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http://dx.doi.org/10.5781/KWJS.2009.27.3.004

TSV Core Technology for 3D IC Packaging  

Hyun, Seung-Min (한국기계연구원 나노융합기계연구본부)
Lee, Chang-Woo (한국기계연구원 지능형생산시스템연구본부)
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Journal of Welding and Joining / v.27, no.3, 2009 , pp. 4-9 More about this Journal
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  • Reference
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