power, a substrate was treated using atmospheric flat plasma method. The adhesive power was improved by the addition of the functional monomers with an order of AA> 2-HEMA> GMA> AAm. The holding power of the adhesives, which is related with the thermal properties of the adhesives, increased with the amount of the functional monomers. The effectiveness in improving the holding power has an order of AA > AAm > GMA > 2-HEMA. By treating a substrate with atmospheric flat plasma method, the adhesives containing each of AA, 2-HEMA, GMA and AAm showed the increases of the final adhesion strength by 9.1, 9.4, 9.4, and 1.8%, respectively. In conclusion, the mechanical properties such as adhesive power and holding power could be controlled by introducing.

Synthesis of Silane Group Modified Polyurethane Acrylate and Analysis of Its UV-curing Property (실란기가 도입된 폴리우레탄 아크릴레이트 합성 및 자외선 경화 특성 분석)

  • Kim, Jung Soo
    • Journal of Adhesion and Interface
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    • v.22 no.3
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    • pp.98-105
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    • 2021
  • In this study, we prepared a silver nanoparticle transferable adhesive composition with transparency and adhesive properties using UV-curable urethane acrylate containing silane groups. The urethane-based adhesive composition was applied between the Ag/PET film in which silver nanoparticles were patterned on PET and the PC film to be transferred. Immediately after UV-curing with UV, PET was removed to complete the manufacture of Ag/PC film. UV-curable urethane acrylate containing silane groups was synthesized using polycaprolactone diol (PCL), isophrone diisocyanate (IPDI), 2-hydroxyethyl methacrylate (HEMA), and (3-aminopropyl) triethoxysilane (APTES). The silane group of APTES can improve interfacial adhesion by reacting with the specially treated silver nanoparticle surface of the Ag/PET film. In addition, we improved the adhesion between silver nanoparticle and PC film by mixing UV-curable urethane acrylate containing a silane group and a functional acrylic diluent used as a diluent. We analyzed the synthesis process of urethane acrylate using FT-IR, and compared the adhesive properties, optical properties, and transfer properties according to the molar ratio of APTES and the acrylic diluent composition. As a result, the best transfer properties were confirmed in the adhesive composition prepared under the conditions of PUA2S1_0.5.