• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.2
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• pp.100-106
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• 2013

Stainless steel has some excellent properties as the material for the mechanical component. Purpose of this study is carried out to obtain mirror surface on the surperfinishing of stainless steel with high efficiency. To achieve this, we have conducted a series of polishing experiment for stainless steel using abrasive film from the perspective of oscillation speed, the rotational speed of workpiece, contact roller hardness, contact pressure and feed rate. Abrasive film used this study is a micro-finishing film and a lapping film. Furthermore, the polishing characteristics and efficiency of stainless steel is discussed through measuring optimal polishing time and surface roughness. From the obtained results, it was confirmed that efficient superfinishing conditions and polishing characteristic of Stainless steel can be determined.

• Nuclear Engineering and Technology
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• v.55 no.7
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• pp.2356-2365
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• 2023

Characterization, dismantling and pre-disposal management of irradiated graphite (i-graphite) have an important role in safe decommissioning of several nuclear facilities which used this material as moderator and reflector. In addition to common radiation protection issues, easily volatizing long-lived radionuclides and stored Wigner energy could be released during imprudent retrieval and processing of i-graphite. With this regard, among all cutting technologies, abrasive waterjet (AWJ) can successfully achieve all of the thermo-mechanical and radiation protection objectives. In this work, factorial experiments were designed and systematically conducted to characterize the AWJ processing parameters and the machining capability. Moreover, the limitation of dust production and secondary waste generation has been addressed since they are important aspects for radiation protection and radioactive waste management. The promising results obtained on non-irradiated nuclear graphite blocks demonstrate the applicability of AWJ as a valid technology for optimizing the retrieval, storage, and disposal of such radioactive waste. These activities would benefit from the points of view of safety, management, and costs.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.10 s.175
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• pp.39-48
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• 2005

As the industrial development is accelerated, a new machining process and system are keenly required to achieve super precision surface finish. Especially to get ground surface finish fer complicated and narrow inner shape of molds, it is impossible with the existing methods so that a new method is being required to be developed. A new material, called Magic(MAGnetic Intelligent Compounds), is finally made and it is called Magic machining that uses this material. There is a way to make a material as follows, the mixture of magnetic particles, bonding material and particles of abrasive grain should be melt down by proper heat, and then this mixture put in a mold and cool down in magnetic field which has a uniform direction. This new polishing method is spotlighted as an excellent solution to the existing problems. However it hasn't reported any study about the influence of the machining conditions of polishing velocity, amplitude and polishing pressure to the surface roughness yet. This study would examine closely the influence of polishing conditions of the Magic polishing tool to the surface finish to decide the optimum polishing condition and to standardize the Magic polishing work.

• Tribology and Lubricants
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• v.34 no.6
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• pp.209-216
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• 2018

Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.

• Tribology and Lubricants
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• v.35 no.5
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• Tribology and Lubricants
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• v.39 no.2
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• pp.72-75
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• 2023

Silicon carbide (SiC) is used as a substrate material for power semiconductors; however, SiC chemical mechanical polishing (CMP) requires considerable time owing to its chemical stability and high hardness. Therefore, researchers are attempting to increase the material removal rate (MRR) of SiC CMP using various methods. Mixed-abrasive CMP (MAS CMP) is one method of increasing the material removal efficiency of CMP by mixing two or more particles. The aim of this research is to study the mathematical modeling of the MRR of MAS CMP of SiC with SiO₂ and TiO₂ particles. With a total particle concentration of 32 wt, using 80-nm SiO₂ particles and 25-nm TiO₂ particles maximizes the MRR at 8 wt of the TiO₂ particle concentration. In the case of 5 nm TiO₂ particles, the MRR tends to increase with an increase in TiO₂ concentration. In the case of particle size 10-25 nm TiO₂, as the particle concentration increases, the MRR increases to a certain level and then decreases again. TiO₂ particles of 25 nm or more continuously decreased MRR as the particle concentration increased. In the model proposed in this study, the MRR of MAS CMP of SiC increases linearly with changes in pressure and relative speed, which shows the same result as the Preston's equation. These results can contribute to the future design of MAS; however, the model needs to be verified and improved in future experiments.

• Conservation Science in Museum
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• v.6
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• pp.31-37
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• 2005

The copper incense burner inlaid with gold and silver and purchased by the National Museum of Korea in 2002 was to be corroded severely throughout the surface. It was difficult to recognize the part with silver inlaying. Using the abrasive method with alumina, however, its splendid inlaying patterns were restored. Prior to applying the abrasive method, the quality was examined, and a material that could help bring out the patterns without causing too much damage to the artifact, selected. The overall condition of the incense burner was also checked through X-ray equipment to know the condition of the gold and silver inlaying, and by x-ray fluorescence spectroscopy to confirm the composition of the incense burner and gold and silver inlaying. The result of this process is expected to serve as valuable data in future research on incense burners inlaid with gold and silver.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.3
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• pp.65-70
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• 2006

The AWJM(Abrasive Water-jet Machining) technology is one of the cutting technologies, which can cut various materials with 2 or 3 times of the speed of sound. In this study, processing conditions such as jet-pressure, cutting speed, orifice diameter and stand-off distance, are used by following the design of experiments with 3 levels. Al6061 material which is normally applied on the field, is applied. Through the S/N ratio analysis with measured values, the optimization value of processing conditions to minimize the surface roughness and taper value is obtained. The order of significance is as follows; jet pressure, cutting speed, abrasive mixing ratio, orifice diameter and stand-off distance. RSM(Response Surface Method) is applied to find the optimal processing conditions to minimize both the surface roughness and the taper value by using jet pressure, cutting speed and abrasive mixing ratio.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.1
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• pp.138-144
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• 2008

Micro-machining of a brittle material such as glass, silicon, etc., is important in micro fabrication. Particularly, micro-abrasive jet machining (${\mu}-AJM$) has become a useful technique for micro-machining of such materials. The ${\mu}-AJM$ process is mainly based on the erosion of a mask which protects brittle substrate against high velocity of micro-particle. Therefore, fabrication of an adequate mask is very important. Generally, for the fabrication of a mask in the ${\mu}-AJM$ process, a photomask based on the semi-conductor fabrication process was used. In this research a rapid mask fabrication technology has been developed for the ${\mu}-AJM$. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Two kinds of mask patterns were fabricated using SU-8 and photopolymer (Watershed 11110). Using fabricated mask patterns, abrasive-jet machining of Si wafer were conducted successfully.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.4
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• pp.401-407
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• 2011

The conventional method of magnetic abrasive polishing is not suitable for non-magnetic materials because such polishing is basically possible when magnetic force exists and the magnetic force in non-magnetic materials is very low. The installation of an electromagnet under the working area of a non-magnetic material, which is called second-generation magnetic abrasive polishing in this study, can enhance the magnetic force. Experimental evaluation and optimization of process parameters for polishing magnesium alloy steel was performed by adopting the design of experiments and the response surface method. The results indicated that the intensity of the magnetic force and spindle speed are significant parameters that affect the improvement of surface roughness. A prediction model for the surface roughness of the magnesium alloy steel is developed using the second-order response surface method.