• Composites Research
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• 제12권5호
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• pp.12-22
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• 1999

알루미늄 기지 금속복합재료는 비강도, 비강성, 경도가 뛰어난 것으로 널리 알려져 있으며, 높은 마모 저항으로 인해 점점 중요한 재료로 인식되고 있다. 본 연구에서는 AC2B 알루미늄 합금을 기지재로 하고, 알루미나($Al_2O_3$) 및 탄소를 단섬유를 보강재로한 혼합금속복합재료를 제조하였다. 다양한 상대 마모 속도하에서의 연삭 마모 시험을 통해 금속복합재료의 상온 및 고온 마모 거동을 규명하였다. 금속복합재료의 마모 저항은 고속에서 보강재로 인해 향상되었다. 탄소 혼합 금속복합재료의 마모 저항은 탄소의 고체 윤활 효과로 인해 알루미나($Al_2O_3$) 복합재료보다 우수하였으며, 특히 고속에서의 내마모성이 가장 향상되었다. 금속복합재료의 마찰계수는 상온과 고온에서 상대 속도의 변화에도 큰 차이를 보이지 않았다.

• 한국세라믹학회지
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• 제47권3호
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• pp.232-236
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• 2010

In recent years abrasive water jet (AWJ) has received significant attention as a technology used in the manufacturing industry for cutting materials. In this paper we report the development of a new preparation method of abrasives for water jet by using an air bubbling sedimentation rate control technique. The SiC abrasives prepared by an air bubbling sedimentation rate control technique using latex resin are found to be superior to the conventional abrasives not only in surface roughness uniformity but also in lifetime. The AWJ test results also show that the former has also better impact-resistance and wear-resistance than the latter.

• International Journal of Precision Engineering and Manufacturing
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• 제9권2호
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• pp.11-17
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• 2008

Critical erosion kinetic energy models for radial/median cracks and lateral cracks in a workpiece are established in this study. We used experimental results to demonstrate that the fracture erosion resistance and erosion machining number could be used to evaluate the brittle fracture resistance and machinability of a workpiece. Erosion kinetic energy models were developed to predict brittle fracture and ductile shear, and a critical erosion kinetic energy model was developed to predict the transition from brittle fracture to ductile shear. These models were verified experimentally.

• ETRI Journal
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• 제27권4호
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• pp.433-438
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• 2005

We present a new type of silicon micro-probe card using a three-dimensional probe beam of the cantilever type. It was fabricated using KOH and dry etching, a porous silicon micromachining technique, and an Au electroplating process. The cantilever-type probe beam had a thickness of $5 {\mu}m$, and a width of $50{\mu}$ and a length of $800 {\mu}m$. The probe beam for pad contact was formed by the thermal expansion coefficient difference between the films. The maximum height of the curled probe beam was $170 {\mu}m$, and an annealing process was performed for 20 min at $500^{\circ}C$. The contact resistance of the newly fabricated probe card was less than $2{\Omega}$, and its lifetime was more than 20,000 turns.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.140-143
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• 2004

Chemical mechanical polishing(CMP) is essential technology to secure the depth of focus through the global planarization of wafer. But a variety of defects such as contamination, scratch, dishing, erosion and corrosion are occurred during CMP. Especially, dishing and erosion defects increase the resistance because they decrease the interconnect section area, and ultimately reduce the life time of the semiconductor. Due to this dishing and erosion must be prohibited. The pattern density and size in chip have a significant influence on dishing and erosion occurred over-polishing. Decreasing of abrasive concentration results in advanced pattern selectivity which can lead the uniform removal in chip and decrease of over-polishing. The fixed abrasive pad was applied and tested to reduce dishing and erosion in this paper. Consequently, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with proposed fixed abrasive pad and chemicals.

• Tribology and Lubricants
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• 제27권1호
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• pp.7-12
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• 2011

Interest in advanced machining process such as AJM(abrasive jet machining) and CMP(chemical-mechanical polishing) using micro/nano-sized abrasives has been on the increasing demand due to wide use of super alloys, composites, semiconductor and ceramics, which are difficult to or cannot be processed by traditional machining methods. In this paper, the effects of pressure, wafer moving velocity and fluid viscosity were investigated by 2-dimensional finite element analysis method considering slurry fluid flow. From the investigation, it could be found that the simulation results quite corresponded well to the Preston's equation that describes pressure/velocity dependency on material removal. The result also revealed that the stress and corresponding material removal induced by the collision of particle may decrease under relatively high wafer moving speed due to the slurry flow resistance. In addition, the increase in slurry fluid viscosity causes the reduction of material removal rate. It should be noted that the viscosity effect can vary with the shape of abrasive particle.

• 한국정밀공학회지
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• 제22권2호
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• pp.38-45
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• 2005

Chemical mechanical polishing(CMP) has been widely accepted for the planarization of multi-layer structures in semiconductor fabrication. But a variety of defects such as abrasive contamination, scratch, dishing, erosion and corrosion are occurred during CMP. Especially, dishing and erosion defects increase the metal resistance because they decrease the interconnect section area, and ultimately reduce the lift time of the semiconductor. Due to this reason dishing and erosion must be prohibited. The pattern density and size in chip have a significant influence on dishing and erosion occurred by over-polishing. The fixed abrasive pad(FAP) was applied and tested to reduce dishing and erosion in this paper. The abrasive concentration decrease of FAP results in advanced pattern selectivity which can lead the uniform removal in chip and declining over-polishing. Consequently, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with proposed FAP and chemicals.

• 한국해양공학회지
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• 제17권1호
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• pp.55-60
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• 2003

The effect of size and volume fraction of ceramic particles, with sliding velocity on the wear properties were investigated for the metal matrix composites fabricated by the pressureless infiltration process. The metal matrix composites exhibited about 5.5 - 6 times the wear resistance compared with AC8A alloy at high sliding velocity, and by increasing the particle size and decreasing the volume fraction, the wear resistance was improved. The wear resistance of metal matrix composites and AC8A alloy exhibited different aspects. Wear loss of AC8A alloy increased with sliding velocity, linearly : whereas, metal matrix composites indicated more wear loss than AC8A alloy at the slow velocity region. However, a transition point of wear loss was found at the middle velocity region, which shows the minimum wear loss. Further, wear loss at the high velocity region exhibited nearly the same value as the slow velocity region. In terms of wear mechanism, the metal matrix composites generally exhibited abrasive wear at slow to high sliding velocity； however, AC8A alloy showed abrasive wear at low sliding velocity and adhesive and melt wear at high sliding velocity.

• 대한기계학회논문집
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• 제19권7호
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• pp.1619-1629
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• 1995

The Al/Al$_{2}$O$_{3}$ SiC and Al/Al$_{2}$O$_{3}$/C hybrid metal matrix composites (MMCs) were fabricated by squeeze infiltration method. Uniform distribution of reinforcements were found in the microstructure of metal matrix composites. Mechanical tests were carried out under various test conditions to clearly identify mechanical behavior of MMCs, and the wear mechanism of Al/Al$_{2}$O$_{3}$/(SiC or C) hybrid metal matrix composites were investigated. The tensile strength and hardness of hybrid composites was resulted in increasing compared with those of the unreinforced matrix alloy. Wear resistance was strongly dependent upon kinds of fiber, volume fraction and sliding speed. The wear resistance of metal matrix composites was remarkably improved by the addition of reinforcements. Especially, the wear resistance of the hybrid composites of carbon fibers was more effective than in the composites reinforced with alumina and SiC whiskers of reinforcements. This was due to the effect of carbon fiber on the solid lubrication. Wear mechanisms of hybrid composites were suggested from wear surface analyses. The major wear mechanism of hybrid composites was the abrasive wear at low to intermediate sliding speed, and the melting wear at intermediate to high sliding speed.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2002년도 추계학술대회 논문집
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• pp.379-384
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• 2002

The effect of size and volume fraction of ceramic particles with sliding velocity on the wear properties were investigated for the metal matrix composites fabricated by pressureless infiltration process. The particulate metal matrix composites exhibited about 5.5 - 6 times of excellent wear resistance compared with AC8A alloy at high sliding velocity, and as increasing the particle size and decreasing the volume fraction the wear resistance was improved. The wear resistance of metal matrix composites and AC8A alloy exhibited different aspects. Wear loss of AC8A alloy increased with sliding velocity linearly. whereas metal matrix composites indicated more wear loss than AC8A alloy at slow velocity region, however a transition point of wear loss was found at middle velocity region which show the minimum wear loss, and wear loss at high velocity region exhibited nearly same value with slow velocity region. In terms of wear mechanism, the metal matrix composites exhibited the abrasive wear at slow to high sliding velocity generally, however AC8A alloy showed abrasive wear at low sliding velocity and adhesive and melt wear at high sliding velocity.