• Title/Summary/Keyword: AR optical system

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A Study on Photocatalytic Degradation Properties by Oxygen Partial Pressure for Tio2Thin Films Fabricated by DC Magnetron Sputtering (DC 마그네트론 스퍼터링법으로 제조된 Tio2 박막의 산소분압비에 따른 광분해 특성에 관한 연구)

  • Jeong, W.J.;Park, J.Y.;Park, G.C.
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.3
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    • pp.226-230
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    • 2005
  • This paper describes the photocatalytic degradation properties by oxygen partial pressure for TiO$_2$ thin films fabricated by dc magnetron reactive sputtering. And the structural, chemical, optical and photocatalytic properties were investigated at various analysis system. When TiO$_2$ thin film was made at deposition time of 120 min and Ar:O$_2$ ratio of 60:40, the best properties were obtained. That results were as follows: thickness; 360∼370 nm, gram size; 40 nm, optical energy band gap; 3.4 eV and Benzene conversion in the photocatalytic degradation; 11 %.

The Fabrication and Properties of Ito Transparent Conducting Film for PDP by the Discharge Plasma Analysis (방전플라즈마 해석을 통한 PDP용 ITO 투명전도막의 제작 및 특성)

  • 곽동주;조문수;박강일;임동건
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.10
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    • pp.902-907
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    • 2003
  • In this paper, the ITO thin film, which is considered as one of the most currently used material for the high performance transparent conducting films for the PDP cell, was made in a parallel-plate, capacitively coupled DC magnetron sputtering system. Some electrical and optical properties of ITO films were investigated and discussed on the basis of glow discharge characteristics. The optimized thin film fabricating conditions of Ar gas pressure and substrate temperature were derived from the Paschen curve and glow discharge characteristics. The maximum transmittance of 89.61 % in the visible region and optical band gap of 3.89 eV and resistivity of 1.67${\times}$10$\^$-3/ $\Omega$-cm were obtained under the conditions of 300 C of substrate temperature and 10∼15 mtorr of pressure, which corresponds nearly to that of Paschen minimum.

Semi-Supervised Learning for Fault Detection and Classification of Plasma Etch Equipment (준지도학습 기반 반도체 공정 이상 상태 감지 및 분류)

  • Lee, Yong Ho;Choi, Jeong Eun;Hong, Sang Jeen
    • Journal of the Semiconductor & Display Technology
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    • v.19 no.4
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    • pp.121-125
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    • 2020
  • With miniaturization of semiconductor, the manufacturing process become more complex, and undetected small changes in the state of the equipment have unexpectedly changed the process results. Fault detection classification (FDC) system that conducts more active data analysis is feasible to achieve more precise manufacturing process control with advanced machine learning method. However, applying machine learning, especially in supervised learning criteria, requires an arduous data labeling process for the construction of machine learning data. In this paper, we propose a semi-supervised learning to minimize the data labeling work for the data preprocessing. We employed equipment status variable identification (SVID) data and optical emission spectroscopy data (OES) in silicon etch with SF6/O2/Ar gas mixture, and the result shows as high as 95.2% of labeling accuracy with the suggested semi-supervised learning algorithm.

Tool Fracture Detection Using System Identification (시스템인식을 이용한 공구파손 검출)

  • 사승윤
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1996.03a
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    • pp.119-123
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    • 1996
  • The demands for robotic and automatic system are continually increasing in manufacturing fields. There were so many studies to monitor and predict system, but it were mainly relied upon measuring of cutting force, current of motor spindle and using acoustic sensor, etc. In this study digital image of time series sequence was acquired taking advantage of optical technique. Then, mean square error was obtained from it and was available for useful observation data. The parameter was estimated using PAA(parameter adaptation algorithm) from observation data. AR model was selected for system model, fifth order was decided according to parameter estimation. Uncorrelation test was also carried out to verify convergence of parameter. Through the proceedings, we found there was a system stability.

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Characteristic of Zr(Si)N film as a diffusion barrier between Cu metal and Si substrate (Cu 금속과 Si 기판 사이에서 확산방지막으로 사용하기 위한 Zr(Si)N 박막의 특성)

  • 김좌연;조병철;채상훈;김헌창;박경순
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.12 no.6
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    • pp.283-287
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    • 2002
  • We have studied Zr(Si)N film as a diffusion barrier between Cu metal and Si substrate for application of interconnection metal in ULSI circuits. Zr(Si)N film was deposited with reactive DC magnetron sputtering system using $Ar/N_2$mixed gas. The value of the resistivity was the lowest for the ZrN film using 29 : 1 of Ar : $N_2$reactant gas ratio at room temperature and decreased with increasing of Si substrate temperature. As the value of ZrN film resistivity was decreased, the direction of crystal growth was toward to (002) plane. The barrier property of ZrN film added with Si was improved. But Si was added too much in ZrN film, the barrier property was degraded. The adhesive property was improved with increasing of Si in ZrN. For the analysis of the film, XRD, Optical microscopy, Scretch tester, so on were used.

PAHs Formation Characteristics and Fullerenes $(C_{60},\;C_{70})$ Synthesis in a Low-Pressure $C_6H_6/Ar/O_2$ Flame (저압 $C_6H_6/Ar/O_2$ 화염에서 PAHs 생성 특성 및 플러렌$(C_{60},\;C_{70})$ 합성에 대한 연구)

  • Lee, G.W.;Kim, Y.W.;Hwang, J.;Jrung, J.;Choi, M.
    • Journal of the Korean Society of Combustion
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    • v.7 no.4
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    • pp.36-44
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    • 2002
  • Carbon molecules with closed-cage structures are called fullerenes $(C_{60},\;C_{70})$, whose applications include super-conductors, sensors, catalysts, optical and electronic device, polymer composites, and biological and medical materials. The synthesis of fullerenes has been recently studied with low-pressure benzene/argon/oxygen flames. The formation of fullerene is known as molecular weight growth processes of PAHs (polycyclic aromatic hydrocarbon). This study presents results of PAHs and fullerene measurements performed in a low-pressure benzene/argon/oxygen normal co-flow laminar diffusion flame. Through the central tube of the burner, benzene vapors carried by argon are injected. The benzene vapors are made in a temperature-controlled bubbler. The burner is located in a chamber, equipped with a sampling system for direct collection of condensable species from the flame, and exhausted to a vacuum pump. Samples of the condensable are analyzed by HPLC (High Performance Liquid Chromatography) to determine the yields of PAHs and fullerene. Also, we computed mole fraction of fullerene and PAHs in a nearly sooting low pressure premixed, one-dimensional benzene/argon/oxygen flame (equivalence ratio ${\Phi}=2.4$, pressure=5.33kPa). The object of computation was to investigate the formation mechanism of fullerenes and PAHs. The computations were performed with CHEMKIN/PREMIX. As a result of this study, fullerenes were synthesized in a low pressure (20torr) $C_6H_6/Ar/O_2$ flames and the highest concentration of fullerene was detected just above the visible surface of a flame.

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Etch characteristics of TiN thin film adding $Cl_2$ in $BCl_3$/Ar Plasma ($BCl_3$/Ar 플라즈마에서 $Cl_2$ 첨가에 따른 TiN 박막의 식각 특성)

  • Um, Doo-Seung;Kang, Chan-Min;Yang, Xue;Kim, Dong-Pyo;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.168-168
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    • 2008
  • Dimension of a transistor has rapidly shrunk to increase the speed of device and to reduce the power consumption. However, it is accompanied with several problems like direct tunneling through the gate dioxide layer and low conductivity characteristic of poly-Si gate in nano-region. To cover these faults, study of new materials is urgently needed. Recently, high dielectric materials like $Al_2O_3$, $ZrO_2$, and $HfO_2$ are being studied for equivalent oxide thickness (EOT). However, poly-Si gate is not compatible with high-k materials for gate-insulator. Poly Si gate with high-k material has some problems such as gate depletion and dopant penetration problems. Therefore, new gate structure or materials that are compatible with high-k materials are also needed. TiN for metal/high-k gate stack is conductive enough to allow a good electrical connection and compatible with high-k materials. According to this trend, the study on dry etching of TiN for metal/high-k gate stack is needed. In this study, the investigations of the TiN etching characteristics were carried out using the inductively coupled $BCl_3$-based plasma system and adding $Cl_2$ gas. Dry etching of the TiN was studied by varying the etching parameters including $BCl_3$/Ar gas mixing ratio, RF power, DC-bias voltage to substrate, and $Cl_2$ gas addition. The plasmas were characterized by optical emission spectroscopy analysis. Scanning electron microscopy was used to investigate the etching profile.

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The Electrical and Optical Properties of Al-Doped ZnO Films Sputtered in an Ar:H2 Gas Radio Frequency Magnetron Sputtering System

  • Hwang, Seung-Taek;Park, Choon-Bae
    • Transactions on Electrical and Electronic Materials
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    • v.11 no.2
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    • pp.81-84
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    • 2010
  • Al-doped ZnO (AZO) films were prepared by an Ar:$H_2$ gas radio frequency (RF) magnetron sputtering system with a AZO ($2\;wt{\cdot}%\;Al_2O_3$) ceramic target at the low temperature of $100^{\circ}C$ and annealed in hydrogen ambient at the temperature of $300^{\circ}C$. To investigate the influence of the $H_2$ flow ratio on the properties of the AZO films, the $H_2$ flow ratio was changed from 0.5% to 2%. As a result, the AZO films, deposited with a 1% $H_2$ addition, showed a resistivity of $11.7\;{\times}\;10^{-4}\;{\Omega}{\cdot}cm$. When the AZO films were annealed at $300^{\circ}C$ for 1 hour in a hydrogen atmosphere, the resistivity decreased from $11.7\;{\times}\;10^{-4}\;{\Omega}{\cdot}cm$ to $5.63\;{\times}\;10^{-4}\;{\Omega}{\cdot}cm$. The lowest resistivity of $5.63\;{\times}\;10^{-4}{\Omega}{\cdot}cm$ was obtained by adding 1% hydrogen gas to the deposition and annealing process. The X-ray diffraction patterns of all the films showed a preferable growth orientation in the (002) plane. The spectrophotometer measurements showed that the transmittance of 85% was obtained by the film deposited with the $H_2$ flow ratio of 1% at 940 nm for GaAs/GaAlAs LEDs.

A Study on Interactive Information Service based on Augmented Reality (증강현실기반 양방향 정보서비스에 관한 연구)

  • Kim, Yong
    • Journal of Information Management
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    • v.41 no.4
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    • pp.41-67
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    • 2010
  • Augmented reality technology was invented for military purposes at the beginning. But the development of wireless and location based technology in 2000s makes AR services reach the age of innovation. Especially, it attracts attention as a media which enriches our perception. There is a potential that it can extend the virtual information in the real world from optical sense to auditory, tactile, and olfactory sense. This study proposed the interactive information service system and method based on AR. To do it, technical background on AR was analyzed and a method to apply the technology was examined. Especially, as a eco service, this study proposed new information service using 2D bar code in a library for user need and convenience in ubiquitous environment. The proposed service system can optimize practical utilization of information resources in virtual and real reality as consolidating analog and digital resources in a library.

Fabrication and Performance of Electron Cyclotron Resonance Ion Milling System for Etching of Magnetic Film Device (자성박막 소자 에칭용 전자 사이클로트론 공명 이온밀링 시스템 제작과 특성연구)

  • Lee, Won-Hyung;Hwang, Do-Guwn;Lee, Sang-Suk;Rhee, Jang-Roh
    • Journal of the Korean Magnetics Society
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    • v.25 no.5
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    • pp.149-155
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    • 2015
  • The ECR (Electron Cyclotron Resonance) Ar ion milling was manufactured to fabricate the device of thin film. The ECR ion milling system applied to the device etching operated by a power of 600W, a frequency of 2.45 GHz, and a wavelength of 12.24 cm and transferred by a designed waveguide. In order to match one resonant frequency, a magnetic field of 908 G was applied to a cavity inside of ECR. The Ar gas intruded into a cavity and created the discharged ion beam. The surface of target material was etched by the ion beam having an acceleration voltage of 1000 V. The formed devices with a width of $1{\mu}m{\sim}9{\mu}m$ on the GMR-SV (Giant magnetoresistance-spin valve) multilayer after three major processes such as photo lithography, ion milling, and electrode fabrication were observed by the optical microscope.