1 |
K.N Chen et. al. Journal of electronic materials Vol. 35, (2006)
|
2 |
Paul Enquist and Chris Sanders, "3D IC Technology:Interconnect for the 21st centry" Advanced Packaging online article
|
3 |
Klumpp, A. Merkel, R., Ramm,P. Japanese Journal of Applied Physics, 43, (L829-L830)
DOI
ScienceOn
|
4 |
J. C. Eloy, et al., "Advanced Packaging", Yole Development, Lyon, France (2006)
|
5 |
K.N Chen et.al. Journal of ELECTRONIC MATERIALS, 34-12, 1464 (2005)
DOI
ScienceOn
|
6 |
F. Niklaus et. al. Journal of Applied Physics, 99, 031101 (2006)
|
7 |
Bio Kim. "3D integration with TSV technology" SEMI Technology Symposium (STS) (2009)
|
8 |
Wolf, M, Ramm P., Klumpp A., Fraundofer IZM, EMC 3D symposium)
|
9 |
C.V Thompson Materials Research Society (2007)
|
10 |
Y. Kwon et.al. MRS symp. Proc. Vol. 766 (2003)
|
11 |
C.S. TAN et. al, Journal of ELECTRONIC MATERIALS, 34-12, 1598, (2005)
DOI
ScienceOn
|
12 |
C.S Tan, et. al. Electrochemical and solid-state Letters, 8 G147-G149 (2005)
DOI
ScienceOn
|
13 |
Bio Kim et. al SEMI Technology Symposium (2008)
|