• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2007년도 추계학술대회 논문집
• /
• pp.528-528
• /
• 2007

Cu CMP widely has been using for the formation of multilevel metal interconnects by the Cu damascene process. And lower dielectric constant materials are required for the below 45nm technology node. As the dielectric constant of dielectric materials are smaller, the strength of dielectric materials become weaker. Therefore these materials are easily damaged by high down pressure during conventional CMP. Also, technical problems such as surface scratches, delamination, dishing and erosion are also occurred. In order to overcome these problems in CMP, the ECMP (electro-chemical mechanical planarization) has been introduced. In this process, abrasive free electrolyte, soft pad and low down force were used. The electrolyte is one of important factor to solve these problems. Also, additives are required to improve the removal rate, uniformity, surface roughness, defects, and so on. In this study, KOH and $NaNO_3$ based electrolytes were used for Cu ECMP and the electrochemical behavior was evaluated by the potentiostat. Also, the Cu surface was observed by SEM as a function of applied voltage and chemical concentration.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
• /
• pp.82-82
• /
• 2007

The chemical mechanical polishing (CMP) process has been widely used to obtain global planarization of multilevel interconnection process for ultra large scale. integrated circuit applications. Especially, the application of copper CMP has become an integral part of several semiconductor device and materials manufacturers. However, the low-k materials at 65nm and below device structures because of fragile property, requires low down-pressure mechanical polishing for maintaining the structural integrity of under layer during their fabrication. In this paper, we studied electrochemical mechanical polishing (ECMP) as a new planarization technology that uses electrolyte chemistry instead of abrasive slurry for copper CMP process. The current-voltage (I-V) curves were employed we investigated that how this chemical affect the process of voltage induced material removal in ECMP of Copper. This work was supported by grant No. (R01-2006-000-11275-0) from the Basic Research Program of the Korea Science.

• Tribology and Lubricants
• /
• 제16권5호
• /
• pp.365-372
• /
• 2000

Tribological behavior of novolac resin-based friction materials with three different relative amounts of graphite and zirconium silicate was investigated by using a pad-on-disk type friction tester. The goal of this paper is to examine the effects of the relative amount of a lubricant and an abrasive in the automotive friction material on friction and wear characteristics at elevated temperature. Friction and wear of friction materials were affected by the existence of transfer film(3$\^$rd/ body layer) at friction interface and the composition of friction material, especially lubricant amount. The friction material with higher content of graphite indicated homogenized and durable transfer film, and resulted in stable friction coefficient regardless of the increase in friction heat. The experimental result also showed that the higher concentration of ZrSiO$_4$ in friction material aggravated friction stability and wear resistance due to the higher friction heat generated at fiction interface during high temperature friction test.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.545-545
• /
• 2008

Poly-Si is an essential material for floating gate in NAND Flash memory. To fabricate this material within region of floating gate, chemical mechanical polishing (CMP) is commonly used process for manufacturing NAND flash memory. We use colloidal silica abrasive with alkaline agent, polymeric additive and organic surfactant to obtain high Poly-Si to SiO2 film selectivity and reduce surface defect in Poly-Si CMP. We already studied about the effects of alkaline agent and polymeric additive. But the effect of organic surfactant in Poly-Si CMP is not clearly defined. So we will examine the function of organic surfactant in Poly-Si CMP with concentration separation test. We expect that surface roughness will be improved with the addition of organic surfactant as the case of wafering CMP. Poly-Si wafer are deposited by low pressure chemical vapor deposition (LPCVD) and oxide film are prepared by the method of plasma-enhanced tetra ethyl ortho silicate (PETEOS). The polishing test will be performed by a Strasbaugh 6EC polisher with an IC1000/Suba IV stacked pad and the pad will be conditioned by ex situ diamond disk. And the thickness difference of wafer between before and after polishing test will be measured by Ellipsometer and Nanospec. The roughness of Poly-Si film will be analyzed by atomic force microscope.

• Asian Journal of Atmospheric Environment
• /
• 제6권2호
• /
• pp.73-82
• /
• 2012

This study was aimed to thoroughly estimate the characteristics of indoor particulate matter (PM) collected on subway platforms by the cooperative approach of semi-bulk and single particle analyses. The size-resolved PM and its number concentration were measured on the platform in a heavily traveled subway station in Fukuoka, Japan. Particle Induced X-ray Emission (PIXE) and micro-PIXE techniques were applied to the chemical analyses of semi-bulk and single particle, respectively. There was the close resemblance of timely fluctuation between PM number concentration and train service on the third basement floor (B3F) platform compared to the second basement floor (B2F) and its maximum level was marked in rush hour. Higher number counts in large particles ($>1{\mu}m$) and lower number counts in fine particles ($<1{\mu}m$) were shown on the platform compared to an above ground. PM2.5 accounted for 58.2% and 38.2 % of TSP on B3F and on B2F, respectively. The elements that were ranked at high concentration in size-resolved semi-bulk PM were Fe, Si, Ca, S, and Na. The major elements tending to have more elevated levels on B3F than B2F were Fe (4.4 times), Ca (17.3 times), and Si (46.4 times). Although concentrations were very low, Cr ($11.9ng\;m^{-3}$ on B3F, $2.4ng\;m^{-3}$ on B2F), Mn ($3.4ng\;m^{-3}$ on B3F, $0.9ng\;m^{-3}$ on B2F), and Pb ($0.6ng\;m^{-3}$ on B3F, $1.6ng\;m^{-3}$ on B2F) were detected from PM2.5. Individual PM was nearly all enriched in Fe with Si and Ca. Classifying and source profiling of the individual particles by elemental maps and particle morphology were tried and particles were presumably divided into four groups (i.e., train/rail friction, train-rail sparking, ballast/abrasive, and cement).

• 한국광물학회지
• /
• 제32권4호
• /
• pp.313-321
• /
• 2019

규조토는 규조 껍질로 구성된 규질 다공성 퇴적암으로서 여과보조재, 충전재, 흡착재, 연마재 등의 다양한 용도로 사용된다. 규조토의 특성 개선을 위해 열처리하게 되면, 비정질 실리카인 단백석이 크리스토발라이트로 상전이하여 규조토에 함유된다. 해외 규조토 17개 시료에 대하여 X-선회절분석과 주사전자현미경 분석을 실시한 결과, 1개 시료에는 크리스토발라이트가 함유되어 있지 않으나, 나머지 16개 시료에는 크리스토발라이트가 다양한 정도(6~100 %)로 함유되어 있었다. 공기 중 일정 농도 이상의 크리스토발라이트는 인체유해물질로 관리되나, 식품 중 크리스토발라이트의 유해성은 낮은 것으로 알려져 있다. 그러나 식품 품질 관리를 위해서 액상 여과식품 내 크리스토발라이트 함량 측정 필요성이 제기되어, 분석법을 수립하고 몇몇 식품을 대상으로 분석을 실시하였다. 은여과지로 여과한 크리스토발라이트에 X-선회절분석을 실시하고, 강도를 보정하여 검량선을 작성한 결과, 2.7 mg까지 미량 정량이 가능한 것으로 평가되었다. 이 방법으로 몇몇 유통 액상여과식품의 잔류 크리스토발라이트 함량을 측정하였으나 검출되지 않았다.

• 대한치과기공학회지
• /
• 제33권4호
• /
• pp.263-270
• /
• 2011

Purpose: The grindability of binary Ti-X%Zr(X=10,20,40) alloys in order to develop a Ti alloy with better machinability than unalloyed titanium has been evaluated. Methods: Experimental Ti-Zr alloys were made in an argon-arc melting furnace. Slabs of experimental alloys were ground using a SiC abrasive wheel on an electric handpiece at circumferential speeds(12000,18000,25000 or 30000rpm) by applying a force(200gr). Grinding rate was evaluated by measuring the amount of metal volume removed after grinding for 1 minute and the volume ratio of metal removed compared to the wheel material lost, which was calculated from the diameter loss (grinding ratio). Experimental datas were compared to those for cp Ti(commercially pure titanium) and Ti-6%Al-4%V alloy were used controls. Results: It was observed that the grindability of Ti-Zr alloys increased with an increase in the Zr concentration. More, they are higher than cp Ti, particularly the Ti-20%Zr alloy exhibited the highest grindability at all circumferential speeds. There was significant difference in the grinding rate and grinding ratio between Ti-20%Zr alloy and cp Ti at any speed(p<0.05). Conclusion: By alloying with Zr, the Ti exhibited better grindability at all circumferential speeds. the Ti-20%Zr alloy has a great potential for use as a dental machining alloy.

• 대한치과기공학회지
• /
• 제35권4호
• /
• pp.295-302
• /
• 2013

Purpose: The grindability of Ti-10%Zr-X%Cr(X=0,1,3) alloys in order to develop Ti alloys for dental applications with better machinability than unalloyed titanium has been evaluated. Methods: Experimental Ti-10%Zr-X%Cr(X=0,1,3) alloys were made in an argon-arc melting furnace. Slabs of experimental alloys were ground using a SiC abrasive wheel on an electric handpiece at one of the four rotational speeds of the wheel (12000, 18000, 25000 or 30000rpm) by applying a force(100gf). Grindability was evaluated by measuring the amount of metal volume removed per minute(grinding rate) and the volume ratio of metal removed compared to the wheel material lost, which was calculated from the diameter loss (grinding ratio). Experimental datas were compared the results with those of cp-Ti(commercially pure titanium) Results: It was observed that the grindability of Ti-10%Zr-X%Cr(X=0,1,3) alloys increased with an increase in the Cr concentration. More, they are higher than cp-Ti, particularly the Ti-10%Zr-3%Cr alloy exhibited the highest grindability at all rotational speeds except 12000rpm. There was significant difference in the grinding rate and grinding ratio between Ti-10%Zr-3%Cr alloy and cp-Ti at all rotational speeds(p<0.05). Conclusion: The Ti-10%Zr-3%Cr alloy exhibited better grindability at high rotational speeds, great potential for use as a dental machining alloy.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
• /
• pp.166-169
• /
• 2003

In this study, we evaluated the characteristics by the addition of 3 different kinds of nonionic surfactant to improve the dispersion stability of slurries. Slurry stability is an issue in any industry in which settling of particles can result in poor performance. So we observed the variation of particle size and settling rate when the concentration and addition time of surfactant are changed. When the surfactant is added after milling process, the particle size and pH became low. It is supposed that the particle agglomeration was disturbed by adsorption of surfactant on alumina abrasive. The settling rate was relatively stable when nonionic surfactant is added about 0.1~1.0 wt%. When molecular weight(MW) is too small like Brij 35, it was appeared low effect on dispersion stability. Because it can't prevent coagulation and subsequent settling with too small MW. The proper quality of MW for slurry stability was presented about 500,000. Consequently, the addition of nonionic surfactant to alumina slurry has been shown to have very good effect on slurry stabilization. If we apply this results to copper CMP process, it is thought that we will be able to obtain better yield.

• Tribology and Lubricants
• /
• 제31권2호
• /
• pp.69-77
• /
• 2015

Recently, there have been reports of severe symptoms of wear in bearings due to foreign substances mixed in lubricants. Therefore, studying the effects of foreign substances (such as combustion products and metallic debris) on the wear characteristics of journal bearings and proposing appropriate management standards for lubricant cleanliness have become necessary. Studies on the effect of particle size and concentration of foreign substances on surface damage have actively progressed in the recent times. These studies indicate the possibility of foreign substances causing direct wear of bearing surfaces. However, experiments conducted until now involve only basic tests such as the Pin-on-Disk test instead of those involving real bearing systems. This study experimentally examines the damage to the surface of a journal bearing due to foreign substances (combustion products and alumina) mixed with the lubricant, as well as the effect of the type and size of particles on its wear characteristics. The study uses an experimental journal bearing similar to a real bearing system for conducting the lubrication test. Hydrodynamic Lubrication (HL) numerical analysis, experiment results, and film parameters are used for calculating the operating conditions required for achieving the desired film thickness, and the results of the analysis are modified for considering the surface roughness. The run-time of the experiment is 10 min including the stabilization process. The experiment results show that alumina particles larger than the minimum film thickness cause significant surface damage.