• Geomechanics and Engineering
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• v.8 no.4
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• pp.477-493
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• 2015

In rock drilling, the most important characteristic to clarify is the wear of the drill bits. The reason that the rock drill bits fail with time is wear. In dry sliding contact adhesive wear deteriorates the materials in contact, quickly, and is the result of shear fracture in the momentary contact joins between the surfaces. This paper aims at presenting an overview of the assessment of WC/Co cemented carbide (CC) tricone bit in rotary drilling. To study wear of these bits, two approaches have been used in this research. Firstly, the new bits were weighted before they mounted on the drill rigs and also after completion their useful life to obtain bit weight loss percentage. The characteristics of the rock types drilled by using such this bit were measured, simultaneously. Alternatively, to measure contact wear, namely, matrix wear a micrometer has been used with a resolution of 0.02 mm at different direction on the tricone bits. Equivalent quartz content (EQC), net quartz content (QC), muscovite content (Mu), coarseness index (CI) of drill cuttings and compressive strength of rocks (UCS) were obtained along with thin sections to investigate mineralogical properties in detail. The correlation between effective parameters and bit wear were obtained as result of this study. It was observed that UCS shows no significant correlation with bit wear. By increasing CI and cutting size of rocks wear of bit increases.

• Publications of The Korean Astronomical Society
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• v.28 no.3
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• pp.75-82
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• 2013

An optical grism for education is fabricated and tested. It is composed of a transmission grating as dispersion element and a prism as diffraction angle compensation device. The transmission grating is Edmundoptics #49-584(spatial frequency 600 lines/mm, dimension $50mm{\times}50mm$). The prism is the fused silica type with angles ($41.3^{\circ}$, $-48.7^{\circ}$, $-90^{\circ}$). The grism device is fabricated by bonding the transmission grating and the prism with an optical adhesive. The zig for assembling the grism, telescope and camera is composed of an aluminum tube, an aluminum disk ring and a T-ring camera adaptor. The fabricated optical grism spectrograph is tested in laboratory using Halogen lamp and Neon lamp with DSLR camera. And the grism assembled with reflector telescope is tested in a field using stellar light. The results show good agreements with design parameters. The wavelength coverage range of the grism is 250 nm at the un-deviated wavelength of 506 nm. The wavelength resolution is 0.11 nm/pixel.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.1
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• pp.110-115
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• 2016

The need for high-strength galvanized steel has recently increased because of the increased number of car consumers who want improved efficiency and exterior quality. High-strength galvanized steel with high corrosion resistance improves the durability of products and exterior quality. Furthermore, the gilt of zinc does not come off during machining because of the fine adhesive property of zinc. When these are welded, zinc has a lower melting temperature than iron, so zinc is more quickly vaporized than iron. Vaporized zinc can stick to electrodes, which increases spatter in welding transportation. Created spatter can enter the molten pool and develop into inner defects or blowholes and pits. Scattered spatter sticks to the product, which leads to the secondary cost of spatter removal. Therefore, in this study, comparisons of amounts of spatter generated are conducted according to the composition of shielding gas in the MIG and CMT processes to find optimal welding parameters.

• Journal of the Society of Disaster Information
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• v.12 no.1
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• pp.54-61
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• 2016

The use of advanced composite materials in strengthening and repair of existing structures is increasing rapidly. This paper describes an effectiveness of a bonding of carbon fiber reinforced sheets to corroded steel members for the repair. Three types of surface treatment, what we call cleaning, of corroded plate are chosen as parameters. They are "without cleaning","removal of painting by brushing" and "complete removal of painting". From the experimental study, the following findings are obtained. 1) When the steel plate is subjected to tensile force, carbon fiber sheets adhered to the painted steel gives a higher strength against peeling compared to that of the plate without painting, 2) The grade of surface treatment, or cleaning of the corroded steel plate affects the strengthening effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.355-356
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• 2006

This work describes the effect of the number of roll pressing and the composition of carbon black on the electric and mechanical properties of carbon-PTFE electrode, in which composition is MSP20 : carbon black: PTFE = 95-X : X : 5 wt.%. It was found that the best electric and mechanical properties were obtained for sheet electrode roll pressed about 15 times and for sheet electrode, in which composition is MSP20 carbon black : PTFE = 80 : 15 : 5 wt%. These behaviors could be explained by the network structure of PTFE fibrils and conducting paths linked with carbon blacks, respectively. On the other hand, cell capacitor using the sheet electrode with 15 wt.% of carbon black attached on aluminum current collector with the electric conductive adhesive, in composition is carbon black : CMC = 70 : 30 wt.%, has exhibited the best rate capability between 0.5 $mA/cm^2$ ~ 100 $mA/cm^2$ current density and the lowest ESR.

• Journal of Welding and Joining
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• v.33 no.6
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• pp.13-20
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• 2015

Many automotive companies are endeavoring to improve the quality of resistance spot welding by updating body-in-white (BIW) production line with adaptive control spot welding system to compensate the process disturbances such as gap, electrode wear, oxidized surfaces, poor fit up and adhesive etc. Most of the commercial adaptive weld controllers require proper "Initial Welding Schedule" or "Reference weld" to achieve compensation in welding parameters during real time welding. In this study, the compensation of a commercial adaptive weld controller had been observed and analyzed thoroughly for various process disturbances to find optimal initial welding schedule. It was observed that 90 percent of the expulsion current in constant current control as reference welding schedule conferred the maximum button diameter in adaptive control welding. Finally, effects of each disturbance in combined field disturbances system with adaptive control had also been confirmed with the design of experiment (DOE) by minitab(R)16 for combined disturbances situation and suitability of optimum initial weld current had also established with real body part validation test.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.4 s.97
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• pp.148-154
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• 1999

This study was carried out to verify grinding performance of dental diamond bur and investigate the possibility of AE application in dentistry field. Workpieces were made of acryl and bovine respectively for the experiments in this study. Grinding test was conducted to get the data of grinding resistance and specific grinding energy of four different types of diamond bur by using tool dynamometer. AE signal was acquired to verify grinding process in the AE measuring system. Tool wear was observed to find parameters about grinding characteristics of diamond bur by means of SEM picture. It was found that the wear of dental diamond bur could be detected with polishing of grinding material, removal of adhesive parts, wear of particles neighboring cutting nose, loss of material and elevation of temperature. The wear of B, C, D type diamond bur is due to wear and fracture of grain size. Abnormal state can be found through the behavior of AE signal in the grinding working. As a result, it is expected that forecast of abnormal state is possible using AE equipments under real time process.

• Journal of Ocean Engineering and Technology
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• v.10 no.2
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• pp.88-97
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• 1996

The pupose of this study is to improve the mechanical properies and to evaluate the residual stresses of flame-sprayed Alumina ceramic coating layer. The first work in this study is to investigate the effects of strengthening heat treatments on the mechanical properties of coating layer. Strengthening heat treatments for sprayed specimens were carried out in vaccum furnace. The mechanical properties such as microhardness, thermal shock resistance, adhesive strength and erosion resistance were tested for the sprayed specimens after strengthening heat treatments. And it was clear that the mechanical properties of coating layer were much improved by strengthening heat treatments. The second work in this study is to evalute the residual stresses in coating lsyer by numerical analysis. FDM and FEM were used to analyze temperature distribution and residul stresses in coating layer. It was proved that are tensile stresses in coating layer and that residual stresses can be controlled by the appropriate selection of the spraying parameters such as preheat temperature, coating thickness and bond coat thickness.