• 제목/요약/키워드: Adhesion Force

검색결과 476건 처리시간 0.022초

습식 표면개질 처리된 폴리이미드 필름 표면의 특성에 관한 연구 (A Study on Characteristics of Surface Modified Polyimide Film by Wet Process)

  • 구석본;이홍기
    • 한국표면공학회지
    • /
    • 제39권4호
    • /
    • pp.166-172
    • /
    • 2006
  • Metallized Polyimide films are extensively used as base materials in microelectronics, optical and automotive applications. However it is difficult to deposit metals on those because of their structural stabilities. In this work, polyimide films are modified by a wet process with alkalinemetalhydroxide and additives to introduce functional groups. The surface molecular structures of polyimide are investigated using X-ray photoelectron spectroscopy(XPS), fourier transform infrared reflection spectroscopy(FTIR-ATR), atomic force micro-scopic(AFM). XPS spectra and FTIR spectra show that the surface structure of polyimide is converted into potassium polyamate. AFM image and AFM cross-sectional analyses reveal the increased roughness on the modified surface of polyimide films. As a result, it is shown that the adhesion strength between polyimide surface and electroless nickel layer is increased by the nano-anchoring effect.

Post-CMP Cleaning에서 PVA 브러시 오염이 세정 효율에 미치는 영향 (Effect of PVA Brush Contamination on Post-CMP Cleaning Performance)

  • 조한철;유민종;김석주;정해도
    • 한국전기전자재료학회논문지
    • /
    • 제22권2호
    • /
    • pp.114-118
    • /
    • 2009
  • PVA (polyvinyl alcohol) brush cleaning method is a typical cleaning method for semiconductor cleaning process especially post-CMP cleaning. PVA brush contacts with the wafer surface and abrasive particle, generating the contact rotational torque of the brush, which is the removal mechanism. The brush rotational torque can overcome theoretically the adhesion force generated between the abrasive particle and wafer by zeta potential. However, after CMP (chemical mechanical polishing) process, many particles remained on the wafer because the brush was contaminated in previous post-CMP cleaning step. The abrasive particle on the brush redeposits to the wafer. The level of the brush contamination increased according to the cleaning run time. After cleaning the brush, the level of wafer contamination dramatically decreased. Therefore, the brush cleanliness effect on the cleaning performance and it is important for the brush to be maintained clearly.

고효율의 용액공정용 유기 발광 다이오드 제작을 위한 ITO 전처리 연구 (Study on the ITO Pre-treatment for the Highly Efficient Solution Processed Organic Light-emitting Diodes)

  • 최은영;서지현;최학범;제종태;김영관
    • 한국전기전자재료학회논문지
    • /
    • 제23권1호
    • /
    • pp.18-23
    • /
    • 2010
  • We demonstrated that the solution processed organic light-emitting diodes (OLEDs) have the high efficiency with pre-treated indium-tin-oxide (ITO). ITO surface was pre-treated with four methods and compared each other. The pre-treatment of ITO surface improves the chemical and physical characteristics of ITO such as the surface roughness, adhesion property, and the hole injection ability. These properties were analyzed by the contact angle, atomic force microscope (AFM) image, and the current flow character in device. As a results, the device with ITO pre-treated by $O_2$ plasma shows the current efficiency of 5.93 cd/A, which is 1.5 times the device without pre-treatment.

카본나노튜브의 포텐셜 함수에 따른 마찰거동에 대한 분자동역학 시뮬레이션 연구 (Study on frictional behavior of carbon nanotube with respect to potential function by molecular dynamics simulation)

  • 김현준;김대은
    • 정보저장시스템학회논문집
    • /
    • 제9권2호
    • /
    • pp.36-41
    • /
    • 2013
  • Frictional behavior of a single carbon nanotube(CNT) was investigated using molecular dynamics simulation. A single CNT aligned horizontally on silver or graphene substrate was modeled to evaluate its frictional behavior such as frictional force and rolling/sliding motion with respect to potential parameter and lattice structure of the substrate. As a result, it was found that friction and rolling was affected by adhesion between two surfaces and period of the rolling depended on lattice distance of the substrate.

A Study of Electromechanical Nanotube Memory Device using Molecular Dynamics

  • Lee Jun-Ha;Lee Hoong-Joo;Kwon Oh-Keun;Kang Jeong-Won
    • 한국반도체및디스플레이장비학회:학술대회논문집
    • /
    • 한국반도체및디스플레이장비학회 2005년도 추계 학술대회
    • /
    • pp.27-30
    • /
    • 2005
  • A nanoelectromechanical (NEM) switching device based on carbon nanotube (CNT) was investigated using atomistic simulations. The model schematics for a CNT based three-terminal NEM switching device fabrication were presented. for the CNT-based three-terminal NEM switch, the interactions between the CNT-lever and the drain electrode or the substrate were very important. When the electrostatic force applied to the CNT-lever was the critical point, the CNT-lever was rapidly bent because of the attractive foroe between the CNT-lever and the drain. The energy curves for the pull-in and the pull-out processes showed the hysteresis loop that was induced by the adhesion of the CNT on the copper, which was the interatomic interaction between the CNT and the copper.

  • PDF

이차전지 원료 해쇄용 Grinding Disc Assembly 품질 시험에 관한 연구 (A Study on the Quality Test of Grinding Disk Assembly for Crushing Material in Secondary Battery)

  • 한상필;이동혁
    • Design & Manufacturing
    • /
    • 제17권2호
    • /
    • pp.42-46
    • /
    • 2023
  • Currently, fossil resources are depleting rapidly. We are looking for energy to replace fossil fuels. They are trying to use electricity to replace internal combustion locomotives. Secondary battery raw materials and chemical additives are pulverized by the high-speed rotation of the grinding disc of the Classifier Separator Mill. Grinding Disc Assembly requires characteristics to withstand abrasion, corrosion, high-speed rotational force and impact. Domestic and foreign grinding discs were analyzed through abrasion resistance, hardness, bending strength, and tensile adhesion strength tests.

무근콘크리트 균열저감을 위한 배합설계 및 시공프로세스 수립에 대한 연구 (Study about cracking reducing of the concrete by utilizing fiber-reinforced admixture)

  • 김대건;최상환;문경식;조만기;한민철;한천구
    • 한국건축시공학회:학술대회논문집
    • /
    • 한국건축시공학회 2014년도 춘계 학술논문 발표대회
    • /
    • pp.140-141
    • /
    • 2014
  • Nowadays, as to increased the workability of the press concrete and decrease the cracking, the fiber-reinforced admixture has been widely used. As the low adhesion force between the paste and fiber-reinforced admixture, it was considered as could not be used in the structure. Even more, as the loss of flowability and the exposure of the fiber, further study is needed. In this study, as the different environment and position of the building, the dosages of the fiber-reinforced admixture has also been changed. The fundamental properties and cracking of fiber-reinforced concrete have been tested.

  • PDF

섬유보강재 혼입비율 및 길이에 따른 콘크리트 균열제어에 관한 연구 (Study about cracking reducing of the concrete by utilizing fiber-reinforced admixture)

  • 김대건;최상환;문경식;조만기;한민철;한천구
    • 한국건축시공학회:학술대회논문집
    • /
    • 한국건축시공학회 2014년도 춘계 학술논문 발표대회
    • /
    • pp.144-145
    • /
    • 2014
  • Nowadays, as to increased the workability of the press concrete and decrease the cracking, the fiber-reinforced admixture has been widely used. As the low adhesion force between the paste and fiber-reinforced admixture, it was considered as could not be used in the structure. Even more, as the loss of flowability and the exposure of the fiber, further study is needed. In this study, as the different environment and position of the building, the dosages of the fiber-reinforced admixture has also been changed. The fundamental properties and cracking of fiber-reinforced concrete have been tested.

  • PDF

고강도 콘크리트의 부착거동에 관한 실험적 연구 (The Experimental Study on the Bond behavior of High strength concrete)

  • 이준구;김우;박광수;김대중;이응찬;김한중
    • 한국콘크리트학회:학술대회논문집
    • /
    • 한국콘크리트학회 1999년도 봄 학술발표회 논문집(I)
    • /
    • pp.774-780
    • /
    • 1999
  • The study of bond behavior between concrete and rebar has been performed for a long time. On this study, we tried to analysed variation of bond behaviors quantitatively with varying the strength of concrete. Bond stress which observed below the neutral surface of beam and at connecting part of beam and column is affected by various bond parameters. Resistance of deformed bars which embedded in concrete to the pullout force is divided 1) chemical adhesive force 2) frictional force 3) mechanical resistance of ribs to the concrete and these horizontal components of resistance is being bond strength. We selected the most common and typical variable which is concrete strength among various variables. So we used two kinds of concrete strength like as 25MPa(NSC) and 65MPa(HSC). Tension Test was performed to verify how bond behavior varied with two kinds of concrete strength. Concentration of bond stress was observed at load-end commonly in Tension Test of the initial load stage. At this stage stress distribution was almost coincident at each strength. As tension load added, this stress distribution had difference gradually and movement of pick point of bond stress to free-end and central section was observed. This tendency was observed at first and moving speed was more fast in NSC. At the preceeding result the reason of this phenomenon is considered to discretion of chemical adhesion and local failure of concrete around rebar in load-end direction. Especially, when concrete strength was increased 2.6 times in tension test, ultimate bond strength was increased 1.45 times. In most recent used building codes, bond strength is proportioned to sqare root of concrete compressive strength but comparison of normalized ultimate bond strength was considered that the higher concrete strength is, the lower safety factor of bond strength is in each strength if we use existing building codes. In Tension Test, in case of initial tensile force state, steel tensile stress of central cross section is not different greatly at each strength but tensile force increasing, that of central cross section in NSC was increased remarkably. Namely, tensile force which was shared in concrete in HSC was far greater than that of concrete in NSC at central section.

  • PDF

실리카 코팅 AuNPs의 Langmuir-Blodgett 박막 제조 (Preparation of Langmuir-Blodgett Film of Silica Coated Gold Nanoparticles)

  • 박민성;최재유;정재연;정걸;현진호
    • 접착 및 계면
    • /
    • 제11권4호
    • /
    • pp.144-148
    • /
    • 2010
  • 본 연구에서는 플라즈몬 공명 신호 증폭을 위한 AuNPs의 실리카 표면 개질 및 나노 입자의 안정적인 표면 박막 형성을 목표로 하였다. 직경 10 nm의 AuNPs를 수용액 상에서 제조하였으며, AuNPs 표면에 실리카 층을 단계별로 형성시켰다. Tetraethlyorthosilicate 농도를 조절함으로써 실리카 박막 두께를 조절하였으며, 얻어진 나노 입자들을 수용액 표면에 분산시켜 Langmuir-Blodgett 박막을 제조하였다. 흡광스펙트럼의 변화를 관찰함으로써 AuNPs의 크기 변화를 확인하였으며, 원자 힘 현미경으로 LB 박막의 형성 여부와 표면 균일도를 살펴보았다.