• Title/Summary/Keyword: 3D profile measurement

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A Study of Hair Damage by Magic Straight Perm

  • Lim, Sun-Nye
    • Applied Microscopy
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    • v.42 no.3
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    • pp.129-135
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    • 2012
  • In this study, the changes in hair quality before and after Magic straight perm have been evaluated through a hair damage measurement method. For this, a healthy high school student's (age18 years) wavy hair was selected and permed on the left and right sides. Then, the changes caused by physical methods which were applied during the fl at iron-based Magic straight perm were evaluated based on the hair damage measurement method before and after the Magic straight perm. According to the protein release test after the Magic straight perm, 1.26% in average and 0.14% was observed in Cool Magic straight perm sample. In a field emission scanning electron microscopy (FE-SEM) test, saw teeth-shaped partial desquamation of cuticle cells and impurities were observed in the warm-treated hair sample. In atomic force microscope (AFM), line-profile is a method to represent roughness data on hair. According to analysis on 3-dimensional (3D) images, the hair with Cool Magic straight perm was lower than the hair with Warm Magic perm in terms of the color change of 3D images. In addition, vertical changes were observed in the hair with Cool Magic perm. As a result, irregular surface roughness was observed. This study proposed a method to minimize hair damage by cooling down the heat with the cool hair straightener as soon as the Warm Magic was finished.

Phase Peak Ambiguity According to Illumination in White-Light Phase-Shifting Interferometry (백색광 간섭계의 위상 정점 알고리즘에서 조명에 따른 위상 정점 모호성에 관한 연구)

  • Kim, Gee-Hong;Lee, Hyung-Seok
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.1
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    • pp.85-91
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    • 2008
  • White light scanning interferometry has gotten a firm position in 3D surface profile measuring field. Recently, the LCD industry gave a chance for this technology to enter into real industry fields. It is known that white-light phase-shifting algorithm give a best resolution compare to other algorithms, but there are some problems to be resolved. One of them is 300nm jump in height profile, called bat-wing effect. The main reason of this problem is an ambiguity of phase-peak detection algorithm, and some solution has been proposed, but it didn't work perfectly. In this paper, I will show the cases when these effects are occurred, and these height discrepancies will be almost disappeared when broad-band illuminators are used.

Development of the 3D Rail Profile Reconstruction Method Improving the Measurement Accuracy of Railway Abrasion (레일 마모도의 측정 정밀도 향상을 위한 3차원 레일 프로파일 재구성 기법 개발)

  • Ahn, Sung-Hyuk;Kim, Man-Cheol
    • Proceedings of the KSR Conference
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    • 2010.06a
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    • pp.533-539
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    • 2010
  • The The contactless railway abrasion measurement system have to satisfy two conditions to increase the measurement accuracy as follows. The laser region projected on the rail have to be extracted without the geometrical distortion. The mapping of the acquired laser region data on the rail profile have to be matched with the cross section of rail, exactly. But, the conventional railway abrasion measurement system is required the post image processing with a camera model and a perspective transform for the exact mapping between the cross section of rail and the coordinate data extracted from a line laser region or the raw image obtained from a camera because the image captured from the camera has an oblique viewpoint. So, the measured rail profile data had limits to the measurement accuracy because of a discontinuity point. In this Paper, we propose the 3D rail profile reconstruction method to increase the accuracy of the railway abrasion measurement system applying the modified camera model and perspective transform to the image obtained from the bidirectional rail.

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Development of Typical On-Machine Measurement S/W based 3D modeler (3D 모델러 기반의 기상측정 소프트웨어 개발)

  • 김찬우;신장순;윤길상;조명우;박균명;유택인
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1581-1584
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    • 2003
  • This paper proposed efficient manufacturing system using OMM(on-machine measurement) system and OMM operating S/W based 3D modeler. A Developed program connected tool machine with RS232C. It is composed two operating system that touch probe operating and laser displacement sensor operating system. A program for touch probe possible measure considered inspection feature and CAD data. The laser operating program is used inspection for profile. very small hole using installed feature data. This system is applied manufacturing line of mold(cavity, core) also verification of efficiency manufacturing process that production, reduction machining error of each process

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The Development of 3D based On-Machine Measurement Operating System (3D 기반의 기상측정 운영시스템 개발)

  • 윤길상;최진화;조명우;김찬우
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.7
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    • pp.145-152
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    • 2004
  • This paper proposed efficient manufacturing system using the OMM (on-machine measurement) system. The OMM system is software based 3D modeler for inspection on machine and it is interfaced tool machine with RS232C. The software is composed of two inspection modules that one is touch probe operating module and the other is laser displacement sensor operating module. The module for touch probe has need of inspection feature that extracted it from CAD data. Touch probe moves to workpiece by three operating modes as follows: manual, general and automatic mode. The operating module of laser displacement sensor is used inspection for profile and very small hole. An Advantage of this inspection method is to be able to execute on-line inspection during machining or after it. The efficiency of proposed system which can predict and definite the machining errors of each process is verified, so the developed system is applied to inspect the mold-base(cavity, core).

PSD sensor array design for the 3D measurement of moving objects (이동 물체의 3차원 계측을 위한 PSD 센서 배열 설계)

  • Kim, Jon-Man;Do, Yong-Tae
    • Journal of Sensor Science and Technology
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    • v.17 no.2
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    • pp.106-113
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    • 2008
  • Perceiving a 3D moving target is important for automated machines including robots in a factory. Although stereovision or ultrasonic ranging is often employed for the purpose, the former requires high-cost systems, and the latter suffers from low-resolution. In this paper, we propose a PSD sensor array to acquire the 3D profile of an object conveyed by a belt. Rectangular parallelepiped target objects at random positions and orientations are assumed. Nine PSD sensors are configured in a $3{\times}3$ array above the belt, and fired in a sequence so that cross-talk can be avoided. Time gaps among sensor readings are compensated to get a result that is obtainable when sensors' measurements are made simultaneously along a sensing line. The system designed is tested with various objects in experiments.

Ultra High-speed 3-dimensional Profilometry Using a Laser Grating Projection System

  • Park, Yoon-Chang;Ahn, Seong-Joon;Kang, Moon-Ho;Kwon, Young-Chul;Ahn, Seung-Joon
    • Journal of the Optical Society of Korea
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    • v.13 no.4
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    • pp.464-467
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    • 2009
  • The grating projection method with phase-shifting technique is very useful in measuring the 3-dimensional (3D) shape with high accuracy and speed. In this work, we have developed an ultra high-speed digital laser grating projection system using a high-power laser diode and a highsensitivity CMOS camera. With our system, the optical measurement required to find out the profile of a 3D object could be carried out within 2.6 ms, which is a significant ($\sim$10 times) improvement compared with those of the previous studies.

Longitudinal Deformation Profile in Tunnel using Measured Data (계측자료를 이용한 터널의 종단변형도)

  • Jang, Won-Yil;Yang, Hyung-Sik;Chung, So-Keul
    • Tunnel and Underground Space
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    • v.18 no.5
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    • pp.338-342
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    • 2008
  • Longitudinal deformation profile(LDP) has been obtained mostly by numerical analysis. In this study, LDP was plotted by measured data from horizontal inclinometer and crown settlement. Deformation of foe ahead was determined by comparing to the maximum deformation point and deformation of after excavation was determined by regression of the measured crown settlement data. The result shows that crown deformation began as f3r as 3D ahead of the face. Crown settlement at the face was 40% of ultimate deformation, which was 10% higher than numerical results, and the deformation converged after excavation of 4D.

Development of Elimination Method of Measurement noise to Improve accuracy for White Light Interferometry (백색광 간섭계의 정밀도 향상을 위한 노이즈 제거 방법)

  • Ko, Kuk-Won;Cho, Soo-Yong;Kim, Min-Young
    • Journal of Institute of Control, Robotics and Systems
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    • v.14 no.6
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    • pp.519-522
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    • 2008
  • As industry of a semiconductor and LCD industry have been rapidly growing, precision technologies of machining such as etching and 3D measurement are required. Stylus has been important measuring method in traditional manufacturing process. However, its disadvantages are low measuring speed and damage possibility at contacting point. To overcome mentioned disadvantage, non-contacting measurement method is needed such as PMP(Phase Measuring Profilometry), WSI(white scanning interferometer) and Confocal Profilometry. Among above 3 well-known methods, WSI started to be applied to FPD(flat panel display) manufacturing process. Even though it overcomes 21t ambiguity of PMP method and can measure objects which has specular surface, the measuring speed and vibration coming from manufacturing machine are one of main issue to apply full automatic total inspection. In this study, We develop high speed WSI system and algorithm to reduce unknown noise. The developing WSI and algorithm are implemented to measure 3D surface of wafer. Experimental results revealed that the proposed system and algorithm are able to measure 3D surface profile of wafer with a good precision and high speed.

Oxide Thickness Measurement of CMP Test Wafer by Dispersive White-light Interferometry (분산형 백색광 간섭계를 이용한 CMP 테스트 웨이퍼의 $SiO_2$ 두께 측정)

  • Park, Boum-Young;Kim, Young-Jin;Jeong, Hae-Do;Ghim, Young-Sik;You, Joon-Ho;Kim, Seung-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.86-87
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    • 2007
  • The dispersive method of white-light interferometry is proper for in-line 3-D inspection of dielectric thin-film thickness to be used in the semiconductor and flat-panel display industry. This research is the measurement application of CMP patterned wafer. The results describe 3-D and 2-D profile of the step height during polishing time.

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