• Title/Summary/Keyword: Abrasive particles

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The effect of buffing on particle removal in Post-Cu CMP cleaning (Post-Cu CMP cleaning에서 연마입자 제거에 buffing 공정이 미치는 영향)

  • Kim, Young-Min;Cho, Han-Chul;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.537-537
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    • 2008
  • Copper (Cu) has been widely used for interconnection structure in intergrated circuits because of its properties such as a low resistance and high resistance to electromigration compared with aluminuim. Damascene processing for the interconnection structure utilizes 2-steps chemical mechanical polishing(CMP). After polishing, the removal of abrasive particles on the surfaces becomes as important as the polishing process. In the paper, buffing process for the removal of colloidal silica from polished Cu wafer was proposed and demonstrated.

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Effects of Oxidizer Additive on the Performance of Copper-Chemical Mechanical Polishing using Tungsten Slurry (텅스텐 슬러리를 사용한 Cu-CMP 특성에서 산화제 첨가의 영향)

  • 이우선;최권우;이영식;최연옥;오용택;서용진
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.2
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    • pp.156-161
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    • 2004
  • We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

Optimization of cutting tool for high speed machining (고속가공을 위한 절삭공구의 최적화)

  • 양민양
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.12 no.6
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    • pp.1290-1295
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    • 1988
  • Theoretical considerations in the development of new cutting tool materials for high speed machining is presented. The progressive wear of cutting tools is assumed to consist of the abrasive and solution components as major modes. Theoretical calculations of relative wear rates between various tool materials based on the two modes are possible using their hardness and solubility data. Assuming cementite as the major hard particles in machining steels, relative wear rates of possible tool materials were calculated. The results indicate that $Al_{2}$O$_{3}$ in oxides, HfN in nitrides and HfC in carbides are the optimal tool materials from the view point of mechanical and thermochemical wear resistance. And several methods for improving the fracture toughness of the above tool materials are suggested.

A Study of Electrochemical Characteristics on Copper Film (Copper 막의 전기화학적 특성에 관한 연구)

  • Han, Sang-Jun;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1729-1730
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    • 2006
  • We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro-structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_{2}O_{3}$ abrasive particles in CMP slurry.

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Study on Ni CMP Characteristics Behavior by Addition of Oxidizers (산화제 첨가에 따른 니켈 화학적 기계적 연마 특성 거동 연구)

  • Choi, Gwon-Woo;Kim, Nam-Hoon;Seo, Yong-Jin;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.647-648
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    • 2005
  • The development of CMP slurry chemistry for Ni that provides good CMP performance is the key for nickel based MEMS device fabrication. In this study, CMP of nickel was performed using different slurry versus oxidizer ratios arid different oxidizers also alumina particles as an abrasive.

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Characteristics of Stainless Steel Composites with Nano-sized TiCxNy (Nano-sized TiCxNy를 함유한 STS 복합체의 특성)

  • Ban, Tae-Ho;Park, Sung-Bum;Jo, Soo-Jeong;Lee, Dong-Won;Turaev, Farkhod R.;Park, Yong-Il;Kim, Sung-Jin
    • Journal of Powder Materials
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    • v.18 no.3
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    • pp.290-296
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    • 2011
  • Titanium carbonitride is more perspective materials compared to titanium carbide. It can be used in tool industry and special products because of its higher strength, abrasive wear-resistance and especially its strong chemical stability at high temperatures. We produced STS+TiCxNy composite by the spark plasma sintering for higher strength and studied the characteristics. The planar and cross-sectional microstructures of the specimens were observed by scanning electron microscopy. Characterizations of the carbon and nitride phases on the surface of composite were carried out using an X-ray diffractometer. During annealing TiCxNy particles diffusion into STS 430 was observed. After annealing, sintering isolations between particles were formed. It causes decreasing of mechanical strength. In addition when annealing temperature was increased hardness increased. Heterogeneous distribution of alloying elements particles was observed. After annealing composites, highest value of hardness was 738.1 MHV.

Characteristics of Sapphire Wafers Polishing Depending on Ion Conductivity of Silica Sol (실리카졸의 이온전도도 변화에 따른 사파이어 웨이퍼의 연마 특성)

  • Na, Ho Seong;Cho, Gyeong Sook;Lee, Dong-Hyun;Park, Min-Gyeong;Kim, Dae Sung;Lee, Seung-Ho
    • Korean Journal of Materials Research
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    • v.25 no.1
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    • pp.21-26
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    • 2015
  • CMP(Chemical Mechanical Polishing) Processes have been used to improve the planarization of the wafers in the semiconductor manufacturing industry. Polishing performance of CMP Process is determined by the chemical reaction of the liquid sol containing abrasive, pressure of the head portion and rotational speed of the polishing pad. However, frictional heat generated during the CMP process causes agglomeration of the particles and the liquidity degradation, resulting in a non-uniform of surface roughness and surface scratch. To overcome this chronic problem, herein, we introduced NaCl salt as an additive into silica sol for elimination the generation of frictional heat. The added NaCl reduced the zata potential of silica sol and increased the contact surface of silica particles onto the sapphire wafer, resulting in increase of the removal rate up to 17 %. Additionally, it seems that the silica particles adsorbed on the polishing pad decreased the contact area between the sapphire water and polishing pad, which suppressed the generation of frictional heat.

Experimental Study on Damage to Journal Bearing due to Contaminating Particles in Lubricant (윤활유 오염입자에 의한 저널 베어링 손상에 관한 실험적 연구)

  • Song, Chang Seok;Lee, Bora;Yu, YongHun;Cho, Yong Joo
    • Tribology and Lubricants
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    • v.31 no.2
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    • pp.69-77
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    • 2015
  • Recently, there have been reports of severe symptoms of wear in bearings due to foreign substances mixed in lubricants. Therefore, studying the effects of foreign substances (such as combustion products and metallic debris) on the wear characteristics of journal bearings and proposing appropriate management standards for lubricant cleanliness have become necessary. Studies on the effect of particle size and concentration of foreign substances on surface damage have actively progressed in the recent times. These studies indicate the possibility of foreign substances causing direct wear of bearing surfaces. However, experiments conducted until now involve only basic tests such as the Pin-on-Disk test instead of those involving real bearing systems. This study experimentally examines the damage to the surface of a journal bearing due to foreign substances (combustion products and alumina) mixed with the lubricant, as well as the effect of the type and size of particles on its wear characteristics. The study uses an experimental journal bearing similar to a real bearing system for conducting the lubrication test. Hydrodynamic Lubrication (HL) numerical analysis, experiment results, and film parameters are used for calculating the operating conditions required for achieving the desired film thickness, and the results of the analysis are modified for considering the surface roughness. The run-time of the experiment is 10 min including the stabilization process. The experiment results show that alumina particles larger than the minimum film thickness cause significant surface damage.

Characteristic of Friction on Texturing Bearing Steel with Ultrasonic Hole Machine

  • Shin, Mijung;H., Angga Senoaji;Kwon, SoonHong;Chung, SungWon;Kwon, SoonGoo;Park, JongMin;Kim, JongSoon;Choi, WonSik
    • Tribology and Lubricants
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    • v.31 no.1
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    • pp.21-27
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    • 2015
  • We carry out experiments to characterize textured bearing steel with varying hole density and depth. Textured surface is believed to reduce the friction coefficient, and improve performance and wearing caused by third-body contact. We employ three lubrication regime conditions based on the Stribeck curve: boundary lubrication, mixed lubrication, and hydrodynamic lubrication. Ultrasonic machining is an untraditional machining method wherein abrasive grit particles are used. The hammering process on the work piece surface by abrasive provides the desired form. In this study, we create multi-holes on the bearing steel surface for texturing purposes. Holes are formed by an ultrasonic machine with a diameter of 0.534 mm and a depth of about 2-4 mm, and they are distributed on the contact surface with a density between 1.37-2.23%. The hole density over the surface area is an important factor affecting the friction. We test nine types of textured specimens using four times replication and compare them with the untextured specimen using graphs, as well as photographs taken using a scanning electron microscope. We use Analyzes variant in this experiment to find the correlation between each pair of treatments. Finally, we report the effect of hole density and depth on the friction coefficient.

Heat and Wear Resistance Characterization of SiCp Reinforced Al Matrix Composites (SiCp입자강화 Al 복합재료의 내열 및 마모특성)

  • Kim, Sug-Won;Kim, Wan-Ki;Woo, Kee-Do;Ahn, Haeng-Keun
    • Journal of Korea Foundry Society
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    • v.20 no.6
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    • pp.377-385
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    • 2000
  • Al matrix composites as the most promising MMCs can be expected to be excellent engineering materials in the nearest future. So as to improve material properties of composite, many manufacturing processes have been developed. Among them, squeeze casting process which offers fine microstructure and near-net-shape is one of the most successful MMCs manufacturing processes. But, in case of with subsieve size particles (under 44 ${\mu}m$), it is very difficult to homogeneously distribute particles in matrix of Al matrix composite by various casting processes, including squeeze casting used so far. Duplex process which was developed in previous study was used to distribute the particle of subsieve size more homogeneously in matrix of Al matrix composite. Microstructures, wear and heat resistance characterization of Al-Si-Cu-Mg-(Ni)/SiCp manufactured by duplex process were examined to clarify the effect of manufacturing conditions, particle size of reinforcement and alloying elements. Al matrix composites reinforced with SiCp(10 ${\mu}m$) have the lowest wear amount among composites reinforced with 3 ${\mu}m$, 5 ${\mu}m$ and 10 ${\mu}m$ SiCp. The wear amount of Al matrix composites with 10 wt.% SiCp(3, 5, 10 ${\mu}m$) was decreased according to the increase of the sliding speed because abrasive wear takes place at high sliding speed of 4m/s and worn debris with block type occurs at low sliding speed of 1m/s. As for heat resistance, it is made clear that remarkable heat resistance property can be obtained by addition of Ni element in Al matrix composites.

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