• The monthly packaging world
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• s.262
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• pp.42-44
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• 2015

• The monthly packaging world
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• s.40
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• pp.104-107
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• 1996

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.103-107
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• 2003

• The monthly packaging world
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• s.101
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• pp.172-178
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• 2001

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.21-26
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• 2013

This study presents new analysis method to predict bending behavior of packaging substrate structure by comparing finite element method simulation and measured curvature using 3D scanner. Packaging substrate is easily bent and deflected while undergoing various processes such as curing of prepreg and copper pattern plating. We prepare specimens with various conditions and measure contours of each specimen and compute the residual stresses on deposited films using analytical solution to find the principle of bending. Core and prepreg in packaging substrate are made up of resin and bundles of fiber which exist orthogonally each other. Anisotropic material properties cause peculiar bending behavior of packaging substrate. We simulate the bending deflection with finite element method and verify the simulated deflection with measured data. The plating stress of electrodeposited copper is about 58 MPa. The curing stresses of solder resist and prepreg are about 13 MPa and 6.4 MPa respectively in room temperature.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.39-44
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• 2021

In this paper, two types of BPF(Band Pass Filter) which are hair-pin and interdigital have been designed for millimeter-wave application using two types of material which are LCP(Liquid Crystal Polymer) and PTFE(Polytetrafluoroethylene) and also, their performances such as bandwidth, insertion loss, and in-band flatness are compared. The proposed BPF are designed as third-order filters, and their pass band is from 26.5 GHz to 27.3 GHz. Interdigital BPF using PTFE substrate has most wide -3 dB S21 bandwidth of 7.8 GHz and hair-pin BPF using LCP substrate has most narrow -3 dB S21 bandwidth among the proposed four BPF. For in-band insertion loss, hair-pin BPF using PTFE substrate achieves low insertion loss better than -0.667 dB, and hair-pin BPF using LCP substrate exhibits relatively high insertion loss among the proposed four BPF better than -0.937 dB. However, the maximum difference in insertion loss performance among the proposed four BPF is 0.27 dB, which is too small to negligible. For in-band flatness, interdigital BPF using PTFE substrate shows greatest performance of 0.017 dB, and hair-pin BPF using LCP substrate exhibits the lowest performance of 0.07 dB. There are tiny difference in in-band flatness performance of 0.053 dB. As a results, it is considered that the BPF using LCP substrate can derive the performances similar to that of the BPF using PTFE substrate in Millimeter-wave band.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.6
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• pp.72-78
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• 1998

An optical modulator Ti:LiNbO$_3$optical waveguide and CPW electrode structure were fabricated. The optical modulator was packaged using components such as ferrules, dirmy LN block and glass, vibration and shock absorbption pad, and alumina feeder through processings of pigtailing. Au wire bonding, epoxing, SMA connecting, sealing. The electrical and optical characteristics were measured after packaging. The electrical properties of S$_{21}$ and S$_{11}$ were obtained as 9.8 GHz at -3 dB and -8.9dB at 14.4GHz, respectively. Optical waveguide prepared met requirements for a single mode at a 1550nm wavelength range. Insertion loss was 4.3dB at room temperature after packaging, and was varied 4.3~6.4dB at various temperatures, 5~45$^{\circ}C$. E-O bandwidth measurement showed 3dB optical response at 7.8GHz, which means that it is applicable for 10Gbps optical communicationon

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.147-164
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• 2001

1. "MLS", state of the art MCM-D wiring substrate. 2. High pin-count LSl assembly. 3. Higher speed needs higher packaging density. 4. Wiring substrate, the key of LSl packaging device. 5. "Inter-Layer Transferability", a new index for the performance of wiring substrates. 6. "MLTF package", a core-less flexible package for high pin-count LSl.

• Journal of Welding and Joining
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• v.27 no.3
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• pp.4-9
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• 2009

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.