• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1278-1282
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• 2004

수열처리법으로 nano-sized $CeO_2$ 입자를 $Al_3O_3$ 입자의 표면에 균일하게 코팅하여 $AL_2O_3/O_2$ composite 연마 입자를 제조하었다. 제조된 $Al_2O_3\CeO_2$ composite 입자의 뭍성을 TEM, XRD, zeta potential analyzer 및 particle size analyzer로 측징하였다. $Al_2O_3/CeO_2$ composite 입자와 구성된 슬러리와 비교 시료로서 $Al_2O_3$와 $CeO_2$ 입자를 혼합한 슬러리를 사용하여 thermal oxide film에 대한 연마특성을 평가하였다. 연마슬러리에 포함된 $A1_2O_3/CeO_2$ composite 입자와 $Al_2O_3$와 $CeO_2$ 혼합입자에서 나노 크기의 세리아 입자가 sub-micron 크기의 알루미나 입자의 표면에 균일하게 코팅되므로서 $Al_2O_3$ 단일 성분의 슬러리에 비해 removal rate(RR)는 106 nm/min, WIWNU는 $8\sim9%$, roughness는 $2.6{\AA}$의 향상된 연마 특성을 나타내었다. 알루미나 입자의 불규칙한 형상 때문에 $Al_2O3/CeO_2$ composite 슬러리와 $Al_2O_3$ 와 $CeO_2$ 혼합슬러리의 연마 특성이 비슷한 수준을 나타내었다.

• Transactions of the Society of Information Storage Systems
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• v.3 no.3
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• pp.129-134
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• 2007

Boron nitride (BN) is a highly attractive material for wear resistant applications of mechanical components. BN is super hard and it is the second hardest of all known materials. It also has a high thermal stability, high abrasive wear resistance, and in contrast to diamond, BN does not react with ferrous materials. The motivation of this work is to investigate the tribological properties of BN for potential applications in ultra-precision components for data storage, printing, and other precision devices. In this work, the wear characteristics of BN thin films deposited on DLC or Ti buffer layer with silicon substrate using RF-magnetron sputtering technique were analyzed. Wear tests were conducted by using a pin-on-disk type tester and the wear tracks were measured with a surface profiler. Experimental results showed that wear characteristics were dependent on the sputtering conditions and buffer layer. Particularly, BN coated on DLC layer showed better wear resistant behavior. The range of the wear rates for the BN films tested in this work was about 20 to $100{\mu}m^3$/cycle.

• Tribology and Lubricants
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• v.30 no.1
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• pp.21-28
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• 2014

Damage to the cylinder liner of large ship engines, such as scuffing on the surface, can occur very easily because it is operated in a corrosive environment. This scuffing may be due to oil film destruction and corrosive wear caused by water and sulfur included in the fuel, abrasive impurities, and poor lubricants. Thus, a method for monitoring the condition and diagnosing the failure of the cylinder liner and piston ring is needed. In this study, a reciprocating friction and wear test was carried out with a cast iron specimen, which simulated an engine cylinder in a corrosive atmosphere. The lubricants used were base oil, stirred oil with distilled water, a NaCl solution, and dilute sulfuric acid. The friction coefficient and frequency spectrum were measured using a load cell and acceleration sense in each experimental condition. We then used these results to diagnose the failure of the cylinder liner.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.3
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• pp.213-217
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing(CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical polishing(ECMP) or electro-chemical mechanical planarization was introduced to solve the technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Transactions on Electrical and Electronic Materials
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• v.6 no.1
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• pp.29-32
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• 2005

Chemical mechanical polishing is an essential process in the production of copper-based chips. On this work, the stability of hydrogen peroxide ($H_{2}O_{2}$) as an oxidizer of copper CMP slurry has been investigated. $H_{2}O_{2}$ is known as the most common oxidizer in copper CMP slurry. But $H_{2}O_{2}$ is so unstable that its stabilization is needed using as an oxidizer. As adding KOH as a pH buffering agent, stability of $H_{2}O_{2}$ decreased. However, $H_{2}O_{2}$ stability in slurry went up with putting in small amount of BTA as a film forming agent. There was no difference of $H_{2}O_{2}$ stability between pH buffering agents KOH and TMAH at similar pH value. Addition of $H_{2}O_{2}$ in slurry in advance of bead milling led to better stability than adding after bead milling. Adding phosphoric acid resulted in the higher stability. Using alumina C as an abrasive was good at stabilizing for $H_{2}O_{2}$.

• Journal of Welding and Joining
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• v.19 no.2
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• pp.191-199
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• 2001

The oxidation and recrystallization behaviors of Ni-base single crystal superalloy, CMSX-2 were investigated to determine the condition of the preparation for transient liquid phase (TLP) bonding operations. The faying surfaces of CMSX-2 were worked by the shot peening, fine cutting and mechanical polishing treatments and the degree of working of treated surfaces was evaluated by the hardness test and X-ray diffraction method CMSX-2 was heat-treated at 1,173∼1.589k for 3.6ks in vacuum of 4mPa. The mechanically polished surface was slightly oxidized after heat treatment even in the vacuum atmosphere of 4mPa. The thickness of an oxide film increased with increasing the heating temperature and the surface roughness of the faying surface. Recrystallization occurred at the surface after heat treatment at above 1,423K when the hardness was increased more than Hv600 by the shot peening treatment while the mechanically polished or fine cut surfaces didn't recrystallized. Based on these results, it was clearfied that the mechanically polishing with fine abrasive grit could be used for the preparation of faying surface of CMSX-2 before bonding operation.

• Restorative Dentistry and Endodontics
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• v.2 no.1
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• pp.15-19
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• 1976

The author studied on the transfer of radioactive fluorine ($^{18}F$) to dental hard tissue through animal experiments which was divided into two groups. First group of rats were sacrified 1, 2, 5, 10 and 20 minutes after intraperitoneal injection. Second group were sacrified 1 and 3 minutes after topical application on anterior teeth. The teeth were removed and sectioned by means of abrasive wheel and polished on india stone as thick as about 50 microns. Autoradiograph picture was made by close contact of high-speed dental X-ray film on prepared specimen for 2 hours. The results of this study were as follows; 1) There was no evidence of transfer of $^{18}F$ on dental hard tissue on the cases of 1, 2 and 5 minutes survival after intraperitoneal injection. 2) Radioactive sodium fluorine incorporated to dental hard tissue was slight and diffuse at 10 minutes cases and significant incorporated picture was noticed at 20 minutes cases in intraperitoneal injection. 3) On topical application groups incorporated $^{18}F$ to enamel was traced clearly only on enamel surface at 1 minute cases and significant transfer into whole enamel was found at 3 minutes cases.

• Korean Journal of Materials Research
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• v.16 no.12
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• pp.766-770
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• 2006

The frictional behavior of oxide films on top of the plasma nitrocarburized compound layers was investigated in terms of post-oxidation treatment temperatures. The post-oxidation treatment at both temperatures($400^{\circ}C,\;500^{\circ}C$) produced magnetite($Fe_3O_4$) films which led to a significant enhancement in corrosion resistance. However, this process did not result in any improvement in frictional behavior of the nitrocarburized surface. The wear mechanisms were governed predominantly by the abrasive action of the slider on the surface irrespective of the counterface material(SiC and Bearing steel). When the specimen was sliding against a SiC counterface, the oxide films were destroyed during the early stage of the sliding process and the wear debris of the oxide film at the sliding track had a great influence on the friction coefficient. On the other hand, when sliding against a bearing steel counterface, the slider was mainly worn out due to the much higher hardness of the surface hardened layer. The fluctuation of the friction coefficient of $400^{\circ}C$-oxidized/ nitrocarburized specimen is much severer than that of $500^{\circ}C$ specimen, due to the less amount of wear debris.

• Journal of the Korean institute of surface engineering
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• v.54 no.5
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• Tribology and Lubricants
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• v.36 no.6
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• pp.378-384
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• 2020

The friction surfaces of mechanical parts are heat-treated or coated with hard materials to minimize wear. Increasing the hardness is a very useful way to reduce abrasive wear. The general Brinell hardness test, which is widely used for metallic materials, is not suitable because it hardly shows any change in hardness when coated with thin films. In this study, we propose a basis for the application of the new Brinell hardness test method to the coated friction surface. An indentation analysis of the rigid sphere and elastic-perfectly plastic materials is performed using a commercial finite element analysis software. The results indicate that their loadto-diameter ratio is the same; the Brinell hardness test method can be applied even when the indenter diameter is on the micrometer scale. In the case of hard coating, it is difficult to calculate Brinell hardness using the diameter of the indentation, but the study revealed, for the first time, that it can be calculated using the depth of the indentation regardless of coating. The change in hardness owing to thin film coating over a wide load range implies that the hardness evaluation method is appropriate. Additional studies on various properties related to the substrate and coating material are required to apply the proposed method.