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A Study on Characteristics of Surface Modified Polyimide Film by Wet Process  

Koo, S.B. (Korea Institute of Industrial Technology)
Lee, H.K. (Korea Institute of Industrial Technology)
Publication Information
Journal of the Korean institute of surface engineering / v.39, no.4, 2006 , pp. 166-172 More about this Journal
Abstract
Metallized Polyimide films are extensively used as base materials in microelectronics, optical and automotive applications. However it is difficult to deposit metals on those because of their structural stabilities. In this work, polyimide films are modified by a wet process with alkalinemetalhydroxide and additives to introduce functional groups. The surface molecular structures of polyimide are investigated using X-ray photoelectron spectroscopy(XPS), fourier transform infrared reflection spectroscopy(FTIR-ATR), atomic force micro-scopic(AFM). XPS spectra and FTIR spectra show that the surface structure of polyimide is converted into potassium polyamate. AFM image and AFM cross-sectional analyses reveal the increased roughness on the modified surface of polyimide films. As a result, it is shown that the adhesion strength between polyimide surface and electroless nickel layer is increased by the nano-anchoring effect.
Keywords
Polyimide film; Surface modification; Electroless metal deposit; Functional group; Micro-anchoring;
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