• Journal of Magnetics
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• v.11 no.1
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• pp.16-19
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• 2006

$2-\mu{m}$ thick GaN epilayer was prepared, and 80 KeV $Co^{-}$ ions with a dose of $3X10^{16}\;cm^{-2}$ were implanted into GaN at $350^{\circ}C$. The implanted samples were post annealed at $700^{\circ}C$. We have investigated the magnetic and structural properties of Co ion-implanted GaN by various measurements. HRXRD results did not show any peaks associated with second phase formation and only the diffraction from the GaN layer and substrate structure were observed. SIMS profiles of Co implanted into GaN before and after annealing at $700^{\circ}C$ have shown a projected range of $\sim390\AA$ with 7.4% concentration and that there is little movement in Co. AFM measurement shows the form of surface craters for $700^{\circ}C$-annealed samples. The magnetization curve and temperature dependence of magnetization taken in zero-field-cooling (ZFC) and field-cooling (FC) conditions showed the features of superparamagnetic system in film. XPS measurement showed the metallic Co 2p core levels spectra for $700^{\circ}C$-annealed samples. From this, it could be explained that magnetic property of our films originated from Co magnetic clusters.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.60-60
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• 2003

디자인 룰에 의해 Gate Length 가 100nm 이하로 줄어듦에 따라 Gate delay 감소와 Switch speed 향상을 위해 보다 더 큰 drive current 를 요구하게 되었다. 본 연구는 dirve current 를 증가시키기 위해 고안된 Strained Si substrate 를 만들기 위한 SiGe layer 성장에 관한 연구이다. SiGe layer를 성장시킬 때 SiH$_4$ gas와 GeH$_4$ gas를 furnace에 flow시켜 Chemical 반응에 의해 Si Substrate를 성장시키는 LPCVD(low pressure chemical vapor depositio)법을 사용하였고 SIMS와 nanospec을 이용하여 박막 두께 및 Ge concentration을 측정하였고, AFM으로 surface의 roughness를 측정하였다. 본 연구에서 우리는 10,20,30,40%의 Ge concentration을 갖는 10nm 이하의 SiGe layer를 얻기 위하여 l0nm 이하의 fixed 된 두께로 SiGe layer를 성장시킬 때 temperature, GeH$_4$ gas pre-flow, SiH$_4$ 와 GeH$_4$의 gas ratio를 변화시켜 성장시킨 후 Ge 의 concentration과 실제 형성된 두께를 측정하였고, SiGe의 mole fraction의 변화에 따른 surface의 roughness 를 측정하였다. 그 결과 10 nm의 두께에서 temperature, GeH$_4$ gas pre-flow, SiH$_4$ 와 GeH$_4$ 의 gas ratio의 변화와 Ge concentration 과의 의존성을 확인 할 수 있었고, SiGe 의 mole traction이 증가하였을 때 surfcace의 roughness 가 증가함을 알 수 있었다. 이 연구 결과는 strained Si 가 가지고 있는 strained Si 내에서 n-FET 와 P-FET사이의 불균형에 대한 해결과 좀 더 발전된 형태인 fully Depleted Strained Si 제작에 기여할 것으로 보인다.

• Journal of Electrical Engineering and Technology
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• v.12 no.5
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• pp.2007-2013
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• 2017

In order to give hydrophobic surface properties on carbon steel, the fluorinated amorphous carbon films were prepared by using linear 2.45GHz microwave PECVD device. Two different process approaches have been tested. One is direct deposition of a-C:H:F films using admixture of $Ar/CH_4/CF_4$ working gases and the other is surface treatment using $CF_4$ plasma after deposition of a-C:H film with $Ar/CH_4$ binary gas system. $Ar/CF_4$ plasma treated surface with high $CF_4$ gas ratio shows best hydrophobicity and durability of hydrophobicity. Nanometer scale surface roughness seems one of the most important factors for hydrophobicity within our experimental conditions. The properties of a-C:H:F films and $CF_4$ plasma treated a-C:H films were investigated in terms of surface roughness, hardness, microstructure, chemical bonding, atomic bonding structure between carbon and fluorine, adhesion and water contact angle by using atomic force microscopy (AFM), nano-indentation, Raman analysis and X-ray photoelectron spectroscopy (XPS).

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.34.2-34.2
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• 2011

The demand for Ru has been increasing in the electronic, chemical and semiconductor industry. Chemical mechanical planarization (CMP) is one of the fabrication processes for electrode formation and barrier layer removal. The abrasive particles can be easily contaminated on the top surface during the CMP process. This can induce adverse effects on subsequent patterning and film deposition processes. In this study, a post Ru CMP cleaning solution was formulated by using sodium periodate as an etchant and citric acid to modify the zeta potential of alumina particles and Ru surfaces. Ru film (150 nm thickness) was deposited on tetraethylorthosilicate (TEOS) films by the atomic layer deposition method. Ru wafers were cut into $2.0{\times}2.0$ cm pieces for the surface analysis and used for estimating PRE. A laser zeta potential analyzer (LEZA-600, Otsuka Electronics Co., Japan) was used to obtain the zeta potentials of alumina particles and the Ru surface. A contact angle analyzer (Phoenix 300, SEO, Korea) was used to measure the contact angle of the Ru surface. The adhesion force between an alumina particle and Ru wafer surface was measured by an atomic force microscope (AFM, XE-100, Park Systems, Korea). In a solution with citric acid, the zeta potential of the alumina surface was changed to a negative value due to the adsorption of negative citrate ions. However, the hydrous Ru oxide, which has positive surface charge, could be formed on Ru surface in citric acid solution at pH 6 and 8. At pH 6 and 8, relatively low particle removal efficiency was observed in citric acid solution due to the attractive force between the Ru surface and particles. At pH 10, the lowest adhesion force and highest cleaning efficiency were measured due to the repulsive force between the contaminated alumina particle and the Ru surface. The highest PRE was achieved in citric acid solution with NaIO4 below 0.01 M at pH 10.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.41.2-41.2
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Metal Oxide Semiconductor) based electronic devices become much faster speed and smaller size than ever before. However, very narrow interconnect line width causes some drawbacks. For example, deposition of conformal and thin barrier is not easy moreover metallization process needs deposition of diffusion barrier and glue layer. Therefore, there is not enough space for copper filling process. In order to overcome these negative effects, simple process of copper metallization is required. In this research, Cu-V thin alloy film was formed by using RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane $SiO_2$/Si bi-layer substrate with smooth and uniform surface. Cu-V film thickness was about 50 nm. Cu-V layer was deposited at RT, 100, 150, 200, and $250^{\circ}C$. XRD, AFM, Hall measurement system, and XPS were used to analyze Cu-V thin film. For the barrier formation, Cu-V film was annealed at 200, 300, 400, 500, and $600^{\circ}C$ (1 hour). As a result, V-based thin interlayer between Cu-V film and $SiO_2$ dielectric layer was formed by itself with annealing. Thin interlayer was confirmed by TEM (Transmission Electron Microscope) analysis. Barrier thermal stability was tested with I-V (for measuring leakage current) and XRD analysis after 300, 400, 500, 600, and $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However V-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Thus, thermal stability of vanadium-based thin interlayer as diffusion barrier is good for copper interconnection.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.976-979
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• 2003

In this study, we formed the 2-dimensional holographic grating in order to mamufactured 2-dimensional photonic crystal in amorphous $As_{40}Ge_{10}Se_{15}S_{35}$ and $Ag/As_{40}Ge_{10}Se_{15}S_{35}$ thin film which have the excellent optical sensetivity using by He-Ne laser(632.8nm). The intensity of incident beam was 2.5mW and incident angle that $2{\theta}$ is $20^{\circ}$. We formed the holographic grating after had formed the 1-dimansional holographic grating and then rotate the sample. We confirmed that 2-dimensional holographic grating result of the figure of diffracted beam and AFM(Atomic Forced Microcopy) image.

• Journal of Electrochemical Science and Technology
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• v.9 no.3
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• pp.202-211
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• 2018

In this work, Fe-Pd alloy films have been electrodeposited on different substrates using an electrolyte containing $[Pd(NH_3)_4]^{2+}$ (0.02 M) and $[Fe-Citrate]^{2+}$ (0.2 M). The influences of substrate and overpotential on chemical composition, nucleation and growth kinetics as well as the electrodeposited films morphology have been investigated using energy dispersive X-ray spectroscopy (EDS), current-time transients, scanning electron microscopy (SEM), atomic force microscopy (AFM) and X-ray diffraction (XRD) patterns. In all substrates - brass, copper and sputtered fluorine doped tin oxide on glass (FTO/glass) - Fe content of the electrodeposited alloys increases by increasing the overpotential. Also the cathodic current efficiency is low due to high rate of $H_2$ co-reduction. Regarding the chronoamperometry current-time transients, it has been demonstrated that the nucleation mechanism is instantaneous with a typical three dimensional (3D) diffusion-controlled growth in the case of brass and copper substrates; while for FTO, the growth mode changes to 3D progressive. At a constant overpotential, the calculated number of active nucleation sites for metallic substrates is much higher than that of FTO/glass; however by increasing the overpotential, the number of active nucleation sites increases. The SEM micrographs as well as the XRD patterns reveal the formation of Fe-Pd alloy thin films with nanostructure arrangement and ultra-fine grains.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.222-222
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• 2010

III-V반도체 태양전지는 다양한 에너지 밴드갭을 만들 수 있으며 다중접합 태양전지의 경우 흡수 전류가 커져 효율이 증가한다. 태양전지의 효율의 증가는 태양광 발전시스템의 발전 단가를 낮추는 중요한 요인이다. 우리는 효율이 높은 III-V 태양전지를 제작하기 위해 일차적으로 Ge기판 위에 GaAs를 성장하고자 한다. Ge기판과 GaAs의 격자상수는 0.07%차이로 거의 일치하나 물질의 열팽창계수가 다르고 비극성인 Ge기판 위에 극성인 GaAs를 성장 시 위상불일치(Anti Phase Domain) 나타난다. 위상불일치 현상을 줄이기 위해 성장 시 온도와 V/III비율, 성장두께 등을 달리하여 성장한다. 표면의 상태가 좋아질수록 위상불일치 현상이 작으며 단일성장 보다 두 단계 과정으로 성장 했을 때 표면의 상태가 더 좋은 결과를 바탕으로[1], 20nm 이하로 얇게 seed층을 성장하고 그 위에 두꺼운 버퍼층을 성장하는 두 단계로 진행하였다. seed층의 성장온도는 $400{\sim}550^{\circ}C$, V/III 비율을 3.5~30으로 다양하게 바꿔가면서 표면의 상태를 비교하였다. 이때 버퍼층의 성장 온도와 V/III 비율은 $680^{\circ}C$, 192으로 일정하게 유지하였다. 표면은 SEM과 AFM을 통해 분석하였으며 결정질의 상태는 XRD 장비(Panalytical사)로 분석하고 광학적 특성은 LTPL(Accent Optical Technologies사)로 측정하였다. 실험의 결과는 seed층의 온도가 낮고 V/III 비율이 낮으며 성장률이 높았을 때 표면상태가 좋은 반면 버퍼층은 온도가 높고 V/III 비율이 높으며 성장률이 낮을 때 표면상태가 좋았다. seed층을 $450^{\circ}C$온도에서 V/III 비율이 3.5이고 성장률이 버퍼층에 비교하여 크게 하여 성장 했을 때 표면 거칠기가 3.75nm로 작아 표면의 상태가 좋음을 확인할 수 있었다. 두 단계 성장 시 표면의 상태는 seed층의 조건에 따라 결정됨을 알 수 있었다. 표면상태가 좋았을 때 결정상태 역시 좋았으며 성장률이 바뀜에 따라 반치폭이 42~45 arcsec의 값을 나타내었다. 광학적 특성은 10K에서 1.1512eV 밴드갭 에너지를 가지고 있어 양질의 GaAs가 성장됨을 알 수 있다.

• Korean Journal of Materials Research
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• v.9 no.2
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• pp.155-162
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• 1999

Zirconia thin films of uniform structure were fabricated by plasma-enhanced metal-organic chemical vapor deposition. Deposition conditions such as substrate temperature were observed to have much influence on the formation of zirconia films, therefore the mechanism of decomposition of $Zr[TMHD]_4$precursor and film growth were examined by XRD, FT-IR etc., as well as the determination of the optimal deposition condition. From temperature dependence on zirconia, below the deposition temperature of 523K, the amorphous zirconia was formed while the crystalline of zirconia with preferred orientation of cubic (200) was obtained above the temperature. Deposits at low temperatures were investigated by FT-IR and the absorption band of films revealed that the zirconia thin film was in amorphous structure and has the same organic band as that of Zr precursor. In case of high temperature, it was found that Zr precursor was completely decomposed and crystalline zirconia was obtained. In addition, at 623K the higher RF power yielded the increased crystallinity of zirconia implying an increase in decomposition rate of precursor. However, it seems that RF power has nothing with the zirconia deposition process at 773K. It was found that the proper bubbler temperature of TEX>$Zr[TMHD]<_4$ precursor is needed along with high flow rate of carrier gas. Through AFM analysis it was determined that the growth mechanism of the zirconia thin film showed island model.

• Journal of the Korean institute of surface engineering
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• v.38 no.5
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• pp.188-192
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• 2005

Indium zinc oxide (IZO) thin films were deposited on glass substrate by dc magnetron sputtering. The effects of oxygen flow rate and deposition temperature on electrical and optical properties of the films were investigated. With addition of small amount of oxygen gas, the characteristic properties of amorphous IZO films were improved and the specific resistivity was about $4.8{\times}10^{-4}\Omega{\cdot}cm$. Change of structural properties according to the deposition temperature was observed with XRD, SEM, and AFM. Films deposited above $300^{\circ}C$ were found to be polycrystalline. Surface roughness of the films was increased due to the formation of grains on the surface. Electrical conductivity became deteriorated for polycrystalline IZO films. Consequently, high quality IZO films could be prepared by do sputtering with $O_{2}/Ar{\simeq}0.03$ and deposition temperature in range of $150\~200^{\circ}C$; a specific resistivity of $3.4{\times}10^{-4}{\Omega}{\cdot}cm$, an optical transmission over $90\%$ at wavelength of 550 nm, and a rms value of surface roughness about $3{\AA}$.